Abstract: A semiconductor circuit includes a pad, a pad driver connected to the pad at an output terminal thereof and configured to calibrate a voltage of the pad in response to code signals, a comparison section configured to compare a reference voltage and the voltage of the pad and generate a comparison signal, and a code generation section configured to calibrate code values of the code signals in response to the comparison signal.

Abstract: A delay locked loop includes a replica delay oscillator unit, a division unit, a pulse generation unit, a code value output unit, and a delay line. The replica delay oscillator unit generates a replica oscillation signal having a period corresponding to a replica delay. The division unit receives the replica oscillation signal and a clock signal and divides the replica oscillation signal and the clock signal at a first or second ratio in response to a delay locking detection signal. The pulse generation unit generates a delay pulse having a pulse width corresponding to a delay amount for causing a delay locking. The code value output unit adjusts a code value corresponding to the pulse width of the delay pulse in response to the delay locking detection signal. The delay line delays the clock signal in response to the code value.

Abstract: A semiconductor integrated circuit includes a semiconductor chip including a memory cell array, a plurality of first through-chip vias configured to vertically penetrate through the semiconductor chip and operate as an interface for a signal and a supply voltage, and a semiconductor substrate. The semiconductor substrate includes a peripheral circuit region coupled to the plurality of first through-chip vias and configured to control the semiconductor chip and a conductivity pattern region configured to operate as an interface for the signal and the supply voltage between the peripheral circuit region and an external controller.

Abstract: A semiconductor integrated circuit includes a plurality of slave chips each including a core area including a memory cell array, a global data line configured to transfer input/output data of the corresponding core area, and a first peripheral circuit area configured to interface the corresponding core area and the corresponding global data line, a plurality of data transfer through-chip vias vertically formed through the plurality of slave chips, respectively, and coupled to the respective global data lines of the slave chips, and a master chip including a second peripheral circuit area configured to provide an input/output interface between the data transfer through-chip vias and an external controller.

Abstract: A semiconductor memory device includes a bank having a plurality of mats, an address counting unit configured to receive an auto-refresh command consecutively applied at predetermined intervals corresponding to a number of the mats, and sequentially count an internal address in response to the auto-refresh command, and an address transferring unit configured to enable the plurality of mats in response to the auto-refresh command, and transfer the internal address to the plurality of mats at predetermined time intervals.

Abstract: A semiconductor system for identifying stacked chips includes a first semiconductor chip and a plurality of second semiconductor chips. The first semiconductor chip generates a plurality of counter codes by using an internal clock or an external input clock and transmits slave address signals and the counter codes through a through-chip via. The second semiconductor chips are given corresponding identifications (IDs) by latching the counter codes for a predetermined delay time, compare the latched counter codes with the slave address signals, and communicate data with the first semiconductor chip through the through-chip via according to the comparison result.

Abstract: A semiconductor memory device includes an open-loop-type delay locked loop (DLL) configured to generate a clock signal locked by reflecting a first delay amount which actually occurs in a data path and a second delay amount which is required for locking the clock signal, a latency control unit configured to shift an inputted command according to a latency code value corresponding to the first delay amount and latency information, and output the shifted command, and an additional delay line configured to delay the shifted command according to a delay code value corresponding to the second delay amount, and output the command of which operation timing is controlled.

Abstract: A semiconductor memory apparatus includes: a memory cell array including a plurality of memory cells; a bit line sense amplifier (BLSA) coupled to the memory cells in the memory cell array through a bit line; a plurality of local input/output lines coupled to the BLSA; and a switching unit coupled to the local input/output lines and configured to select a part of the local input/output lines.

Abstract: An open loop type delay locked loop includes a delay amount pulse generation unit configured to generate a delay amount pulse having a pulse width corresponding to a delay amount for delay locking a clock signal, a delay amount coding unit configured to output a code value by coding the delay amount in response to the delay amount pulse, a clock control unit configured to adjust a toggling period of the clock signal in response to a control signal, and a delay line configured to delay an adjusted clock signal outputted from the clock control unit in response to the code value.

