Patents by Inventor Keith Comendant
Keith Comendant has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110092072Abstract: A heating plate for a substrate support assembly in a semiconductor plasma processing apparatus, comprises multiple independently controllable planar heater zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. A substrate support assembly in which the heating plate is incorporated includes an electrostatic clamping electrode and a temperature controlled base plate. Methods for manufacturing the heating plate include bonding together ceramic or polymer sheets having planar heater zones, power supply lines, power return lines and vias.Type: ApplicationFiled: October 21, 2009Publication date: April 21, 2011Applicant: Lam Research CorporationInventors: Harmeet Singh, Keith Gaff, Neil Benjamin, Keith Comendant
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Publication number: 20110083318Abstract: An electrode assembly and method of centering an outer ring around an electrode assembly in a plasma reaction chamber used in semiconductor substrate processing. The method includes positioning the outer ring around an outer surface of a backing member of the electrode assembly, and inserting at least one centering element between the outer ring and the backing member. The centering element can be a plurality of spring-loaded centering elements received in a cavity on the outer surface of the backing member, the centering elements having a first end adapted to contact the outer ring and a second end adapted to receive a spring. The outer ring surrounds an outer surface of the backing member, such that the plurality of spring-loaded centering elements are positioned between the outer surface of the backing member and an inner surface of the outer ring.Type: ApplicationFiled: December 14, 2010Publication date: April 14, 2011Inventors: Dean J. Larson, Daniel Brown, Keith Comendant, Victor Wang
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Publication number: 20110086513Abstract: Components of a plasma processing apparatus includes a backing member with gas passages attached to an upper electrode with gas passages. To compensate for the differences in coefficient of thermal expansion between the metallic backing member and upper electrode, the gas passages are positioned and sized such that they are misaligned at ambient temperature and substantially concentric at an elevated processing temperature. Non-uniform shear stresses can be generated in the elastomeric bonding material, due to the thermal expansion. Shear stresses can either be accommodated by applying an elastomeric bonding material of varying thickness or using a backing member comprising of multiple pieces.Type: ApplicationFiled: December 14, 2010Publication date: April 14, 2011Applicant: Lam Research CorporationInventors: Anthony De La Llera, Allan K. Ronne, Jaehyun Kim, Jason Augustino, Rajinder Dhindsa, Yen-Kun Wang, Saurabh J. Ullal, Anthony J. Norell, Keith Comendant, William M. Denty, JR.
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Publication number: 20110075313Abstract: A dielectric arrestor insert for use in a chamber wafer processing system having a gas input line, an arrestor housing and a wafer processing space. The input line is able to provide gas to the arrestor housing. The arrestor housing is able to house the dielectric arrestor insert. The dielectric arrestor insert comprises a gas entry portion, a non-linear channel and a gas exit portion. The gas entry portion is arranged to receive the gas from the input line. The non-linear channel is arranged to deliver the gas from the gas entry portion to the gas exit portion. The gas exit portion is arranged to deliver the gas from the non-linear channel to the wafer processing space.Type: ApplicationFiled: September 30, 2009Publication date: March 31, 2011Inventor: Keith Comendant
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Patent number: 7911213Abstract: A method is disclosed for calibrating a capacitance of an apparatus for measuring dielectric properties of a part. The apparatus includes an electrically grounded chamber, a lower electrode disposed within the chamber and connected to a radiofrequency (RF) transmission rod, an electrically grounded upper electrode disposed within the chamber above the lower electrode, and a variable capacitor connected to control transmission of RF power through the RF transmission rod to the lower electrode. A method is also disclosed for determining a capacitance of a part through use of the apparatus. A method is also disclosed for determining a dielectric constant of a part through use of the apparatus. A method is also disclosed for determining a loss tangent of a part through use of the apparatus.Type: GrantFiled: September 29, 2008Date of Patent: March 22, 2011Assignee: Lam Research CorporationInventors: Jaehyun Kim, Arthur H. Sato, Keith Comendant, Qing Liu, Feiyang Wu
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Patent number: 7875824Abstract: An electrode assembly and method of centering an outer ring around an electrode assembly in a plasma reaction chamber used in semiconductor substrate processing. The method includes positioning the outer ring around an outer surface of a backing member of the electrode assembly, and inserting at least one centering element between the outer ring and the backing member. The centering element can be a plurality of spring-loaded centering elements received in a cavity on the outer surface of the backing member, the centering elements having a first end adapted to contact the outer ring and a second end adapted to receive a spring. The outer ring surrounds an outer surface of the backing member, such that the plurality of spring-loaded centering elements are positioned between the outer surface of the backing member and an inner surface of the outer ring.Type: GrantFiled: February 2, 2007Date of Patent: January 25, 2011Assignee: Lam Research CorporationInventors: Dean J. Larson, Daniel Brown, Keith Comendant, Victor Wang
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Patent number: 7854820Abstract: Components of a plasma processing apparatus includes a backing member with gas passages attached to an upper electrode with gas passages. To compensate for the differences in coefficient of thermal expansion between the metallic backing member and upper electrode, the gas passages are positioned and sized such that they are misaligned at ambient temperature and substantially concentric at an elevated processing temperature. Non-uniform shear stresses can be generated in the elastomeric bonding material, due to the thermal expansion. Shear stresses can either be accommodated by applying an elastomeric bonding material of varying thickness or using a backing member comprising of multiple pieces.Type: GrantFiled: December 15, 2006Date of Patent: December 21, 2010Assignee: Lam Research CorporationInventors: Anthony De La Llera, Allan K. Ronne, Jaehyun Kim, Jason Augustino, Rajinder Dhindsa, Yen-Kun Wang, Saurabh J. Ullal, Anthony J. Norell, Keith Comendant, William M. Denty, Jr.
