Abstract: A semiconductor memory apparatus includes: a memory cell array including a plurality of memory cells; a bit line sense amplifier (BLSA) coupled to the memory cells in the memory cell array through a bit line; a plurality of local input/output lines coupled to the BLSA; and a switching unit coupled to the local input/output lines and configured to select a part of the local input/output lines.

Abstract: A semiconductor wafer includes at least one chip formed on a substrate, and a scribe line region surrounding the chip. The chip includes a device formation region, and a chip boundary region surrounding the device formation region and formed between the device formation region and the scribe line region. The chip boundary region includes a guard ring structure which physically separates the device formation region from the scribe line region. The guard ring structure includes a signal transfer element which transfers an electric signal between the device formation region and the scribe line region.

Abstract: A delay circuit includes: a delay unit configured to receive a clock signal, delay an input signal sequentially by a predetermined time interval, and output a plurality of first delayed signals; and an option unit configured to select one of the plurality of first delayed signals based on one or more select signals, and output a second delayed signal.

Abstract: An address delay circuit of a semiconductor memory apparatus includes a control pulse generation unit configured to generate a control pulse following a time corresponding to a predetermined multiple of cycles of a clock after a read write pulse is inputted; and a delay unit configured to output internal addresses when the control pulse is inputted, wherein the internal addresses are input as external addresses.

Abstract: A semiconductor memory apparatus includes a first data input/output line configured to transmit data from a first memory bank; a second data input/output line configured to transmit the data from the first memory bank; a first data output section configured to align and output data transmitted through the first data input/output line based on an input/output mode; and a second data output section configured to align and output either data transmitted through the first input/output line or the second data input/output line based on the input/output mode and an address signal.

Abstract: A semiconductor wafer includes at least one chip formed on a substrate, and a scribe line region surrounding the chip. The chip includes a device formation region, and a chip boundary region surrounding the device formation region and formed between the device formation region and the scribe line region. The chip boundary region includes a guard ring structure which physically separates the device formation region from the scribe line region. The guard ring structure includes a signal transfer element which transfers an electric signal between the device formation region and the scribe line region.

Abstract: A temperature detection circuit of a semiconductor memory apparatus includes a fixed period oscillator, a temperature variable signal generating unit and a counting unit. The oscillator is configured to generate a fixed period oscillator signal when an enable signal is enabled. The temperature variable signal generating unit is configured to generate a temperature variable signal whose enable interval varies based on temperature variations, when the enable signal is enabled. The counting unit is configured to count the oscillator signal during the enable interval of the temperature variable signal to generate a temperature information signal.

Abstract: A semiconductor integrated circuit includes a plurality of semiconductor chips respectively selected in response to a plurality of chip selection signals, and a chip selection signal generator configured to generate the chip selection signals in response to one first control signal for deciding whether to drive the semiconductor chips and at least one second control signal for selecting at least one semiconductor chip from among the semiconductor chips.

Abstract: A circuit for shifting an address includes a shift cell block configured to sequentially shift address signals in response to shift control signals and a control cell block configured to generate the shift control signals for activating the shift cell block in a column unit using sequentially shifted read commands or write commands.

Abstract: A semiconductor apparatus having a plurality of stacked chips includes: a plurality of latch units, each of which is disposed in a corresponding one of the plurality of chips and is configured to latch a clock signal and a frequency-divided signal at mutually different points of time to generate an chip identification signal of the corresponding one of the plurality of chips; and a plurality of chip selection signal generating units, each of which is disposed in the corresponding one of the plurality of chips and is configured to compare the chip identification signal of the corresponding one of the plurality of chips with a chip selection identification signal to generate a chip selection signal of the corresponding one of the plurality of chips, wherein the chip selection signal is configured to enable the corresponding one of the plurality of chips when the chip identification signal matches the chip selection identification signal.

Abstract: A delay locked loop includes a replica delay oscillator unit, a division unit, a pulse generation unit, a code value output unit, and a delay line. The replica delay oscillator unit generates a replica oscillation signal having a period corresponding to a replica delay. The division unit receives the replica oscillation signal and a clock signal and divides the replica oscillation signal and the clock signal at a first or second ratio in response to a delay locking detection signal. The pulse generation unit generates a delay pulse having a pulse width corresponding to a delay amount for causing a delay locking. The code value output unit adjusts a code value corresponding to the pulse width of the delay pulse in response to the delay locking detection signal. The delay line delays the clock signal in response to the code value.

