Patents by Inventor John Heck

John Heck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11143818
    Abstract: Embodiments include apparatuses, methods, and systems including a laser device having a 1×3 MMI coupler within a semiconductor layer. A front arm is coupled to the MMI coupler and terminated by a front reflector. In addition, a coarse tuning arm is coupled to the MMI coupler and terminated by a first back reflector for coarse wavelength tuning, a fine tuning arm is coupled to the MMI coupler and terminated by a second back reflector for fine wavelength tuning, and a SMSR and power tuning arm is coupled to the MMI coupler and terminated by a third back reflector. A gain region is above the front arm and above the semiconductor layer. Other embodiments may also be described and claimed.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: October 12, 2021
    Assignees: INTEL CORPORATION, REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Meer Nazmus Sakib, Guan-Lin Su, John Heck, Haisheng Rong, Ming C. Wu
  • Patent number: 10996408
    Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler including an optical waveguide to guide light to an optical fiber. In embodiments, the optical waveguide includes a tapered segment to propagate the received light to the optical fiber. In embodiments, the tapered segment is buried below a surface of a semiconductor substrate to transition the received light within the semiconductor substrate from a first optical mode to a second optical mode to reduce a loss of light during propagation of the received light from the optical waveguide to the optical fiber. In embodiments, the surface of the semiconductor substrate comprises a bottom planar surface of a silicon photonic chip that includes at least one or more of passive or active photonic components. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: May 4, 2021
    Assignee: Intel Corporation
    Inventors: John Heck, Harel Frish, Reece DeFrees, George A. Ghiurcan, Hari Mahalingam, Pegah Seddighian
  • Publication number: 20210119710
    Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to coherent optical receivers, including coherent receivers with integrated all-silicon waveguide photodetectors and tunable local oscillators implemented within CMOS technology. Embodiments are also directed to tunable silicon hybrid lasers with integrated temperature sensors to control wavelength. Embodiments are also directed to post-process phase correction of optical hybrid and nested I/Q modulators. Embodiments are also directed to demultiplexing photodetectors based on multiple microrings. In embodiments, all components may be implements on a silicon substrate. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: December 23, 2020
    Publication date: April 22, 2021
    Inventors: Meer Nazmus Sakib, Peicheng Liao, Ranjeet Kumar, Duanni Huang, Haisheng Rong, Harel Frish, John Heck, Chaoxuan Ma, Hao Li, Ganesh Balamurugan
  • Publication number: 20210074866
    Abstract: Embodiments disclosed herein include optoelectronic systems and methods of forming such systems. In an embodiment the optoelectronic system comprises a board, and a carrier attached to the board. In an embodiment, a first die is on the carrier. In an embodiment, the first die is a photonics die, and a surface of the first die is covered by an optically transparent layer.
