Patents by Inventor Keith A. Miller

Keith A. Miller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7670436
    Abstract: A substrate ring assembly is provided for a substrate support having a peripheral edge. The assembly has an annular band having an inner perimeter that surrounds and at least partially covers the peripheral edge of the substrate support. The assembly also has a clamp to secure the annular band to the peripheral edge of the substrate support.
    Type: Grant
    Filed: November 3, 2004
    Date of Patent: March 2, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Keith A. Miller, Ilya Lavitsky
  • Publication number: 20100049253
    Abstract: Connectors for attaching a spinal rod to an anchor. The connectors may include a receiver with a rod-receiving opening on a bottom side that leads into a receiver passage sized to receive the spinal rod. A elongate member may extend through an opening on the top side of the receiver, and may include a cut-out to receive the spinal rod. A grommet may be operatively connected to the receiver and include a grommet passage to receive the anchor. A disk may be positioned between the receiver and the grommet and may include an angled surface that is positioned on a side of the receiver passage. The elongate member may be movable along the first axis between extended and retracted positions with the cut-out positioned closer to the second axis in the retracted position than in the extended position.
    Type: Application
    Filed: August 20, 2008
    Publication date: February 25, 2010
    Applicant: WARSAW ORTHOPEDIC, INC.
    Inventor: Keith MILLER
  • Patent number: 7665775
    Abstract: A locking window that is selectively movable between a first closed position and a second open position and a window latch adapted to be attached to the window is disclosed. The window latch includes a cam latch, a housing including a support wall, a pivot fastener for attaching the cam latch to the housing, and a detent for retaining the cam latch in one of the open and the locked positions.
    Type: Grant
    Filed: August 4, 2003
    Date of Patent: February 23, 2010
    Assignee: Hughes Supply Company of Thomasville, Inc.
    Inventors: D. Keith Miller, Christopher R. Rogers, Farrell Smith, Jeffrey T. Hughes
  • Publication number: 20090308732
    Abstract: Embodiments of the present invention generally relate to an apparatus and method for uniform sputter depositing of materials into the bottom and sidewalls of high aspect ratio features on a substrate. In one embodiment, a sputter deposition system includes a collimator that has apertures having aspect ratios that decrease from a central region of the collimator to a peripheral region of the collimator. In one embodiment, the collimator is coupled to a grounded shield via a bracket member that includes a combination of internally and externally threaded fasteners. In another embodiment, the collimator is integrally attached to a grounded shield. In one embodiment, a method of sputter depositing material includes pulsing the bias on the substrate support between high and low values.
    Type: Application
    Filed: June 11, 2009
    Publication date: December 17, 2009
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Yong Cao, Maurice E. Ewert, Xianmin Tang, Keith A. Miller, Daniel C. Lubben, Umesh M. Kelkar, Tza-Jing Gung, Anantha K. Subramani
  • Publication number: 20090260982
    Abstract: Embodiments described herein generally relate to components for a semiconductor processing chamber, a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a process kit. In one embodiment a lower shield for encircling a sputtering target and a substrate support is provided. The lower shield comprises a cylindrical outer band having a first diameter dimensioned to encircle the sputtering surface of the sputtering target and the substrate support, the cylindrical band comprising a top wall that surrounds a sputtering surface of a sputtering target and a bottom wall that surrounds the substrate support, a support ledge comprising a resting surface and extending radially outward from the cylindrical outer band, a base plate extending radially inward from the bottom wall of the cylindrical band, and a cylindrical inner band coupled with the base plate and partially surrounding a peripheral edge of the substrate support.
    Type: Application
    Filed: April 14, 2009
    Publication date: October 22, 2009
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Keith A. Miller, Anantha Subramani
  • Publication number: 20090259256
    Abstract: The present application relates to connectors for coupling together two surgical members of different materials while inhibiting galvanic corrosion. The connector may include a first coupling element composed of a material with a similar galvanic potential to one of the surgical members, and a second coupling element composed of a material with a similar galvanic potential to the second surgical member. Each of the first and second coupling elements may be configured to connect to the respective surgical member. The connector may also include a coupling medium disposed between the first and second coupling elements. The coupling medium may function to connect together the two coupling elements, and isolate the coupling elements to inhibit galvanic corrosion.
    Type: Application
    Filed: April 11, 2008
    Publication date: October 15, 2009
    Applicant: WARSAW ORTHOPEDIC, INC.
    Inventor: Keith Miller
  • Patent number: 7593428
    Abstract: Apparatus, and an associated method, for forming a UDP-Lite, or other, data packet with multiple, dynamically-selected, checksum-protected parts. Digitized data is provided to a formatter, and the formatter forms the data packet to include header fields identifying parts of the payload portion of the data packet that are checksum-protected with different checksums. Additional indicia is contained in the header part of the data packet to identify the checksum-type and the checksum-values associated with the separate parts of the data packet. Multiple, contiguous parts of the data packet are checksum-protected with selectable checksum-types, selected by a selector that operates to control operation of the formatter.
