Abstract: An electronic device, a method for obtaining an utterance intention of a user thereof, and a non-transitory computer-readable recording medium are provided. An electronic device according to an embodiment of the present disclosure may comprise: a microphone for receiving a user voice uttered by a user; and a processor for obtaining an utterance intention of a user on the basis of at least one word included in a user voice while the user voice is being input, providing response information corresponding to the obtained utterance intention, and updating the response information while providing the response information, on the basis of an additional word uttered after the at least one word is input.

Abstract: A package structure includes a first die, a second die, an insulation structure, a through via, a dielectric layer and a redistribution layer. The second die is electrically bonded to the first die. The insulation structure is disposed on the first die and laterally surrounds the second die. The through via penetrates through the insulation structure to electrically connect to the first die. The through via includes a first barrier layer and a conductive post on the first barrier layer. The dielectric layer is on the second die and the insulation structure. The redistribution layer is embedded in the dielectric layer and electrically connected to the through via. The redistribution layer includes a second barrier layer and a conductive layer on the second barrier layer. The conductive layer of the redistribution layer is in contact with the conductive post of the through via.

Abstract: A method of manufacturing a die stack structure includes the following steps. A first bonding structure is formed over a front side of a first die. The method of forming the first bonding structure includes the following steps. A first bonding dielectric material is formed on a first test pad of the first die. A first blocking layer is formed over the first bonding dielectric material. A second bonding dielectric material and a first dummy metal layer are formed over the first blocking layer. The first dummy metal layer and the first test pad are electrically isolated from each other by the first blocking layer. Thereafter, a second bonding structure is formed over a front side of a second die. The first die and the second die are bonded through the first bonding structure and the second bonding structure.

Abstract: A display apparatus comprising a driving circuit that includes a storage capacitor and at least one thin film transistor, and a light-emitting device that includes a region disposed outside the driving circuit and a region overlapping with the storage capacitor, each of capacitor electrodes of the storage capacitor being a transparent electrode having a relatively higher transmittance, so that the quality of the image realized on an outer surface of a device substrate which supports the driving circuit and the light-emitting device of each pixel area can be improved.

Abstract: A semiconductor structure including a first semiconductor die, a second semiconductor die, a passivation layer, an anti-arcing pattern, and conductive terminals is provided. The second semiconductor die is stacked over the first semiconductor die. The passivation layer covers the second semiconductor die and includes first openings for revealing pads of the second semiconductor die. The anti-arcing pattern is disposed over the passivation layer. The conductive terminals are disposed over and electrically connected to the pads of the second semiconductor die.

Abstract: Provided is a semiconductor structure including a pad disposed over and electrically connected to an interconnect structure, wherein the pad has a probe mark, and the probe mark has a concave surface; a protective layer conformally covering the pad and the probe mark; and a bonding structure disposed over the protective layer, wherein the bonding structure includes: a bonding dielectric layer includes a first bonding dielectric material and a second bonding dielectric material on the first bonding dielectric material; a first bonding metal layer including a via plug and a metal feature, wherein the via plug penetrates through the first bonding dielectric material and the protective layer to electrically connect to the pad having the probe mark, the metal feature is located on the via plug and the first bonding dielectric material, and the metal feature is laterally surrounded by the second bonding dielectric material.

Abstract: Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device includes an integrated circuit die mounting region, a molding material around the integrated circuit die mounting region, and an interconnect structure over the molding material and the integrated circuit die mounting region. The interconnect structure has contact pads, and connectors are coupled to the contact pads. Two or more of the connectors have an alignment feature formed thereon.

Abstract: Described herein are methods for cardiovascular imaging for diagnosing and/or detecting various cardiovascular diseases. Various embodiments of the invention provide using magnetic resonance imaging of the cardiovascular system of a subject at rest or a normocapnic condition, as well as at a stressed or hypercapnic condition, in a repeated manner enhancing the statistical power, such that fast, motion-corrected, free-breathing, whole-heart imaging of the cardiovascular system is utilized to identify impaired cardiovascular function in a manner with improved specificity and accuracy.