Abstract: A semiconductor apparatus includes a signal transmission block and signal reception blocks. The signal transmission block is disposed in a first chip and configured to transmit fuse information in synchronization with transmission control signals. The signal reception blocks are respectively disposed in the first chip and a second chip and configured to receive the fuse information in synchronization with reception control signals.

Abstract: A semiconductor memory device includes an open-loop-type delay locked loop (DLL) configured to generate a clock signal locked by reflecting a first delay amount which actually occurs in a data path and a second delay amount which is required for locking the clock signal, a latency control unit configured to shift an inputted command according to a latency code value corresponding to the first delay amount and latency information, and output the shifted command, and an additional delay line configured to delay the shifted command according to a delay code value corresponding to the second delay amount, and output the command of which operation timing is controlled.

Abstract: A semiconductor apparatus having a plurality of stacked chips includes: a through silicon via (TSV) configured to couple the plurality of chips together and configured to be coupled in series to a plurality of voltage drop units; a plurality of signal conversion units, each of which is configured to convert a voltage outputted from the voltage drop unit of the corresponding one of the plurality of chips to a digital code signal and provide the digital code signal as chip identification signal of the corresponding one of the plurality of chips; and a plurality of chip selection signal generating units, each of which is configured to compare the chip identification signal with a chip selection identification signal to generate a chip selection signal of the corresponding one of the plurality of chips.

Abstract: A semiconductor memory apparatus includes one or more semiconductor chips configured to have predetermined capacity and structure; and a signal level control unit configured to control levels of external signals, which are input to the one or more semiconductor chips, in order to realize various capacities and structures using the one or more semiconductor chips.

Abstract: An integrated circuit that detects whether a through silicon via has defects or not, at a wafer level. The integrated circuit includes a semiconductor substrate, a through silicon via configured to be formed in the semiconductor substrate to extend to a certain depth from the surface of the semiconductor substrate, an output pad, and a current path providing unit configured to provide a current, flowing between the semiconductor substrate and the through silicon via, to the output pad during a test mode.

Abstract: A duty cycle correction circuit includes a duty cycle control unit configured to generate a corrected clock signal by correcting a duty cycle of an input clock signal in response to a control signal, a duty cycle detection unit configured to detect a duty cycle of the corrected clock signal and output a detection signal, and a control signal generation unit configured to generate the control signal in response to the detection signal.

Abstract: A delay locked loop includes a replica delay oscillator unit, a division unit, a pulse generation unit, a code value output unit, and a delay line. The replica delay oscillator unit generates a replica oscillation signal having a period corresponding to a replica delay. The division unit receives the replica oscillation signal and a clock signal and divides the replica oscillation signal and the clock signal at a first or second ratio in response to a delay locking detection signal. The pulse generation unit generates a delay pulse having a pulse width corresponding to a delay amount for causing a delay locking. The code value output unit adjusts a code value corresponding to the pulse width of the delay pulse in response to the delay locking detection signal. The delay line delays the clock signal in response to the code value.

Abstract: A semiconductor apparatus may include a master chip, first to nth slave chips, first to nth slave chip ID generating units, and a master chip ID generating unit. The first to nth slave chip ID generating units are disposed respectively in the first to nth slave chips and connected in series to each other. Each of the first to nth slave chip ID generating units is configured to add a predetermined code value to an mth operation code to generate an (m+1)th operation code. The master chip ID generating unit is disposed in the master chip to generate a variable first operation code in response to a select signal. Here, ‘n’ is an integer that is equal to or greater than 2, and ‘m’ is an integer that is equal to or greater than 1 and equal to or smaller than ‘n’.

Abstract: Various embodiments of a test mode control circuit of a semiconductor apparatus and related methods are disclosed. In one exemplary embodiment, the test mode control circuit may include: a test mode control block configured to generate a plurality of control signal sets in response to a first address signal set and a second address signal set which are sequentially inputted; a test mode transfer block configured to transfer a plurality of test mode signals, which are generated according to a combination of the plurality of control signal sets, to a plurality of circuit blocks of the semiconductor apparatus; and a plurality of global lines configured to transmit the plurality of control signal sets to the test mode transfer block.