Abstract: To provide an inexpensive planar antenna of stable quality which has a circuit with low resistance and in which electrical continuity between the antenna and the electronic part such as IC chip is secured, a planar antenna is made to have a circuit pattern comprised of an antenna part and a connecting terminal part on a resin film, wherein the circuit pattern has a metal layer, a conductive layer provided on the top surface of the connecting terminal part of the metal layer, and a protective layer provided on the top surface of the antenna part of the metal layer and on the section from the side surface to a portion of the top surface of the conductive layer.

Abstract: A semiconductor device comprises: a semiconductor element; a support substrate arranged on a surface of the semiconductor element opposite to a surface thereof provided with a pad, the support substrate being wider in area than the semiconductor element; a burying insulating layer on the support substrate for burying the semiconductor element therein; a fan-out interconnection led out from the pad to an area on the burying insulating layer lying more peripherally outwardly than the semiconductor element; and a reinforcement portion arranged in a preset area on top of outer periphery of the semiconductor element for augmenting the mechanical strength of the burying insulating layer and the fan-out interconnection.

Abstract: A wiring board composite body includes a supporting substrate, and wiring boards formed on each of the upper and the lower surfaces of the supporting substrate. The supporting substrate includes a supporting body, and a metal body arranged on each of the upper and the lower surfaces of the supporting body. The wiring board comprises at least an insulation layer insulating upper and lower wirings, and a via connecting the upper and the lower wirings. The wiring board mounted on the metal body constitutes a wiring board with the metal body. Thus, the supporting body supporting the metal body is effectively used in a process of forming the wiring board on the metal body, and the wiring board composite body, which has advantageous structural and production characteristics, is provided. A semiconductor device and a method for manufacturing such wiring board composite body and the semiconductor device are also provided.

Abstract: Provided is a process for producing a MnZn-base ferrite comprising: firing a compacted raw material to produce the MnZn-base ferrite, wherein the firing comprises, in the following order: a heating phase comprising gradually bringing a firing temperature from room temperature up to a maximum temperature; a maximum temperature holding phase comprising maintaining the maximum temperature for a period of time, wherein a partial pressure of oxygen (p2) at the maximum temperature holding phase is greater than an equilibrium partial pressure of oxygen (p1) as follows: p2>p1, wherein the equilibrium partial pressure of oxygen (p1) is represented by the following equation: log(p1)=log(PO2)=a?b/T, wherein PO2 is measured in a unit of %, and T is measured in a unit of absolute temperature K; and a cooling phase comprising gradually bringing the maximum temperature down to near room temperature, wherein a partial pressure of oxygen (p3) at the cooling phase is operated at an equilibrium partial pressure of oxygen bas

Abstract: A circuit board includes a functional device, a circuit board embedding therein the functional device, and first and second conductive-wiring layers formed on the front and rear surfaces of the circuit board to sandwich therebetween the functional device and each include at least one conductor layer. The surface of each of the outermost patterned interconnections of the first conductive-wiring layer is exposed, and the surface of a first dielectric layer isolating the outermost patterned interconnections from one another protrudes from the surface of the each of the patterned interconnections. The patterned interconnections of the second conductive-wiring layer are connected to respective electrode terminals of the functional device, and the surface of a second dielectric layer isolating the electrode terminals from one another is substrate within the same plane as the surface of the electrode terminals disposed adjacent to the second dielectric layer.

Abstract: A novel NiMnZn-based ferrite which can reduce magnetic loss (core loss) at a high frequency of about 2 MHz or higher and achieve higher saturated magnetic flux density while forming high sintered density is provided. The NiMnZn-based ferrite contains a main component comprising 54.0 to 57.5 mol % of iron oxide in terms of Fe2O3, 2.0 to 7.0 mol % of zinc oxide in terms of ZnO, 0.5 to 4.7 mol % of nickel oxide in terms of NiO, and a remainder of manganese oxide (in terms of MnO); and an accessory component comprising 100 to 1000 ppm by weight of Si in terms of SiO2, 800 to 3000 ppm by weight of Ca in terms of CaCO3, and 520 to 1000 ppm by weight of Nb in terms of Nb2O5 with respect to the main component; while having an average ferrite crystal particle size of 2.1 to 8.5 ?m.