    Type: Application
    Filed: September 6, 2019
    Publication date: March 11, 2021
    Inventors: Priyanka DOBRIYAL, Ankur AGRAWAL, Susheel JADHAV, Quan TRAN, Raghuram NARAYAN, Raiyomand ASPANDIAR, Kenneth BROWN, John HECK
  • Patent number: 10914874
    Abstract: Disclosed herein are display and photonic devices utilizing metasurfaces. An optical device comprising an optical component and an optical transmission medium is disclosed. A waveguide couples the optical component and the optical transmission medium. A metasurface is disposed on an end of the waveguide and arranged to increase an optical coupling between the waveguide and the optical transmission medium. Additionally, a display comprising a number of light emitting elements and a metasurface for each of the light emitting elements. The metasurface arranged to eliminate screen door effect in virtual reality display systems.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: February 9, 2021
    Assignee: Intel Corporation
    Inventors: Khaled Ahmed, John Heck, Ramon Cancel Olmo, Richmond Hicks, Olga Gorbounova
  • Patent number: 10877352
    Abstract: Embodiments include apparatuses, methods, and systems including a semiconductor photonic device having a substrate, a waveguide disposed above the substrate, a phase change layer disposed above the waveguide, and a heater disposed above the phase change layer. The waveguide has a modifiable refractive index based at least in part on a state of a phase change material included in the phase change layer. The phase change material of the phase change layer is in a first state of a set of states, and the waveguide has a first refractive index determined based on the first state of the phase change material. The heater is to generate heat to transform the phase change material to a second state of the set of states, and the waveguide has a second refractive index determined based on the second state of the phase change material. Other embodiments may also be described and claimed.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: December 29, 2020
    Assignee: Intel Corporation
    Inventors: John Heck, Harel Frish, Derchang Kau, Charles Dennison, Haisheng Rong, Jeffrey Driscoll, Jonathan K. Doylend, George A. Ghiurcan, Michael E. Favaro
  • Publication number: 20200393619
    Abstract: Embodiments of the present disclosure are directed to low numerical aperture (NA) optical couplers, or spot size converters, that include a lateral taper section and/or a vertical adiabatic taper section. In embodiments, the optical couplers may be positioned on a silicon substrate proximate to V-grooves within the substrate to contain optical fibers to self-align and to couple with the optical couplers. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: August 27, 2020
    Publication date: December 17, 2020
    Inventors: Hari Mahalingam, Harel Frish, Sean McCargar, Joshua Keener, Shane Yerkes, John Heck, Ling Liao
  • Patent number: 10816737
    Abstract: In various embodiments, optical fibers may be placed into V-shaped grooves in a substrate. A lid may then be placed on top of the optical fibers to hold them accurately in place, and the lid may be attached to the substrate using a reflow solder technique. Epoxy may then be applied as a strain relief. Because the V-shaped grooves and optical waveguides are manufactured with precision on the same substrate, precise alignment between these two may be achieved. Because the epoxy is applied after reflow, the epoxy may not be exposed to reflow temperatures, which might otherwise cause the epoxy to distort during the cure process.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: October 27, 2020
    Assignee: Intel Corporation
    Inventors: John Heck, Hari Mahalingam, Paul Yu, Kumar Satya Harinadh Potluri
  • Publication number: 20200200951
    Abstract: Disclosed herein are display and photonic devices utilizing metasurfaces. An optical device comprising an optical component and an optical transmission medium is disclosed. A waveguide couples the optical component and the optical transmission medium. A metasurface is disposed on an end of the waveguide and arranged to increase an optical coupling between the waveguide and the optical transmission medium. Additionally, a display comprising a number of light emitting elements and a metasurface for each of the light emitting elements. The metasurface arranged to eliminate screen door effect in virtual reality display systems.
    Type: Application
    Filed: February 18, 2020
    Publication date: June 25, 2020
    Applicant: Intel Corporation
    Inventors: Khaled Ahmed, John Heck, Ramon Cancel Olmo, Richmond Hicks, Olga Gorbounova
  • Publication number: 20200192026
    Abstract: Embodiments may relate to a wavelength-division multiplexing (WDM) transceiver that has a silicon waveguide layer coupled with a silicon nitride waveguide layer. In some embodiments, the silicon waveguide layer may include a tapered portion that is coupled with the silicon nitride waveguide layer. In some embodiments, the silicon waveguide layer may be coupled with a first oxide layer with a first z-height, and the silicon nitride waveguide layer may be coupled with a second oxide layer with a second z-height that is greater than the first z-height. Other embodiments may be described or claimed.
    Type: Application
    Filed: February 21, 2020
    Publication date: June 18, 2020
    Applicant: Intel Corporation
    Inventors: John Heck, Lina He, Sungbong Park, Olufemi Isiade Dosunmu, Harel Frish, Kelly Christopher Magruder, Seth M. Slavin, Wei Qian, Ansheng Liu, Nutan Gautam, Mark Isenberger
  • Publication number: 20200150344
    Abstract: Embodiments include apparatuses, methods, and systems including a semiconductor photonic device having a waveguide disposed above a substrate. The waveguide has a first section including amorphous silicon with a first refractive index, and a second section including crystalline silicon with a second refractive index different from the first refractive index. The semiconductor photonic device further includes a heat element at a vicinity of the first section of the waveguide. The heat element is arranged to generate heat to transform the amorphous silicon of the first section of the waveguide to partially or completely crystallized crystalline silicon with a third refractive index. The amorphous silicon in the first section may be formed with silicon lattice defects caused by an element implanted into the first section. Other embodiments may also be described and claimed.