    Type: Grant
    Filed: January 9, 2007
    Date of Patent: September 22, 2009
    Inventors: Keith Miller, Marta Karzewicz
  • Patent number: 7585312
    Abstract: A spinal stabilization apparatus and method according to which a fastener is engaged with a vertebra of a spinal system. The fastener is connected to a rod and the direction of extension of at least a portion of the rod in a coronal plane may be selectively adjusted.
    Type: Grant
    Filed: April 29, 2005
    Date of Patent: September 8, 2009
    Assignee: Warsaw Orthopedic, Inc.
    Inventors: Bernard A. Rawlins, Alan Rezach, David A. Warmbold, Keith Miller, Marco Capote, Douglas Baker, Anthony Dickinson
  • Patent number: 7569125
    Abstract: A one-piece inner shield usable in a plasma sputter reactor and extending from the target to the pedestal with a smooth inner surface and supported by an annular flange in a middle portion of the shield. The shield may be used to support the RF coil used in exciting the plasma. An outer shield includes an outwardly extending flange on its end alignable with the inner shield flange, holes in correspondence to recesses in the inner shield for standoffs for the RF coil, and circumferentially arranged gas flow holes.
    Type: Grant
    Filed: May 5, 2005
    Date of Patent: August 4, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Tza-Jing Gung, Xianmin Tang, John Forster, Peijun Ding, Marc Schweitzer, Keith A. Miller, Ilya Lavitsky
  • Publication number: 20090177070
    Abstract: An electrode assembly for a sensor catheter tip includes a first electrode and a second electrode each having a central axis. The two electrodes are axially aligned and spaced apart along the axis. Each of the first and second electrodes comprises a contact aperture spaced from the center axis, and a contact. element positioned within each of the contact apertures. The center axis of each of the first and second electrodes is substantially aligned, and the contact elements corresponding to each of the first and second electrodes are offset, thereby providing staggered contact points for each respective electrode.
    Type: Application
    Filed: March 23, 2009
    Publication date: July 9, 2009
    Applicant: TYCO ELECTRONICS CORPORATION
    Inventors: WILLIAM HENRY BERNHART, JOHN PHILIP THOMPSON, JOHN RAYMOND PENICA, PAUL STEVEN SREMCICH, JOHN E. HAMPTON, BRENT DAVID YOHN, KEITH MILLER
  • Publication number: 20090159428
    Abstract: When a magnetron is scanned about the back of a target in a selected complex path having radial components, the erosion profile has a form depending upon the selection of paths. A radial erosion rate profile for a given magnetron is measured. Periodically during scanning, an erosion profile is calculated from the measured erosion rate profile, the time the magnetron spends at different radii, and the target power. The calculated erosion profile may be used to indicate when erosion has become excessive at any location prompting target replacement or to adjust the height of the magnetron above the target for repeated scans. In another aspect of the invention, the magnetron height is dynamically adjusted during a scan to compensate for erosion. The compensation may be based on the calculated erosion profile or on feedback control of the present value of the target voltage for a constant-power target supply.
    Type: Application
    Filed: December 20, 2007
    Publication date: June 25, 2009
    Applicant: Applied Materials, Inc.
    Inventors: KEITH A. MILLER, Daniel C. Lubben
  • Patent number: 7520969
    Abstract: A process kit for a semiconductor processing chamber is provided. In one embodiment, a process kit includes a notched deposition ring. In another embodiment, a process kit includes a cover ring configured to engage the notched deposition ring. In another embodiment, a process kit includes an annular deposition ring body having inner, outer, upper and bottom walls. A trough is recessed into an upper surface of the body between the upper and inner walls. A recessed surface is formed on a lower surface of the body between the bottom and inner walls. A notch extends inward from the body to catch deposition material passing through a notch of the substrate being processed.
    Type: Grant
    Filed: March 7, 2006
    Date of Patent: April 21, 2009
    Assignee: Applied Materials, Inc.
    Inventor: Keith A. Miller
  • Publication number: 20090099933
    Abstract: Evaluating values of different terms in online auctions is disclosed. An interest rate and a period from a buyer for a lot are obtained. The lot has a predetermined value. A first bid is received from a first bidder and a second bid is received from a second bidder on the lot. The first and second bids each have a payment time and a rebate. The first bid is transformed into a first value and the second bid is transformed into a second value using the interest rate, period, and predetermined value from the buyer and the payment times and rebates from the first and second bidders.
    Type: Application
    Filed: December 12, 2008
    Publication date: April 16, 2009
    Inventors: David Marhafer, Keith Miller, Dan McIlnay, David Clevenger
  • Patent number: 7512433
    Abstract: An electrode assembly for a sensor catheter tip includes a first electrode and a second electrode each having a central axis. The two electrodes are axially aligned and spaced apart along the axis. Each of the first and second electrodes comprises a contact aperture spaced from the center axis, and a contact element positioned within each of the contact apertures. The center axis of each of the first and second electrodes is substantially aligned, and the contact elements corresponding to each of the first and second electrodes are offset, thereby providing staggered contact points for each respective electrode.
