Patents by Inventor Kevin G. Duesman
Kevin G. Duesman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11848323Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to both the first and second contact pads. The semiconductor device assembly can further include a second die including a third contact pad electrically coupled to a third circuit on the second die including at least a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad and electrically disconnected from the fourth contact pad.Type: GrantFiled: February 18, 2021Date of Patent: December 19, 2023Assignee: Micron Technology, Inc.Inventors: James E. Davis, John B. Pusey, Zhiping Yin, Kevin G. Duesman
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Patent number: 11508657Abstract: Semiconductor devices having inductive structures, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor device includes a substrate and at least one circuit component coupled to the substrate. The semiconductor device can further include an inductive structure carried by the substrate and having a stack of alternating first and second layers. In some embodiments, the first layers comprise an oxide material and the second layers each include a coil of conductive material. The coils of conductive material can be electrically coupled (a) together to form an inductor and (b) to the at least one circuit component.Type: GrantFiled: August 11, 2020Date of Patent: November 22, 2022Assignee: Micron Technology, Inc.Inventors: James E. Davis, Kevin G. Duesman
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Patent number: 11056467Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate, the die including a first contact pad electrically coupled to a first circuit on the die including an active circuit element, a first TSV electrically coupling the first contact pad to a first backside contact pad, and a second contact pad electrically coupled to a second circuit including only passive circuit elements. The substrate includes a substrate contact electrically coupled to the first and second contact pads. The assembly can further include a second die including a third contact pad electrically coupled to a third circuit including a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad, but electrically disconnected from the fourth contact pad.Type: GrantFiled: October 2, 2019Date of Patent: July 6, 2021Assignee: Micron Technology, Inc.Inventors: Kevin G. Duesman, James E. Davis, Warren L. Boyer
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Publication number: 20210175228Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to both the first and second contact pads. The semiconductor device assembly can further include a second die including a third contact pad electrically coupled to a third circuit on the second die including at least a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad and electrically disconnected from the fourth contact pad.Type: ApplicationFiled: February 18, 2021Publication date: June 10, 2021Inventors: James E. Davis, John B. Pusey, Zhiping Yin, Kevin G. Duesman
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Patent number: 10930645Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to both the first and second contact pads. The semiconductor device assembly can further include a second die including a third contact pad electrically coupled to a third circuit on the second die including at least a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad and electrically disconnected from the fourth contact pad.Type: GrantFiled: January 15, 2020Date of Patent: February 23, 2021Assignee: Micron Technology, Inc.Inventors: James E. Davis, John B. Pusey, Zhiping Yin, Kevin G. Duesman
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Patent number: 10867991Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to the first contact pad, and the substrate is electrically isolated from the second contact pad.Type: GrantFiled: December 27, 2018Date of Patent: December 15, 2020Assignee: Micron Technology, Inc.Inventors: Kevin G. Duesman, James E. Davis, Warren L. Boyer, Jeffrey P. Wright
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Publication number: 20200373238Abstract: Semiconductor devices having inductive structures, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor device includes a substrate and at least one circuit component coupled to the substrate. The semiconductor device can further include an inductive structure carried by the substrate and having a stack of alternating first and second layers. In some embodiments, the first layers comprise an oxide material and the second layers each include a coil of conductive material. The coils of conductive material can be electrically coupled (a) together to form an inductor and (b) to the at least one circuit component.Type: ApplicationFiled: August 11, 2020Publication date: November 26, 2020Inventors: James E. Davis, Kevin G. Duesman
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Patent number: 10811372Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements, and a plated pad electrically coupling at least a part of the first contact pad to at least a part of the second contact pad. The substrate includes a substrate contact electrically coupled to the plated pad on the die.Type: GrantFiled: May 18, 2019Date of Patent: October 20, 2020Assignee: Micron Technology, Inc.Inventors: James E. Davis, Kevin G. Duesman, Jeffrey P. Wright, Warren L. Boyer
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Patent number: 10784192Abstract: Semiconductor devices having inductive structures, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor device includes a substrate and at least one circuit component coupled to the substrate. The semiconductor device can further include an inductive structure carried by the substrate and having a stack of alternating first and second layers. In some embodiments, the first layers comprise an oxide material and the second layers each include a coil of conductive material. The coils of conductive material can be electrically coupled (a) together to form an inductor and (b) to the at least one circuit component.Type: GrantFiled: November 7, 2018Date of Patent: September 22, 2020Assignee: Micron Technology, Inc.Inventors: James E. Davis, Kevin G. Duesman
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Publication number: 20200212032Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to the first contact pad, and the substrate is electrically isolated from the second contact pad.Type: ApplicationFiled: December 27, 2018Publication date: July 2, 2020Inventors: Kevin G. Duesman, James E. Davis, Warren L. Boyer, Jeffrey P. Wright