    Type: Application
    Filed: January 2, 2020
    Publication date: May 14, 2020
    Inventors: Hasitha Jayatilleka, Harel Frish, Ranjeet Kumar, Haisheng Rong, John Heck
  • Patent number: 10564330
    Abstract: Disclosed herein are display and photonic devices utilizing metasurfaces. An optical device comprising an optical component and an optical transmission medium is disclosed. A waveguide couples the optical component and the optical transmission medium. A metasurface is disposed on an end of the waveguide and arranged to increase an optical coupling between the waveguide and the optical transmission medium. Additionally, a display comprising a number of light emitting elements and a metasurface for each of the light emitting elements. The metasurface arranged to eliminate screen door effect in virtual reality display systems.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: February 18, 2020
    Assignee: INTEL CORPORATION
    Inventors: Khaled Ahmed, John Heck, Ramon Cancel Olmo, Richmond Hicks, Olga Gorbounova
  • Publication number: 20190339585
    Abstract: Embodiments include apparatuses, methods, and systems including a semiconductor photonic device having a substrate, a waveguide disposed above the substrate, a phase change layer disposed above the waveguide, and a heater disposed above the phase change layer. The waveguide has a modifiable refractive index based at least in part on a state of a phase change material included in the phase change layer. The phase change material of the phase change layer is in a first state of a set of states, and the waveguide has a first refractive index determined based on the first state of the phase change material. The heater is to generate heat to transform the phase change material to a second state of the set of states, and the waveguide has a second refractive index determined based on the second state of the phase change material. Other embodiments may also be described and claimed.
    Type: Application
    Filed: July 19, 2019
    Publication date: November 7, 2019
    Inventors: John Heck, Harel Frish, Derchang Kau, Charles Dennison, Haisheng Rong, Jeffrey Driscoll, Jonathan K. Doylend, George A. Ghiurcan, Michael E. Favaro
  • Publication number: 20190339466
    Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler including an optical waveguide to guide light to an optical fiber. In embodiments, the optical waveguide includes a tapered segment to propagate the received light to the optical fiber. In embodiments, the tapered segment is buried below a surface of a semiconductor substrate to transition the received light within the semiconductor substrate from a first optical mode to a second optical mode to reduce a loss of light during propagation of the received light from the optical waveguide to the optical fiber. In embodiments, the surface of the semiconductor substrate comprises a bottom planar surface of a silicon photonic chip that includes at least one or more of passive or active photonic components. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: July 19, 2019
    Publication date: November 7, 2019
    Inventors: John Heck, Harel Frish, Reece DeFrees, George A. Ghiurcan, Hari Mahalingam, Pegah Seddighian
  • Patent number: 10466515
    Abstract: Embodiments herein relate to photonic integrated circuits with an on-chip optical isolator. A photonic transmitter chip may include a laser and an on-chip isolator optically coupled with the laser that includes an optical waveguide having a section coupled with a magneto-optic liquid phase epitaxy grown garnet film. In some embodiments, a cladding may be coupled with the garnet film, the on-chip isolator may be arranged in a Mach-Zehnder interferometer configuration, the waveguide may include one or more polarization rotators, and/or the garnet film may be formed of a material from a rare-earth garnet family. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: November 5, 2019
    Assignee: Intel Corporation
    Inventors: John Heck, David N. Hutchison, Jie Sun, Haisheng Rong, Woosung Kim
  • Publication number: 20190324210
    Abstract: Embodiments include apparatuses, methods, and systems including a laser device having a 1×3 MMI coupler within a semiconductor layer. A front arm is coupled to the MMI coupler and terminated by a front reflector. In addition, a coarse tuning arm is coupled to the MMI coupler and terminated by a first back reflector for coarse wavelength tuning, a fine tuning arm is coupled to the MMI coupler and terminated by a second back reflector for fine wavelength tuning, and a SMSR and power tuning arm is coupled to the MMI coupler and terminated by a third back reflector. A gain region is above the front arm and above the semiconductor layer. Other embodiments may also be described and claimed.