    Type: Grant
    Filed: May 16, 2006
    Date of Patent: March 31, 2009
    Assignee: Tyco Electronics Corporation
    Inventors: William Henry Bernhart, John Philip Thompson, John Raymond Penica, Paul Steven Sremcich, John E. Hampton, Brent David Yohn, Keith Miller
  • Patent number: 7483852
    Abstract: A method and system of evaluating values of different payment or delivery terms in online auctions, including obtaining an interest rate and a period from a buyer for a lot, the lot having a predetermined value, receiving a first bid from a first bidder and a second bid from a second bidder on the lot, the first and second bids each having a payment time and a rebate and transforming the first bid into a first value and the second bid into a second value using the interest rate, the period, and the predetermined value from the buyer, and the payment times and rebates from the first and second bidders.
    Type: Grant
    Filed: April 24, 2002
    Date of Patent: January 27, 2009
    Assignee: Ariba, Inc.
    Inventors: David Marhafer, Keith Miller, Dan McIlnay, David Clevenger
  • Publication number: 20080276958
    Abstract: A substrate cleaning chamber includes a contoured ceiling electrode having an arcuate surface that faces a substrate support and has a variable cross-sectional thickness to vary the gap size between the arcuate surface and the substrate support to provide a varying plasma density across the substrate support. A dielectric ring for the cleaning chamber comprises a base, a ridge, and a radially inward ledge that covers the peripheral lip of the substrate support. A base shield comprises a circular disc having at least one perimeter wall. Cleaning and conditioning processes for the cleaning chamber are also described.
    Type: Application
    Filed: May 8, 2007
    Publication date: November 13, 2008
    Inventors: Vineet Mehta, Karl Brown, John A. Pipitone, Daniel J. Hoffman, Steven C. Shannon, Keith A. Miller, Vijay D. Parkhe
  • Patent number: 7418186
    Abstract: A fiber retention device is provided for retention of fibers such as optical fibers, tubing, cables, buffer tubes and other elongate objects. The retention device includes, generally, a mounting retainer and a resilient sleeve. The mounting retainer is formed of a resilient material and defines one or more generally U-shaped support channels. The resilient sleeve is positioned in the U-shaped support channel and defines at least one expandable passageway for receiving a fiber therein. The passageway diameter is less than the fiber diameter in a pre-load orientation or relaxed condition prior to inserting the fiber into the passageway. The support channel selectively includes a plurality of tabs for locating the sleeve therein including tabs on a bottom wall for resisting relative horizontal movement and tabs on a side wall for resisting relative vertical movement of the sleeve within the channel.
    Type: Grant
    Filed: May 11, 2007
    Date of Patent: August 26, 2008
    Assignee: Preformed Line Products Company
    Inventors: Christopher S. Grubish, Keith A. Miller, George Dudash, John L. Hornsby, Mark A. Stransky, Randy G. Cloud
  • Patent number: 7409464
    Abstract: A system and method for converting compact multimedia format files to synchronized multimedia integration language while preserving media and timeline information. Media objects and timeline information are extracted from a compact multimedia format file. The media is saved to separate files, and each file may be split into multiple files if the file overlaps a loop boundary. A synchronized multimedia integration language is created from the timing information, including loops, and the media files.
    Type: Grant
    Filed: October 29, 2004
    Date of Patent: August 5, 2008
    Assignee: Nokia Corporation
    Inventors: Cris Jansson, Keith Miller
  • Publication number: 20080179183
    Abstract: A non-axisymmetric electromagnet coil used in plasma processing in which at least one electromagnet coil is not symmetric with the central axis of the plasma processing chamber with which it is used but is symmetric with an axis offset from the central axis. When placed radially outside of an RF coil, it may reduce the azimuthal asymmetry in the plasma produced by the RF coil. Axisymmetric magnet arrays may include additional axisymmetric electromagnet coils. One axisymmetric coil is advantageously placed radially inside of the non-axisymmetric coil to carry opposed currents. The multiple electromagnet coils may be embedded in a molded encapsulant having a central bore about a central axis providing the axisymmetry of the coils.
    Type: Application
    Filed: January 31, 2007
    Publication date: July 31, 2008
    Applicant: Applied Materials, Inc.
    Inventors: CHRISTOPHER BOITNOTT, KEITH A. MILLER
  • Publication number: 20080141939
    Abstract: A electromagnet array structure including multiple electromagnetic coils captured in a rigid encapsulant, for example, of cured epoxy resin, to form a unitary free-standing structure which can be placed around the walls of a plasma processing chamber. A liquid cooling coil may also be captured in the encapsulant between the electromagnetic coils. The structure may additionally include water fittings, locating pins, through tubes for chamber bolts, and lifting brackets.
    Type: Application
    Filed: December 13, 2006
    Publication date: June 19, 2008
    Applicant: Applied Materials, Inc
    Inventors: Andrew Gillard, Anthony Vesci, Keith A. Miller