Abstract: A delay locked loop includes a replica delay oscillator unit, a division unit, a pulse generation unit, a code value output unit, and a delay line. The replica delay oscillator unit generates a replica oscillation signal having a period corresponding to a replica delay. The division unit receives the replica oscillation signal and a clock signal and divides the replica oscillation signal and the clock signal at a first or second ratio in response to a delay locking detection signal. The pulse generation unit generates a delay pulse having a pulse width corresponding to a delay amount for causing a delay locking. The code value output unit adjusts a code value corresponding to the pulse width of the delay pulse in response to the delay locking detection signal. The delay line delays the clock signal in response to the code value.

Abstract: Various embodiments of a semiconductor apparatus and related methods are disclosed. In one exemplary embodiment, a semiconductor apparatus may include a chip, scribe lanes disposed around the chip, and a probe test logic circuit for conducting a probe test on the chip. The probe test logic circuit is disposed on a portion of the scribe lanes.

Abstract: A semiconductor memory device includes a bank having a plurality of mats, an address counting unit configured to receive an auto-refresh command consecutively applied at predetermined intervals corresponding to a number of the mats, and sequentially count an internal address in response to the auto-refresh command, and an address transferring unit configured to enable the plurality of mats in response to the auto-refresh command, and transfer the internal address to the plurality of mats at predetermined time intervals.

Abstract: A delay locked loop includes a delay pulse generation unit, a coding unit, and a delay line. The delay pulse generation unit is configured to generate a delay pulse having a certain width. The coding unit is configured to code the delay pulse and output a code value. The delay line is configured to delay an input clock by the code value, and generate a delayed locked clock. The delay pulse has a logic high level state during a third period equivalent to a difference between a first period, which corresponds to an integer multiple of the input clock, and a second period, which is a certain replica delay period.

Abstract: A delay circuit includes first and second selective delay stages each including a number of unit delay cells to delay signals applied thereto; and a delay control unit configured to control selectively applying an input signal to the first selective delay stage or the second selective delay stage in response to a code combination of first and second selection signals and produce an output signal.

Abstract: An apparatus for controlling an operation timing in a semiconductor memory device, comprising: a shift information generator configured to generate shift information based on data path delay information and latency information; and a shift register configured to shift a command based on the shift information and produce a shifted command to control an operation timing.

Abstract: A semiconductor circuit includes a pad, a pad driver connected to the pad at an output terminal thereof and configured to calibrate a voltage of the pad in response to code signals, a comparison section configured to compare a reference voltage and the voltage of the pad and generate a comparison signal, and a code generation section configured to calibrate code values of the code signals in response to the comparison signal.

Abstract: A semiconductor apparatus having a plurality of stacked chips includes: a plurality of latch units, each of which is disposed in a corresponding one of the plurality of chips and is configured to latch a clock signal and a frequency-divided signal at mutually different points of time to generate an chip identification signal of the corresponding one of the plurality of chips; and a plurality of chip selection signal generating units, each of which is disposed in the corresponding one of the plurality of chips and is configured to compare the chip identification signal of the corresponding one of the plurality of chips with a chip selection identification signal to generate a chip selection signal of the corresponding one of the plurality of chips, wherein the chip selection signal is configured to enable the corresponding one of the plurality of chips when the chip identification signal matches the chip selection identification signal.

Abstract: A data input/output circuit includes a rank selecting section and a data input/output section. The rank selecting section is selectively connected to one of the first and second ranks in response to a chip selection signal, and outputs data to a connected rank or receives data from the connected rank. The data input/output section outputs the data transmitted from the rank selecting section through a data pad to an external device during a read operation, and outputs the data inputted to the data pad to the rank selecting section during a write operation.

