Abstract: Embodiments related to integrated circuit (IC) connectors are described. In some embodiments, an IC assembly may include an IC package substrate, an intermediate member, and a male connector. The IC package substrate may have first signal contacts on a top or bottom surface, and the bottom surface may have second signal contacts for coupling with a socket on a circuit board. The intermediate member may have a first end coupled to the first signal contacts and a second end extending beyond the side surface. The male connector may be disposed at the second end of the intermediate member, and may have signal contacts coupled to the signal contacts of the intermediate member. The male connector may be mateable with a female connector when the female connector is brought into engagement in a direction parallel to the axis of the intermediate member. Other embodiments may be disclosed and/or claimed.

Abstract: An apparatus includes a plurality of contact elements to provide electrical continuity between an integrated circuit and an electronic subassembly, wherein a contact element includes a spring element and a separate lead element, wherein the spring element is arranged to be substantially vertically slidable over at least a portion of the lead element in response to a force applied to the contact element.

Abstract: Shielded sockets for microprocessors and fabrication of shielded sockets by overmolding and plating techniques are described. In an example, a socket for a packaged semiconductor device includes a plastic housing having walls surrounding a cavity. A plurality of contact strips is disposed in the cavity and supported by one or more of the walls of the plastic housing. Each of the plurality of contact strips includes a plurality of contacts. Each of the plurality of contacts includes a vertical region overmolded with plastic, a contact portion, and a J-lead portion. The plastic is coated with a metal layer.

Abstract: Shielded sockets for microprocessors and fabrication of shielded sockets by overmolding and plating techniques are described. In an example, a socket for a packaged semiconductor device includes a plastic housing having walls surrounding a cavity. A plurality of contact strips is disposed in the cavity and supported by one or more of the walls of the plastic housing. Each of the plurality of contact strips includes a plurality of contacts. Each of the plurality of contacts includes a vertical region overmolded with plastic, a contact portion, and a J-lead portion. The plastic is coated with a metal layer.

Abstract: An apparatus includes a plurality of contact elements to provide electrical continuity between an integrated circuit and an electronic subassembly, wherein a contact element includes a spring element and a separate lead element, wherein the spring element is arranged to be substantially vertically slidable over at least a portion of the lead element in response to a force applied to the contact element.

Abstract: A clip-type connector for electrically coupling a substrate with a device or another substrate is disclosed. An electrical connector comprises a top plate and a bottom plate. An array of contacts are on at least one of the top plate and bottom plate. A hinge is located between the top plate and the bottom plate such that the hinge mechanically connects the top plate to the bottom plate. A spring applying a force against the top and bottom plates.

Abstract: Connectors and methods to couple packages and dies are shown. Selected examples include plugs and receptacles having two or more terraces with contacts provided along the terraces. Examples of connectors and methods include configurations where the connector is usable with a package including a die coupled along a substrate. In selected examples a heat sink is coupled over the die, and a package includes a side access port between the heat sink and the substrate configured to receive the connector, such as one or more of a plug or receptacle through the side access port.

Abstract: A microelectronic socket having a two piece construction, wherein a first piece comprises a conductive socket substrate and the second piece comprises an insulative insert. The conductive socket substrate has a first surface, a second surface, and at least one opening extending therebetween. The insulative insert has a base portion with at least one projection extending therefrom. The insulative insert is mated with the conductive socket substrate such that the at least one projection resides within a corresponding conductive socket substrate opening. The insulative insert further includes a plurality of vias, wherein at least one of the plurality of vias extends through the insulative base and through an insulative insert projection, wherein a contact may be disposed within the via.

Abstract: An apparatus comprises a socket for an integrated circuited (IC), wherein the socket includes a socket body that includes a plurality of land grid array contacts for contacting the IC, an alignment mechanism, and a locking mechanism, and a cover for the socket, wherein the cover is vertically alignable with the alignment mechanism of the socket body and laterally slidable over the grid array contacts upon alignment to engage the locking mechanism of the socket body.

Abstract: An apparatus for coupling an integrated circuit to other electronics can include a housing having an exterior and an interior, the exterior having an exterior bottom surface, the interior defined by an interior bottom surface opposite the exterior bottom surface, and at least one sidewall extending away from the interior bottom surface to define an interior shape that is sized to receive the integrated circuit, with the integrated circuit disposed against the interior bottom surface and the at least one sidewall. The example can include a plurality of exterior contacts exposed along the exterior bottom surface in an exterior contact pattern that is generally circular in shape.