Abstract: A gas sensor including: a gas sensing element including first and second ceramic layers. The first ceramic layer has a first through hole and a first through hole conductor covering an inner surface thereof The first ceramic layer includes a first conductor which includes: a first peripheral conductive portion electrically connected to the first through hole conductor; a first lead portion that is narrower than the first peripheral conductive portion; and a first contact conductive portion that is wider than the first lead portion. The first peripheral conductive portion, the first lead portion and the first contact conductive portion are integrally formed and arranged in this order in a longitudinal direction. The second ceramic layer includes a second conductor electrically connected to at least the first contact conductive portion.

Abstract: A wiring board has an insulating layer, a plurality of wiring layers formed in such a way as to be insulated from each other by the insulating layer, and a plurality of vias formed in the insulating layer to connect the wiring layers. Of the wiring layers, a surface wiring layer formed in one surface of the insulating layer include a first metal film exposed from the one surface and a second metal film embedded in the insulating layer and stacked on the first metal film. Edges of the first metal film project from edges of the second metal film in the direction in which the second metal film spreads. By designing the shape of the wiring layers embedded in the insulating layer in this manner, it is possible to obtain a highly reliable wiring board that can be effectively prevented from side etching in the manufacturing process and can adapt to miniaturization and highly dense packaging of wires.

Abstract: A semiconductor device including a metal frame having a penetrating opening; a semiconductor chip provided in the opening; an insulating layer provided on the upper surface of the metal frame such that the insulating layer covers the upper surface, which is the circuit-formed surface of the semiconductor chip; an interconnect layer provided only on the upper-surface side of the metal frame with intervention of the insulating material and electrically connected to a circuit of the semiconductor chip; a via conductor provided on the upper surface of said semiconductor chip to electrically connect the circuit of the semiconductor chip and the interconnect layer; and a resin layer provided on the lower surface of the metal frame.

Abstract: A planar antenna has a circuit pattern including an antenna part and a connection terminal part on a plastic film, in which the circuit pattern has a metal layer and a heat-sealable conductive layer provided on a surface layer of a connection terminal part of the metal layer. The planar antenna is obtained by forming a circuit pattern including a metal layer on a plastic film, providing a heat-sealable conductive layer in a connection terminal part of the circuit pattern, and then removing an unnecessary part with etching.

Abstract: A gas sensor element for detecting a specific gas component contained in a gas to be measured includes: a solid electrolyte layer; a first electrode disposed on the solid electrolyte layer; a second electrode disposed on the solid electrolyte layer; and a porous layer disposed on one of the first electrode and the second electrode such that the gas to be measured is introduced from the outside of said gas sensor element and passes through the porous layer to at least one of the first electrode and the second electrode. The porous layer includes: a first porous layer including a first ceramic porous body which does not include noble metal particles dispersed therein; and a second porous layer provided on the first porous layer and including a second ceramic porous body and noble metal particles dispersed therein.

Abstract: Semiconductor device has a semiconductor chip embedded in an insulating layer. A semiconductor device comprises a semiconductor chip formed to have external connection pads and a positioning mark that is for via formation; an insulating layer containing a non-photosensitive resin as an ingredient and having a plurality of vias; and wiring electrically connected to the external connection pads through the vias and at least a portion of which is formed on the insulating layer. The insulating layer is formed to have a recess in a portion above the positioning mark. The bottom of the recess is the insulating layer alone. Vias have high positional accuracy relative to the mark.

