Patents by Inventor Joshua D. Heppner

Joshua D. Heppner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140162475
    Abstract: Connectors and methods to couple packages and dies are shown. Selected examples include plugs and receptacles having two or more terraces with contacts provided along the terraces. Examples of connectors and methods include configurations where the connector is usable with a package including a die coupled along a substrate. In selected examples a heat sink is coupled over the die, and a package includes a side access port between the heat sink and the substrate configured to receive the connector, such as one or more of a plug or receptacle through the side access port.
    Type: Application
    Filed: December 11, 2012
    Publication date: June 12, 2014
    Inventors: Gaurav Chawla, Joshua D. Heppner, Zhichao Zhang, David J. Llapitan, Vijaykumar Krithivasan
  • Patent number: 8025531
    Abstract: A shielded socket and method of fabrication is described. In an embodiment, a socket is formed of a conductive polymer socket housing, and at least one conductive contact is in electrical contact with the conductive polymer socket housing. In an embodiment, a socket is formed of an insulative socket housing, and at least one conductive contact is in electrical contact with a conductive grid embedded within the insulative housing.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: September 27, 2011
    Assignee: Intel Corporation
    Inventors: Zhichao Zhang, Joshua D. Heppner, Kemal Aygun