Abstract: A semiconductor device includes a data alignment unit configured to align serial input data in response to a data strobe signal, a data latching unit configured to latch an output signal of the data alignment unit in response to first and second synchronization pulse signals which are activated according to BL information during a write operation, and a data output unit configured to output an output signal of the data latching unit to a plurality of global data lines in response to a data input strobe signal corresponding to the BL information.

Abstract: A semiconductor integrated circuit having a multi-chip structure includes a plurality of stacked semiconductor chips. At least one of the semiconductor chips includes first and second metal layers separately formed inside the semiconductor chip, a first internal circuit coupled in series between the first and second metal layers inside the semiconductor chip, a first metal path vertically formed over the second metal layer to a first side of the semiconductor chip, and a first through silicon via formed through the semiconductor chip from a second side of the semiconductor chip to the first metal layer.

Abstract: A semiconductor wafer includes at least one chip formed on a substrate, and a scribe line region surrounding the chip. The chip includes a device formation region, and a chip boundary region surrounding the device formation region and formed between the device formation region and the scribe line region. The chip boundary region includes a guard ring structure which physically separates the device formation region from the scribe line region. The guard ring structure includes a signal transfer element which transfers an electric signal between the device formation region and the scribe line region.

Abstract: A circuit for controlling the read cycle includes plurality of shift stages configured to sequentially shift read signals; and an activating unit configured to activate a read cycle signal which represents a read cycle, by performing logical operation for output signals of the plurality of the shift stages, wherein the plurality of the shift stages are configured to sequentially shift the read signals for a period corresponding to burst setting information.

Abstract: An address delay circuit of a semiconductor memory apparatus includes a control pulse generation unit configured to generate a control pulse following a time corresponding to a predetermined multiple of cycles of a clock after a read write pulse is inputted; and a delay unit configured to output internal addresses when the control pulse is inputted, wherein the internal addresses are input as external addresses.

Abstract: An address delay circuit of a semiconductor memory apparatus includes a control clock delay block configured to receive a clock as a first control clock in response to a first input control signal, and output external address as the first delayed address; a control clock input selecting delay block configured to receive the clock as a second control clock in response to a second input control signal, select whether to receive the external address or the first delayed address in response to the first input control signal, and output the selected address as the second delayed address; and a control clock input/output selecting delay block configured to receive the clock, select whether to receive the external address or the second delayed address in response to the second input control signal, and output the selected address as an internal address.

Abstract: A delay circuit includes: a delay unit configured to receive a clock signal, delay an input signal sequentially by a predetermined time interval, and output a plurality of first delayed signals; and an option unit configured to select one of the plurality of first delayed signals based on one or more select signals, and output a second delayed signal.

Abstract: A semiconductor memory apparatus includes a first data input/output line configured to transmit data from a first memory bank; a second data input/output line configured to transmit the data from the first memory bank; a first data output section configured to align and output data transmitted through the first data input/output line based on an input/output mode; and a second data output section configured to align and output either data transmitted through the first input/output line or the second data input/output line based on the input/output mode and an address signal.

Abstract: A semiconductor apparatus having a plurality of chips stacked therein is disclosed. At least two of the plurality of chips are configured to receive a column command and generate a column control signal based on the column command. Generation timing of the column control signal generated based on a column command in one of the at least two of the plurality of chips substantially coincide with the generation timing in the other of the at least two of the plurality of chips.

Abstract: A voltage trimming circuit of a semiconductor memory apparatus may include a first voltage generation block configured to select voltage levels of a first node and a second node and divide a voltage between the first node and the second node to generate a first division voltage group; a second voltage generation block configured to select voltage levels of a third node and a fourth node and divide a voltage between the third node and the fourth node to generate a second division voltage group; a first switch block configured to select one division voltage of the first division voltage group to output the selected division voltage as a first reference voltage; and a second switch block configured to select one division voltage of the second division voltage group to output the selected division voltage as a second reference voltage.

Abstract: A delay circuit of a semiconductor memory apparatus includes a decoding unit configured to decode a plurality of test signals and enable one of a plurality of control signals; a bias voltage generation unit configured to generate a first bias voltage and a second bias voltage depending upon the control signal enabled among the plurality of control signals; and a delay unit configured to determine a delay time depending upon levels of the first and second bias voltages, delay an input signal by the determined delay time, and output a resultant signal as an output signal.