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Patent number: 7780791Abstract: A plasma processing system for processing a substrate is described. The plasma processing system includes a bottom piece including a chuck configured for holding the substrate. The plasma processing system also includes an induction coil configured to generate an electromagnetic field in order to create a plasma for processing the substrate; and an optimized top piece coupled to the bottom piece, the top piece further configured for a heating and cooling system. Wherein, the heating and cooling system is substantially shielded from the electromagnetic field by the optimized top piece, and the optimized top piece can substantially be handled by a single person.Type: GrantFiled: June 30, 2004Date of Patent: August 24, 2010Assignee: Lam Research CorporationInventors: Leonard J. Sharpless, Keith Comendant
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Patent number: 7777500Abstract: Characterizing dielectric properties of a part includes placing a full-sized part within a dielectric property measurement apparatus. In one embodiment, the full-sized part is a dielectric part of a plasma processing system. The dielectric property measurement apparatus is operated to determine a dielectric constant value of the full-sized part and a loss tangent value of the full-sized part. The determined dielectric constant and loss tangent values are affixed to the full-sized part.Type: GrantFiled: September 29, 2008Date of Patent: August 17, 2010Assignee: Lam Research CorporationInventors: Jaehyun Kim, Arthur H. Sato, Keith Comendant, Qing Liu, Feiyang Wu
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Publication number: 20100116788Abstract: A substrate support useful in a reaction chamber of a plasma processing apparatus is provided. The substrate support comprises a base member and a heat transfer member overlying the base member. The heat transfer member has multiple zones to individually heat and cool each zone of the heat transfer member. An electrostatic chuck overlies the heat transfer member. The electrostatic chuck has a support surface for supporting a substrate in a reaction chamber of the plasma processing apparatus. A source of cold liquid and a source of hot liquid are in fluid communication with flow passages in each zone. A valve arrangement is operable to independently control temperature of the liquid by adjusting a mixing ratio of the hot liquid to the cold liquid circulating in the flow passages. In another embodiment, heating elements along a supply line and transfer lines heat a liquid from a liquid source before circulating in the flow passages.Type: ApplicationFiled: November 12, 2008Publication date: May 13, 2010Applicant: Lam Research CorporationInventors: Harmeet Singh, Keith Comendant
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Publication number: 20100079152Abstract: A method is disclosed for calibrating a capacitance of an apparatus for measuring dielectric properties of a part. The apparatus includes an electrically grounded chamber, a lower electrode disposed within the chamber and connected to a radiofrequency (RF) transmission rod, an electrically grounded upper electrode disposed within the chamber above the lower electrode, and a variable capacitor connected to control transmission of RF power through the RF transmission rod to the lower electrode. A method is also disclosed for determining a capacitance of a part through use of the apparatus. A method is also disclosed for determining a dielectric constant of a part through use of the apparatus. A method is also disclosed for determining a loss tangent of a part through use of the apparatus.Type: ApplicationFiled: September 29, 2008Publication date: April 1, 2010Applicant: Lam Research CorporationInventors: Jaehyun Kim, Arthur H. Sato, Keith Comendant, Qing Liu, Feiyang Wu
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Patent number: 7651269Abstract: Temperature probes for measuring the temperature of objects are disclosed. The temperature probes include a housing and a tip in thermal contact with an end of the housing. The tip is adapted to contact a surface of the object whose temperature is to be measured by the temperature probe. A portion of the housing in contact with the tip has a high thermal resistance effective to thermally isolate the tip from an adjacent portion of the housing. A sensor is located inside of the housing and adapted to measure the temperature of the tip.Type: GrantFiled: July 19, 2007Date of Patent: January 26, 2010Assignee: Lam Research CorporationInventor: Keith Comendant
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Publication number: 20090161286Abstract: A method of tuning the thermal conductivity of an electrostatic chuck (ESC) support assembly comprises measuring the temperature at a plurality of sites on a support assembly surface in which each site is associated with a given cell, determining from the measurements any fractional reduction in area suggested for each cell, and removing material from the support assembly surface within each cell in accordance with the suggested fractional reduction in order to decrease thermal conductivity in that cell. The material removal can result in an improvement to the equilibrium temperature uniformity of the electrostatic chuck support assembly at the chuck surface of an electrostatic chuck bonded to the support assembly surface, or can result in an equilibrium temperature profile of the ESC support assembly which approaches or achieves a target equilibrium temperature profile.Type: ApplicationFiled: January 29, 2009Publication date: June 25, 2009Applicant: Lam Research CorporationInventors: ROBERT STEGER, KEITH COMENDANT
