Patents by Inventor Keith Comendant
Keith Comendant has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8587113Abstract: A thermal plate for a substrate support assembly in a semiconductor plasma processing apparatus, includes multiple independently controllable planar thermal zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. Each planar thermal zone uses at least one Peltier device as a thermoelectric element. A substrate support assembly in which the thermal plate is incorporated has an electrostatic clamping electrode layer and a temperature controlled base plate. Methods for manufacturing the thermal plate include bonding together ceramic or polymer sheets having planar thermal zones, positive, negative and common lines and vias.Type: GrantFiled: June 7, 2013Date of Patent: November 19, 2013Assignee: Lam Research CorporationInventors: Keith William Gaff, Keith Comendant, Anthony Ricci
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Publication number: 20130269368Abstract: A thermal plate for a substrate support assembly in a semiconductor plasma processing apparatus, includes multiple independently controllable planar thermal zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. Each planar thermal zone uses at least one Peltier device as a thermoelectric element. A substrate support assembly in which the thermal plate is incorporated has an electrostatic clamping electrode layer and a temperature controlled base plate. Methods for manufacturing the thermal plate include bonding together ceramic or polymer sheets having planar thermal zones, positive, negative and common lines and vias.Type: ApplicationFiled: June 7, 2013Publication date: October 17, 2013Inventors: Keith William GAFF, Keith Comendant, Anthony Ricci
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Patent number: 8540843Abstract: A plasma processing system for processing a substrate is described. The plasma processing system includes a bottom piece including a chuck configured for holding the substrate. The plasma processing system also includes an induction coil configured to generate an electromagnetic field in order to create a plasma for processing the substrate. The plasma processing system also includes a cover covering at least the induction coil and a heating and cooling system.Type: GrantFiled: August 23, 2010Date of Patent: September 24, 2013Assignee: Lam Research CorporationInventors: Leonard J. Sharpless, Keith Comendant
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Publication number: 20130241581Abstract: A plate of substantially uniform thickness is formed from an electrically conductive material. The plate has a top surface defined to support a part to be measured. The plate has a bottom surface defined to be connected to a radiofrequency (RF) transmission rod such that RF power can be transmitted through the RF transmission rod to the plate. The plate is defined to have a number of holes cut vertically through the plate at a corresponding number of locations that underlie embedded conductive material items in the part to be measured when the part is positioned on the top surface of the plate.Type: ApplicationFiled: April 22, 2013Publication date: September 19, 2013Applicant: Lam Research CorporationInventors: Jaehyun Kim, Arthur H. Sato, Keith Comendant, Qing Liu, Feiyang Wu
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Patent number: 8519724Abstract: A plate of substantially uniform thickness is formed from an electrically conductive material. The plate has a top surface defined to support a part to be measured. The plate has a bottom surface defined to be connected to a radiofrequency (RF) transmission rod such that RF power can be transmitted through the RF transmission rod to the plate. The plate is defined to have a number of holes cut vertically through the plate at a corresponding number of locations that underlie embedded conductive material items in the part to be measured when the part is positioned on the top surface of the plate.Type: GrantFiled: September 29, 2008Date of Patent: August 27, 2013Assignee: Lam Research CorporationInventors: Jaehyun Kim, Arthur H. Sato, Keith Comendant, Qing Liu, Feiyang Wu
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Patent number: 8503151Abstract: A dielectric arrestor insert for use in a chamber wafer processing system having a gas input line, an arrestor housing and a wafer processing space. The input line is able to provide gas to the arrestor housing. The arrestor housing is able to house the dielectric arrestor insert. The dielectric arrestor insert comprises a gas entry portion, a non-linear channel and a gas exit portion. The gas entry portion is arranged to receive the gas from the input line. The non-linear channel is arranged to deliver the gas from the gas entry portion to the gas exit portion. The gas exit portion is arranged to deliver the gas from the non-linear channel to the wafer processing space.Type: GrantFiled: September 30, 2009Date of Patent: August 6, 2013Assignee: Lam Research CorporationInventor: Keith Comendant