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Publication number: 20200152620Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to both the first and second contact pads. The semiconductor device assembly can further include a second die including a third contact pad electrically coupled to a third circuit on the second die including at least a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad and electrically disconnected from the fourth contact pad.Type: ApplicationFiled: January 15, 2020Publication date: May 14, 2020Inventors: James E. Davis, John B. Pusey, Zhiping Yin, Kevin G. Duesman
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Publication number: 20200144182Abstract: Semiconductor devices having inductive structures, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor device includes a substrate and at least one circuit component coupled to the substrate. The semiconductor device can further include an inductive structure carried by the substrate and having a stack of alternating first and second layers. In some embodiments, the first layers comprise an oxide material and the second layers each include a coil of conductive material. The coils of conductive material can be electrically coupled (a) together to form an inductor and (b) to the at least one circuit component.Type: ApplicationFiled: November 7, 2018Publication date: May 7, 2020Inventors: James E. Davis, Kevin G. Duesman
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Patent number: 10580767Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to both the first and second contact pads. The semiconductor device assembly can further include a second die including a third contact pad electrically coupled to a third circuit on the second die including at least a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad and electrically disconnected from the fourth contact pad.Type: GrantFiled: November 27, 2018Date of Patent: March 3, 2020Assignee: Micron Technology, Inc.Inventors: James E. Davis, John B. Pusey, Zhiping Yin, Kevin G. Duesman
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Publication number: 20200035650Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate, the die including a first contact pad electrically coupled to a first circuit on the die including an active circuit element, a first TSV electrically coupling the first contact pad to a first backside contact pad, and a second contact pad electrically coupled to a second circuit including only passive circuit elements. The substrate includes a substrate contact electrically coupled to the first and second contact pads. The assembly can further include a second die including a third contact pad electrically coupled to a third circuit including a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad, but electrically disconnected from the fourth contact pad.Type: ApplicationFiled: October 2, 2019Publication date: January 30, 2020Inventors: Kevin G. Duesman, James E. Davis, Warren L. Boyer
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Patent number: 10483241Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate, the die including a first contact pad electrically coupled to a first circuit on the die including an active circuit element, a first TSV electrically coupling the first contact pad to a first backside contact pad, and a second contact pad electrically coupled to a second circuit including only passive circuit elements. The substrate includes a substrate contact electrically coupled to the first and second contact pads. The assembly can further include a second die including a third contact pad electrically coupled to a third circuit including a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad, but electrically disconnected from the fourth contact pad.Type: GrantFiled: June 27, 2018Date of Patent: November 19, 2019Assignee: Micron Technology, Inc.Inventors: Kevin G. Duesman, James E. Davis, Warren L. Boyer
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Patent number: 10453829Abstract: In one embodiment, an apparatus comprises a tier comprising alternating first and second layers, wherein the first layers comprise a first conductive material and the second layers comprise a first dielectric material; a lower metal layer below the tier; a bond pad above the tier, the bond pad coupled to the lower metal layer by a via extending through the tier; and a first channel formed through a portion of the tier, the first channel surrounding the via, the first channel comprising a second dielectric material.Type: GrantFiled: June 16, 2017Date of Patent: October 22, 2019Assignee: Intel CorporationInventors: Merri Lyn Carlson, Hongbin Zhu, Gordon A. Haller, James E. Davis, Kevin G. Duesman, James Mathew, Michael P. Violette
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Publication number: 20190273052Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements, and a plated pad electrically coupling at least a part of the first contact pad to at least a part of the second contact pad. The substrate includes a substrate contact electrically coupled to the plated pad on the die.Type: ApplicationFiled: May 18, 2019Publication date: September 5, 2019Inventors: James E. Davis, Kevin G. Duesman, Jeffrey P. Wright, Warren L. Boyer
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Patent number: 10403585Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements, and a plated pad electrically coupling at least a part of the first contact pad to at least a part of the second contact pad. The substrate includes a substrate contact electrically coupled to the plated pad on the die.Type: GrantFiled: September 21, 2018Date of Patent: September 3, 2019Assignee: Micron Technology, Inc.Inventors: James E. Davis, Kevin G. Duesman, Jeffrey P. Wright, Warren L. Boyer
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Patent number: 10312232Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to both the first and second contact pads. The semiconductor device assembly can further include a second die including a third contact pad electrically coupled to a third circuit on the second die including at least a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad and electrically disconnected from the fourth contact pad.Type: GrantFiled: June 13, 2018Date of Patent: June 4, 2019Assignee: Micron Technology, Inc.Inventors: James E. Davis, John B. Pusey, Zhiping Yin, Kevin G. Duesman
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Publication number: 20190148358Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to both the first and second contact pads. The semiconductor device assembly can further include a second die including a third contact pad electrically coupled to a third circuit on the second die including at least a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad and electrically disconnected from the fourth contact pad.Type: ApplicationFiled: June 13, 2018Publication date: May 16, 2019Inventors: James E. Davis, John B. Pusey, Zhiping Yin, Kevin G. Duesman