Abstract: Embodiments of the present disclosure are directed towards an inductor structure having one or more strips of conductive material disposed around a core. The strips may have contacts at a first end and a second end of the strips, and may be disposed around the core with a gap between the contacts. The inductor structure may be mounted on a surface of a substrate, and one or more traces may be formed in the surface of the substrate to electrically couple two or more of the strips of conductive material to one another to form inductive coils. Other embodiments may be described and/or claimed.

Abstract: Embodiments related to integrated circuit (IC) connectors are described. In some embodiments, an IC assembly may include an IC package substrate, an intermediate member, and a male connector. The IC package substrate may have first signal contacts on a top or bottom surface, and the bottom surface may have second signal contacts for coupling with a socket on a circuit board. The intermediate member may have a first end coupled to the first signal contacts and a second end extending beyond the side surface. The male connector may be disposed at the second end of the intermediate member, and may have signal contacts coupled to the signal contacts of the intermediate member. The male connector may be mateable with a female connector when the female connector is brought into engagement in a direction parallel to the axis of the intermediate member. Other embodiments may be disclosed and/or claimed.

Abstract: This disclosure relates generally to a connector assembly. In various examples, first conductive members are secured with respect to one another and form a first row and second conductive members are secured with respect to one another, a first subset of the second conductive members forming a second row and a second subset of the second conductive members forming a third row, the second and third rows being parallel and stacked with respect to one another and the second and third rows being orthogonal to the first row. Individual ones of the first and second conductive members are arranged to be coupled at a first end to a corresponding one of contacts. Ones of the first conductive members are arranged to be coupled to a corresponding individual one of the second conductive members proximate a second end of each of the first and second conductive members.

Abstract: An apparatus for coupling an integrated circuit to other electronics can include a housing having an exterior and an interior, the exterior having an exterior bottom surface, the interior defined by an interior bottom surface opposite the exterior bottom surface, and at least one sidewall extending away from the interior bottom surface to define an interior shape that is sized to receive the integrated circuit, with the integrated circuit disposed against the interior bottom surface and the at least one sidewall. The example can include a plurality of exterior contacts exposed along the exterior bottom surface in an exterior contact pattern that is generally circular in shape.

Abstract: Shielded sockets for microprocessors and fabrication of shielded sockets by overmolding and plating techniques are described. In an example, a socket for a packaged semiconductor device includes a plastic housing having walls surrounding a cavity. A plurality of contact strips is disposed in the cavity and supported by one or more of the walls of the plastic housing. Each of the plurality of contact strips includes a plurality of contacts. Each of the plurality of contacts includes a vertical region overmolded with plastic, a contact portion, and a J-lead portion. The plastic is coated with a metal layer.

Abstract: Connectors and methods to couple packages and dies are shown. Selected examples include plugs and receptacles having two or more terraces with contacts provided along the terraces. Examples of connectors and methods include configurations where the connector is usable with a package including a die coupled along a substrate. In selected examples a heat sink is coupled over the die, and a package includes a side access port between the heat sink and the substrate configured to receive the connector, such as one or more of a plug or receptacle through the side access port.

Abstract: This disclosure relates generally to a connector assembly. In various examples, first conductive members are secured with respect to one another and form a first row and second conductive members are secured with respect to one another, a first subset of the second conductive members forming a second row and a second subset of the second conductive members forming a third row, the second and third rows being parallel and stacked with respect to one another and the second and third rows being orthogonal to the first row. Individual ones of the first and second conductive members are arranged to be coupled at a first end to a corresponding one of contacts. Ones of the first conductive members are arranged to be coupled to a corresponding individual one of the second conductive members proximate a second end of each of the first and second conductive members.

Abstract: An apparatus includes a plurality of contact elements to provide electrical continuity between an integrated circuit and an electronic subassembly, wherein a contact element includes a spring element and a separate lead element, wherein the spring element is arranged to be substantially vertically slidable over at least a portion of the lead element in response to a force applied to the contact element.

Abstract: Embodiments of the present disclosure are directed towards an inductor structure having one or more strips of conductive material disposed around a core. The strips may have contacts at a first end and a second end of the strips, and may be disposed around the core with a gap between the contacts. The inductor structure may be mounted on a surface of a substrate, and one or more traces may be formed in the surface of the substrate to electrically couple two or more of the strips of conductive material to one another to form inductive coils. Other embodiments may be described and/or claimed.

Abstract: An apparatus for coupling an integrated circuit to other electronics can include a housing having an exterior and an interior, the exterior having an exterior bottom surface, the interior defined by an interior bottom surface opposite the exterior bottom surface, and at least one sidewall extending away from the interior bottom surface to define an interior shape that is sized to receive the integrated circuit, with the integrated circuit disposed against the interior bottom surface and the at least one sidewall. The example can include a plurality of exterior contacts exposed along the exterior bottom surface in an exterior contact pattern that is generally circular in shape.