Abstract: A transparent board is positioned on a support board provided with a positioning mark, and a release material is provided. A semiconductor element is then positioned so that the electrode element faces upward, and the support board is then removed. An insulating resin is then formed on the release material so as to cover the semiconductor element; and a via, a wiring layer, an insulation layer, an external terminal, and a solder resist are then formed. The transparent board is then peeled from the semiconductor device through the use of the release material. A chip can thereby be mounted with high precision, there is no need to provide a positioning mark during mounting of the chip on the substrate in the manufacturing process, and the substrate can easily be removed. As a result, a semiconductor device having high density and a thin profile can be manufactured at low cost.

Abstract: A semiconductor device, in which a semiconductor element is mounted on one side of a circuit board that is made up from an insulating layer and a wiring layer, includes metal posts provided on the side of said circuit board on which said semiconductor element is mounted; and a sealing layer provided on the side of said circuit board on which said semiconductor element is mounted such that said semiconductor element is covered and such that only portions of said metal posts are exposed.

Abstract: Firing is carried out such that for operation of a partial pressure of oxygen and temperature at the high-temperature holding operation phase and cooling operation phase, the following equilibrium relation equation (1) indicative of an equilibrium relation of a partial pressure of oxygen (PO2 in %) to a temperature (T in absolute temperature K) is used to set the values of a and b at given values of a=a* and b=b*, respectively, Log(PO2)=a?b/T ??Eq.

Abstract: A vibrator has massaging balls supported by a treating unit that may be shifted along a subject portion for treatment, guided by guiding members. The treating unit is supported by a supporting structure with respect to the guiding members. A position or orientation altering mechanism is provided for altering the position of the treatment unit in a direction orthogonal to the direction of its shifting or the orientation of the treating unit with respect to the guiding members. The supporting structure may include an engaging unit that engages the guiding members and an arm for supporting the engaging unit.

Abstract: A gas sensor comprising: a gas detecting element extending in an axial direction and including a detecting electrode provided on an outer surface of a leading end side of the gas detecting element, and a lead portion connecting to the detecting electrode and extending toward a rear end side of the gas detecting element; a cylindrical metal shell housing the gas detecting element such that the gas detecting element protrudes from a leading end side of the metal shell; a powder layer filling a gap between the gas detecting element and the metal shell and covering at least a portion of the lead portion; and an insulating layer provided between the powder layer and the lead portion. Also disclosed is a method for manufacturing the gas sensor which includes forming the insulating layer by at least: applying a glass paste; drying the glass paste; and heat-treating the glass paste.

Abstract: This present invention provides an image reading apparatus aiming at improving its operability while saving the cost and an image forming apparatus provided with the same. Sponges for pressing a pressing plate against a platen glass are constituted of nine sponges. Then, restoration forces Fa to Fc generated when sponges on a front side of a document feeding apparatus far from a fulcrum shaft of a hinge unit are crushed are set smaller than restoration forces Fg to Fi generated when sponges on a deep side of the document feeding apparatus near the fulcrum shaft 45 of the hinge unit are crushed.

Abstract: This present invention provides an image reading apparatus aiming at improving its operability while saving the cost and an image forming apparatus provided with the same. Sponges for pressing a pressing plate against a platen glass are constituted of nine sponges. Then, restoration forces Fa to Fc generated when sponges on a front side of a document feeding apparatus far from a fulcrum shaft of a hinge unit are crushed are set smaller than restoration forces Fg to Fi generated when sponges on a deep side of the document feeding apparatus near the fulcrum shaft 45 of the hinge unit are crushed.

Abstract: A vibrator has massaging balls supported by a treating unit that may be shifted along a subject portion for treatment, guided by guiding members. The treating unit is supported by a supporting structure with respect to the guiding members. A position or orientation altering mechanism is provided for altering the position of the treatment unit in a direction orthogonal to the direction of its shifting or the orientation of the treating unit with respect to the guiding members. The supporting structure may include an engaging unit that engages the guiding members and an arm for supporting the engaging unit.