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Patent number: 8461674Abstract: A thermal plate for a substrate support assembly in a semiconductor plasma processing apparatus, comprises multiple independently controllable planar thermal zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. Each planar thermal zone uses at least one Peltier device as a thermoelectric element. A substrate support assembly in which the thermal plate is incorporated includes an electrostatic clamping electrode layer and a temperature controlled base plate. Methods for manufacturing the thermal plate include bonding together ceramic or polymer sheets having planar thermal zones, positive, negative and common lines and vias.Type: GrantFiled: September 21, 2011Date of Patent: June 11, 2013Assignee: Lam Research CorporationInventors: Keith William Gaff, Keith Comendant, Anthony Ricci
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Publication number: 20130068750Abstract: A heating plate for a substrate support assembly in a semiconductor plasma processing apparatus, comprises multiple independently controllable planar heater zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. Each planar heater zone uses at least one diode as a heater element. A substrate support assembly in which the heating plate is incorporated includes an electrostatic clamping electrode and a temperature controlled base plate. Methods for manufacturing the heating plate include bonding together ceramic or polymer sheets having planar heater zones, power supply lines, power return lines and vias.Type: ApplicationFiled: September 20, 2011Publication date: March 21, 2013Applicant: Lam Research CorporationInventors: Keith William Gaff, Keith Comendant
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Publication number: 20130072035Abstract: A thermal plate for a substrate support assembly in a semiconductor plasma processing apparatus, comprises multiple independently controllable planar thermal zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. Each planar thermal zone uses at least one Peltier device as a thermoelectric element. A substrate support assembly in which the thermal plate is incorporated includes an electrostatic clamping electrode layer and a temperature controlled base plate. Methods for manufacturing the thermal plate include bonding together ceramic or polymer sheets having planar thermal zones, positive, negative and common lines and vias.Type: ApplicationFiled: September 21, 2011Publication date: March 21, 2013Applicant: Lam Research CorporationInventors: Keith William Gaff, Keith Comendant, Anthony Ricci
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Patent number: 8269510Abstract: A chamber formed from an electrically conductive material is connected to a ground potential. A hot electrode formed from an electrically conductive material is disposed within the chamber in a substantially horizontal orientation and is physically separated from the chamber. The hot electrode includes a top surface defined to support a part to be measured. A radiofrequency (RF) transmission rod is connected to extend from a bottom surface of the hot electrode through an opening in a bottom of the chamber and be physically separated from the chamber. The RF transmission rod is defined to transmit RF power from a conductor plate in an electrical components housing to the hot electrode. An upper electrode formed from an electrically conductive material is disposed within the chamber in a substantially horizontal orientation. The upper electrode is electrically connected to the chamber and is defined to be movable in a vertical direction.Type: GrantFiled: September 29, 2008Date of Patent: September 18, 2012Assignee: Lam Research CorporationInventors: Jaehyun Kim, Arthur H. Sato, Keith Comendant, Qing Liu, Feiyang Wu
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Publication number: 20120043022Abstract: A plasma processing system for processing a substrate is described. The plasma processing system includes a bottom piece including a chuck configured for holding the substrate. The plasma processing system also includes an induction coil configured to generate an electromagnetic field in order to create a plasma for processing the substrate. The plasma processing system also includes a cover covering at least the induction coil and a heating and cooling system.Type: ApplicationFiled: August 23, 2010Publication date: February 23, 2012Inventors: Leonard J. Sharpless, Keith Comendant
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Publication number: 20120018411Abstract: An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus.Type: ApplicationFiled: September 19, 2011Publication date: January 26, 2012Applicant: Lam Research CorporationInventors: Anthony J. Ricci, Keith Comendant, James Tappan
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Patent number: 8084705Abstract: An electrode assembly and method of centering an outer ring around an electrode assembly in a plasma reaction chamber used in semiconductor substrate processing. The method includes positioning the outer ring around an outer surface of a backing member of the electrode assembly, and inserting at least one centering element between the outer ring and the backing member. The centering element can be a plurality of spring-loaded centering elements received in a cavity on the outer surface of the backing member, the centering elements having a first end adapted to contact the outer ring and a second end adapted to receive a spring. The outer ring surrounds an outer surface of the backing member, such that the plurality of spring-loaded centering elements are positioned between the outer surface of the backing member and an inner surface of the outer ring.Type: GrantFiled: December 14, 2010Date of Patent: December 27, 2011Assignee: Lam Research CorporationInventors: Dean J. Larson, Daniel Brown, Keith Comendant, Victor Wang