Abstract: Provided is a device for executing an application including a graphics user interface (GUI) for receiving an input value of an input field, the device including an audio output unit, a user input unit receiving a user input to request execution of the application, and a control unit configured to output, through the audio output unit, an audio signal indicating an induced inquiry corresponding to the input field, based on whether the user input is a voice input, to receive a voice input indicating a response to the induced inquiry, and to execute the application by setting an input value for the input field based on the voice input indicating the response to the induced inquiry.

Abstract: Disclosed are three-dimensional semiconductor memory devices including an electrode structure including gate electrodes stacked in a first direction, a lower pattern group including lower vertical patterns that are in a lower portion of the electrode structure and are connected to the substrate, and an upper pattern group including upper vertical patterns that are in an upper portion of the electrode structure. The upper vertical patterns may be connected to the lower vertical patterns, respectively. The devices may also include two common source plugs spaced apart from each other in a second direction. The electrode structure may be between the two common source plugs. An upper portion of the lower pattern group has a first width in the second direction, an upper portion of the upper pattern group has a second width in the second direction, and the first width may be greater than the second width.

Abstract: The present invention relates to a composition comprising an elecampane extract for prevention and alleviation or treatment of premenstrual syndrome. In detail, the composition can be advantageously available as a composition for preventing, and alleviating or treating premenstrual syndrome in women, which effectively suppresses pituitary prolactin secretion, which is a phenomenon appearing in premenstrual syndrome, to increase the progesterone release amount lowered in the luteal phase of women as well as effectively controlling the decreased release of luteinizing hormone and follicle-stimulating hormone.

Abstract: A semiconductor structure including a first semiconductor die, a second semiconductor die, a passivation layer, an anti-arcing pattern, and conductive terminals is provided. The second semiconductor die is stacked over the first semiconductor die. The passivation layer covers the second semiconductor die and includes first openings for revealing pads of the second semiconductor die. The anti-arcing pattern is disposed over the passivation layer. The conductive terminals are disposed over and electrically connected to the pads of the second semiconductor die.

Abstract: Provided is a die stack structure including a first die and a second die. The first die and the second die are bonded together through a hybrid bonding structure. At least one of a first test pad of the first die or a second test pad of the second die has a protrusion of the at least one of the first test pad or the second test pad, and a bonding insulating layer of the hybrid bonding structure covers and contacts with the protrusion, so that the first test pad and the second test pad are electrically isolated from each other.

Abstract: Disclosed is a cleaning device with an auxiliary cleaner. More particularly, a cleaning device having an auxiliary cleaner includes a bar-shaped grip extending in a vertical direction, a rigid main cleaner having a tubular housing coupled to a bottom of the grip and a plurality of frames extending from a bottom of the housing and spaced apart from each other by a predefined spacing, and the auxiliary cleaner coupled to a bottom of the main cleaner, wherein the auxiliary cleaner contacts a cleaning target as the main cleaner deforms.

Abstract: A display device comprises a display panel substrate and a glass substrate over said display panel substrate, wherein said display panel substrate comprises multiple contact pads, a display area, a first boundary, a second boundary, a third boundary and a fourth boundary, wherein said display area comprises a first edge, a second edge, a third edge and a fourth edge, wherein said first boundary is parallel to said third boundary and said first and third edges, wherein said second boundary is parallel to said fourth boundary and said second and fourth edges, wherein a first least distance between said first boundary and said first edge, wherein a second least distance between said second boundary and said second edge, a third least distance between said third boundary and said third edge, a fourth distance between said fourth boundary and said fourth edge, and wherein said first, second, third and fourth least distances are smaller than 100 micrometers, and wherein said glass substrate comprising multiple meta

Abstract: An abrasion resistance fiber includes 90.0 parts by weight to 99.0 parts by weight of a fiber body, 0.5 parts by weight to 7.5 parts by weight of an abrasion agent, 0.1 parts by weight to 0.5 parts by weight of a paraffin-based lubricant, and 0.1 parts by weight to 0.3 parts by weight of an antioxidant. The fiber body includes polyethylene terephthalate (PET). The abrasion agent is attached to a surface of the fiber body and includes silicon dioxide aerogels.