Abstract: A semiconductor apparatus having a plurality of stacked chips includes: a through silicon via (TSV) configured to couple the plurality of chips together and configured to be coupled in series to a plurality of voltage drop units; a plurality of signal conversion units, each of which is configured to convert a voltage outputted from the voltage drop unit of the corresponding one of the plurality of chips to a digital code signal and provide the digital code signal as chip identification signal of the corresponding one of the plurality of chips; and a plurality of chip selection signal generating units, each of which is configured to compare the chip identification signal with a chip selection identification signal to generate a chip selection signal of the corresponding one of the plurality of chips.

Abstract: A circuit for testing a semiconductor apparatus includes a test voltage applying unit configured to apply a test voltage to a first end of a through-silicon via (TSV) in response to a test mode signal and a detecting unit configured to be connected to a second end of the TSV and detect a current outputted from the second end of the TSV.

Abstract: A semiconductor memory device includes a plurality of data transmission lines, a plurality of parallel-to-serial conversion sections configured to receive, serially align, and output data from at least two of the plurality of data transmission lines, a plurality of data compression circuits configured to receive, compress, and output outputs of at least two of the plurality of parallel-to-serial conversion sections, and a plurality of data output circuits configured to output respective compression results of the plurality of data compression circuits to an outside of a chip.

Abstract: A local sense amplifier of a semiconductor memory apparatus includes a read amplification unit configured to amplify data of first data lines and transfer the amplified data to second data lines during a read operation; and a write amplification unit configured to amplify data of the second data lines and transfer the amplified data to the first data lines during a write operation.

Abstract: A command control circuit of a semiconductor integrated device includes a plurality of latches sequentially connected and receiving a command signal, and a plurality of selection switches configured to pass or to interrupt the command signal inputted to each one of the plurality of latches.

Abstract: A temperature detection circuit of a semiconductor memory apparatus includes a fixed period oscillator, a temperature variable signal generating unit and a counting unit. The oscillator is configured to generate a fixed period oscillator signal when an enable signal is enabled. The temperature variable signal generating unit is configured to generate a temperature variable signal whose enable interval varies based on temperature variations, when the enable signal is enabled. The counting unit is configured to count the oscillator signal during the enable interval of the temperature variable signal to generate a temperature information signal.

Abstract: A charge pumping circuit consumes less current by reducing the number of charge pumps operating simultaneously. The charge pumping circuit includes a voltage sensor that detects a level of a high voltage and outputs a control signal based on the detection result. An oscillator provides an oscillating clock signal in response to the control signal of the voltage sensor, and the oscillator sequentially outputs the clock signal as a plurality of clock signals having shifted phases A plurality of high-voltage pumps are disposed in a plurality of regions to pump the high voltage in response to the clock signals and a different phase is designated for each region.

Abstract: A circuit for controlling the read cycle includes plurality of shift stages configured to sequentially shift read signals; and an activating unit configured to activate a read cycle signal which represents a read cycle, by performing logical operation for output signals of the plurality of the shift stages, wherein the plurality of the shift stages are configured to sequentially shift the read signals for a period corresponding to burst setting information.

Abstract: A circuit for shifting an address includes a shift cell block configured to sequentially shift address signals in response to shift control signals and a control cell block configured to generate the shift control signals for activating the shift cell block in a column unit using sequentially shifted read commands or write commands.

Abstract: A delay apparatus of a semiconductor integrated circuit includes a control signal generating unit configured to generate a block control signal and a unit control signal in response to a delay control signal; a plurality of delay blocks, connected in series to each other, and configured to generate a delay clock signal by delaying an input clock signal, wherein each of the delay blocks includes a predetermined number of unit delayers, and the plurality of the delay blocks are configured to be selectively activated in response to the block control signal; and a minute delay unit including a predetermined number of unit delayers and configured to generate an output clock signal by delaying the delay clock signal by adjusting an activation number of the provided unit delayers in response to the unit control signal.

Abstract: A delay circuit includes first and second selective delay stages each including a number of unit delay cells to delay signals applied thereto; and a delay control unit configured to control selectively applying an input signal to the first selective delay stage or the second selective delay stage in response to a code combination of first and second selection signals and produce an output signal.