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Patent number: 8051556Abstract: An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.Type: GrantFiled: September 22, 2008Date of Patent: November 8, 2011Assignee: Lam Research CorporationInventors: Anthony J. Ricci, Keith Comendant, James Tappan
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Patent number: 8038796Abstract: An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.Type: GrantFiled: December 30, 2004Date of Patent: October 18, 2011Assignee: Lam Research CorporationInventors: Anthony J. Ricci, Keith Comendant, James Tappan
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Patent number: 7998296Abstract: A method of protecting a bond layer in a substrate support adapted for use in a plasma processing system. The method includes the steps of attaching an upper member of a substrate support to a lower member of a substrate support with a bonding material. An adhesive is applied to an outer periphery of the upper member and to an upper periphery of the lower member, and a protective ring is positioned around the outer periphery of the upper member and the upper periphery of the lower member. The protective ring is originally fabricated with dimensions the provide mechanical stability and workability. The protective ring is then machined to an exact set of final dimensions consistent with the design of the substrate support application.Type: GrantFiled: August 26, 2008Date of Patent: August 16, 2011Assignee: Lam Research CorporationInventors: Tony Ricci, Jim Tappan, Keith Comendant
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Patent number: 7973539Abstract: A method is disclosed for calibrating a capacitance of an apparatus for measuring dielectric properties of a part. The apparatus includes an electrically grounded chamber, a lower electrode disposed within the chamber and connected to a radiofrequency (RF) transmission rod, an electrically grounded upper electrode disposed within the chamber above the lower electrode, and a variable capacitor connected to control transmission of RF power through the RF transmission rod to the lower electrode. A method is also disclosed for determining a capacitance of a part through use of the apparatus. A method is also disclosed for determining a dielectric constant of a part through use of the apparatus. A method is also disclosed for determining a loss tangent of a part through use of the apparatus.Type: GrantFiled: February 17, 2011Date of Patent: July 5, 2011Assignee: Lam Research CorporationInventors: Jaehyun Kim, Arthur H. Sato, Keith Comendant, Qing Liu, Feiyang Wu
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Publication number: 20110143462Abstract: A plasma etching system having a substrate support assembly with multiple independently controllable heater zones. The plasma etching system is configured to control etching temperature of predetermined locations so that pre-etch and/or post-etch non-uniformity of critical device parameters can be compensated for.Type: ApplicationFiled: December 13, 2010Publication date: June 16, 2011Applicant: Lam Research CorporationInventors: Keith William Gaff, Harmeet Singh, Keith Comendant, Vahid Vahedi
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Publication number: 20110140715Abstract: A method is disclosed for calibrating a capacitance of an apparatus for measuring dielectric properties of a part. The apparatus includes an electrically grounded chamber, a lower electrode disposed within the chamber and connected to a radiofrequency (RF) transmission rod, an electrically grounded upper electrode disposed within the chamber above the lower electrode, and a variable capacitor connected to control transmission of RF power through the RF transmission rod to the lower electrode. A method is also disclosed for determining a capacitance of a part through use of the apparatus. A method is also disclosed for determining a dielectric constant of a part through use of the apparatus. A method is also disclosed for determining a loss tangent of a part through use of the apparatus.Type: ApplicationFiled: February 17, 2011Publication date: June 16, 2011Applicant: Lam Research CorporationInventors: Jaehyun Kim, Arthur H. Sato, Keith Comendant, Qing Liu, Feiyang Wu
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Patent number: 7939784Abstract: A method of tuning the thermal conductivity of an electrostatic chuck (ESC) support assembly comprises measuring the temperature at a plurality of sites on a support assembly surface in which each site is associated with a given cell, determining from the measurements any fractional reduction in area suggested for each cell, and removing material from the support assembly surface within each cell in accordance with the suggested fractional reduction in order to decrease thermal conductivity in that cell. The material removal can result in an improvement to the equilibrium temperature uniformity of the electrostatic chuck support assembly at the chuck surface of an electrostatic chuck bonded to the support assembly surface, or can result in an equilibrium temperature profile of the ESC support assembly which approaches or achieves a target equilibrium temperature profile.Type: GrantFiled: January 29, 2009Date of Patent: May 10, 2011Assignee: Lam Research CorporationInventors: Robert Steger, Keith Comendant