    Type: Application
    Filed: June 28, 2019
    Publication date: October 24, 2019
    Inventors: Meer Nazmus Sakib, Guan-Lin Su, John Heck, Haisheng Rong, Ming C. Wu
  • Patent number: 10310196
    Abstract: A portion of an optical waveguide extending laterally within a photonic integrated circuit (PIC) chip is at least partially freed from the substrate to allow physical displacement of a released waveguide end relative to the substrate and relative to an adjacent photonic device also fabricated in the substrate. The released waveguide end may be displaced to modulate interaction between the photonic device and an optical mode propagated by the waveguide. In embodiments where the photonic device is an optical coupler, employing for example an Echelle grating or arrayed waveguide grating (AWG), mode propagation through the coupler may be modulated via physical displacement of the released waveguide end. In one such embodiment, thermal sensitivity of an integrated optical wavelength division multiplexer (WDM) is reduced by displacing the released waveguide end relative to the coupler in a manner that counters a temperature dependence of the optical coupler.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: June 4, 2019
    Assignee: Intel Corporation
    Inventors: David N. Hutchison, Haisheng Rong, John Heck
  • Patent number: 10281322
    Abstract: An optical circuit includes solid state photonics. The optical circuit includes a phased array of solid state waveguides that perform beamsteering on an optical signal. The optical circuit includes a modulator to modulate a bit sequence onto the carrier frequency of the optical signal, and the beamsteered signal includes the modulated bit sequence. The optical circuit includes a photodetector to detect a reflection of the beamsteered optical signal. The optical circuit autocorrelates the reflection signal with the bit sequence to generate a processed signal.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: May 7, 2019
    Assignee: Intel Corporation
    Inventors: Jonathan K. Doylend, David N. Hutchison, John Heck, Haisheng Rong, Daniel Grodensky, David Arbel, Israel Petronius
  • Publication number: 20190121004
    Abstract: Disclosed herein are display and photonic devices utilizing metasurfaces. An optical device comprising an optical component and an optical transmission medium is disclosed. A waveguide couples the optical component and the optical transmission medium. A metasurface is disposed on an end of the waveguide and arranged to increase an optical coupling between the waveguide and the optical transmission medium. Additionally, a display comprising a number of light emitting elements and a metasurface for each of the light emitting elements. The metasurface arranged to eliminate screen door effect in virtual reality display systems.
    Type: Application
    Filed: December 21, 2018
    Publication date: April 25, 2019
    Inventors: Khaled Ahmed, John Heck, Ramon Cancel Olmo, Richmond Hicks, Olga Gorbounova
  • Publication number: 20190121036
    Abstract: In various embodiments, optical fibers may be placed into V-shaped grooves in a substrate. A lid may then be placed on top of the optical fibers to hold them accurately in place, and the lid may be attached to the substrate using a reflow solder technique. Epoxy may then be applied as a strain relief. Because the V-shaped grooves and optical waveguides are manufactured with precision on the same substrate, precise alignment between these two may be achieved. Because the epoxy is applied after reflow, the epoxy may not be exposed to reflow temperatures, which might otherwise cause the epoxy to distort during the cure process.
    Type: Application
    Filed: December 19, 2018
    Publication date: April 25, 2019
    Applicant: Intel Corporation
    Inventors: John Heck, Hari Mahalingam, Paul Yu, Kumar Satya Harinadh Potluri