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Publication number: 20090091335Abstract: Characterizing dielectric properties of a part includes placing a full-sized part within a dielectric property measurement apparatus. In one embodiment, the full-sized part is a dielectric part of a plasma processing system. The dielectric property measurement apparatus is operated to determine a dielectric constant value of the full-sized part and a loss tangent value of the full-sized part. The determined dielectric constant and loss tangent values are affixed to the full-sized part.Type: ApplicationFiled: September 29, 2008Publication date: April 9, 2009Inventors: Jaehyun Kim, Arthur H. Sato, Keith Comendant, Qing Liu, Feiyang Wu
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Publication number: 20090091341Abstract: A plate of substantially uniform thickness is formed from an electrically conductive material. The plate has a top surface defined to support a part to be measured. The plate has a bottom surface defined to be connected to a radiofrequency (RF) transmission rod such that RF power can be transmitted through the RF transmission rod to the plate. The plate is defined to have a number of holes cut vertically through the plate at a corresponding number of locations that underlie embedded conductive material items in the part to be measured when the part is positioned on the top surface of the plate.Type: ApplicationFiled: September 29, 2008Publication date: April 9, 2009Applicant: Lam Research CorporationInventors: Jaehyun Kim, Arthur H. Sato, Keith Comendant, Qing Liu, Feiyang Wu
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Publication number: 20090091340Abstract: A chamber formed from an electrically conductive material is connected to a ground potential. A hot electrode formed from an electrically conductive material is disposed within the chamber in a substantially horizontal orientation and is physically separated from the chamber. The hot electrode includes a top surface defined to support a part to be measured. A radiofrequency (RF) transmission rod is connected to extend from a bottom surface of the hot electrode through an opening in a bottom of the chamber and be physically separated from the chamber. The RF transmission rod is defined to transmit RF power from a conductor plate in an electrical components housing to the hot electrode. An upper electrode formed from an electrically conductive material is disposed within the chamber in a substantially horizontal orientation. The upper electrode is electrically connected to the chamber and is defined to be movable in a vertical direction.Type: ApplicationFiled: September 29, 2008Publication date: April 9, 2009Applicant: Lam Research CorporationInventors: Jaehyun Kim, Arthur H. Sato, Keith Comendant, Qing Liu, Feiyang Wu
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Publication number: 20090078360Abstract: An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.Type: ApplicationFiled: September 22, 2008Publication date: March 26, 2009Applicant: Lam Research CorporationInventors: Anthony J. Ricci, Keith Comendant, James Tappan
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Patent number: 7501605Abstract: A method of tuning the thermal conductivity of an electrostatic chuck (ESC) support assembly comprises measuring the temperature at a plurality of sites on a support assembly surface in which each site is associated with a given cell, determining from the measurements any fractional reduction in area suggested for each cell, and removing material from the support assembly surface within each cell in accordance with the suggested fractional reduction in order to decrease thermal conductivity in that cell. The material removal can result in an improvement to the equilibrium temperature uniformity of the electrostatic chuck support assembly at the chuck surface of an electrostatic chuck bonded to the support assembly surface, or can result in an equilibrium temperature profile of the ESC support assembly which approaches or achieves a target equilibrium temperature profile.Type: GrantFiled: August 29, 2006Date of Patent: March 10, 2009Assignee: Lam Research CorporationInventors: Robert Steger, Keith Comendant
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Publication number: 20090022205Abstract: Temperature probes for measuring the temperature of objects are disclosed. The temperature probes include a housing and a tip in thermal contact with an end of the housing. The tip is adapted to contact a surface of the object whose temperature is to be measured by the temperature probe. A portion of the housing in contact with the tip has a high thermal resistance effective to thermally isolate the tip from an adjacent portion of the housing. A sensor is located inside of the housing and adapted to measure the temperature of the tip.Type: ApplicationFiled: July 19, 2007Publication date: January 22, 2009Applicant: Lam Research CorporationInventor: Keith Comendant
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Publication number: 20080314508Abstract: A method of protecting a bond layer in a substrate support adapted for use in a plasma processing system. The method includes the steps of attaching an upper member of a substrate support to a lower member of a substrate support with a bonding material. An adhesive is applied to an outer periphery of the upper member and to an upper periphery of the lower member, and a protective ring is positioned around the outer periphery of the upper member and the upper periphery of the lower member. The protective ring is originally fabricated with dimensions that provide mechanical stability and workability. The protective ring is then machined to an exact set of final dimensions consistent with the design of the substrate support application.Type: ApplicationFiled: August 26, 2008Publication date: December 25, 2008Applicant: Lam Research CorporationInventors: Tony Ricci, Jim Tappan, Keith Comendant