Abstract: A flash memory device performs a program operation using an incremental step pulse programming (ISPP) scheme comprising a plurality of program loops. In each of the program loops, a program pulse operation is performed to increase the threshold voltages of selected memory cells, and a program verify operation is performed to verify a program status of the selected memory cells. The program verify operation can be selectively skipped in some program loops based on a voltage increment of one or more of the program pulse operations, an amount by which threshold voltages of the selected memory cells are to be increased in the ISPP scheme, or a total number of program loops of the ISPP scheme.

Abstract: An erasing method in a nonvolatile memory device is disclosed. The method includes post-programming dummy memory cells; verifying whether threshold voltages of the dummy memory cells are greater than or equal to a first voltage; post-programming normal memory cells; and verifying whether threshold voltages of the normal memory cells are greater than or equal to a second voltage. The first voltage is different from the second voltage, and the post-programming of the dummy memory cells comprises: applying a program voltage to a plurality of dummy word lines coupled to the dummy memory cells to post-program the dummy memory cells; and applying a pass voltage to a plurality of normal word lines coupled to the normal memory cells so that the normal memory cells are not post-programmed.

Abstract: A nonvolatile memory device comprises a memory core and a controller for controlling the wear level of a memory block in the nonvolatile memory device. The controller determines the wear level of a memory block by obtaining data of an actual wear level from a charge measurement cell of a selected region of the memory cell, and stores the wear level of the selected region in an erase count table.

Abstract: A method of programming a nonvolatile memory device comprises applying a gradually increasing program voltage to a memory cell, determining the number of verify voltages to be applied to the memory cell during a program loop based on the change of a threshold voltage from an initial state of the memory cell to a target state, and applying at least one of the determined verify voltages to the memory cell to verify whether the memory cell is programmed to the target state.

Abstract: A flash memory device includes first and second memory cell array blocks and a row decoder coupled to the first memory cell array block and the second memory cell array block. The row decoder includes a block decoder, a single high voltage level shifter that is coupled to both the first and second memory cell array blocks, the single high voltage level shifter configured to provide a block wordline signal of a high voltage to the first and second memory array blocks in response to a block selection signal received from the block decoder, a first pass transistor unit, and a second pass transistor unit.

Abstract: Disclosed is a 3D memory device including a first plane having a first mat formed on a first layer and a third mat formed on a second layer disposed over the first layer, the first and third mats sharing a bit line, and a second plane having a second mat formed on the first layer and a fourth mat formed on the second layer. The second and fourth mats share a bit line. Each one of the first through fourth mats includes a plurality of blocks and a block associated with the first plane is simultaneously accessed with a block of the second plane.

Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a wiring pattern and a metal plating layer formed on a base film comprises a transfer area including a row of sprocket holes arranged along the edges of the base film at predetermined intervals, and wherein the transfer area includes an exposure area from which the base film is exposed, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.

Abstract: A non-volatile memory device includes a memory cell array from which data is read via a plurality of bitlines, which includes a plurality of memory cells having gates respectively connected with a plurality of wordlines, a first type global wordline decoder configured to selectively apply n different voltages, where n is an integer greater than or equal to 3, to a corresponding wordline of the plurality of wordlines in a program mode, and a second type global wordline decoder configured to selectively apply (n?1) different voltages to a corresponding wordline of the plurality of wordlines in the program mode, the second type global wordline decoder having fewer switching elements than the first type global wordline decoder.

Abstract: A NAND flash memory device includes a control circuit configured to apply, during a program operation, a first word line voltage to non-selected ones of a plurality of serially-connected memory cells, a second word line voltage greater than the first word line voltage to a selected one of the plurality of memory cells, and a third word line voltage lower than the first word line voltage to a dummy memory cell connected in series with the plurality of memory cells. In other embodiments, a control circuit is configured to program a dummy memory cell before and/or after each erase operation on a plurality of memory cells connected in series therewith. In still other embodiments, a control circuit is configured to forego erasure of a dummy memory cell while erasing a plurality of memory cells connected in series therewith.

Abstract: A programming method and a three-dimensional memory device are disclosed. The three-dimensional memory device includes a stacked plurality of layers, each layer having a memory array, and each memory array having a string of memory cells. The programming method includes, for each unselected string associated with an unselected layer in the plurality of layers, charging the channel of memory cells associated with unselected string with a shut-off voltage, and thereafter programming a selected string associated with a selected layer in the plurality of layers.

Abstract: A dome sheet structure of a mobile communication terminal may include: a metal dome covering a contact point printed on a printed circuit board; and a light guide film disposed on the metal dome. The light guide film may be bonded with the metal dome in a bonding area, and the bonding area may be an area between two concentric circles having different diameters and centered at a center of the metal dome.

Abstract: A semiconductor memory device includes a plurality of memory chips each including a chip identification (ID) generation circuit.

Abstract: A nonvolatile memory device includes a memory cell array having multiple memory cells arranged at intersections of word lines and bit lines, a first page region configured with at least two adjacent memory cells coupled to a word line, and a second page region configured with at least two adjacent memory cells coupled to the word line. The nonvolatile memory devices also includes a first common source line connecting with the memory cells of the first page region, and a second common source line connecting with the memory cells of the second page region. The first and second common source lines are controlled independently.

Abstract: A semiconductor device including a plurality of semiconductor chips is provided. A semiconductor device includes a storing unit in which redundancy information portions are stored, and a comparing unit comparing a current address to the redundancy information portions and enabling or disabling operation of a semiconductor device based on the comparison result.

Abstract: Non-volatile memory devices and methods of programming the non-volatile memory devices use six threshold voltage levels. Data also may be read from the non-volatile memory devices. The non-volatile memory devices include a first non-volatile memory cell and a second non-volatile memory cell, each of which can be programmed with first through sixth threshold voltage levels that sequentially increase. Programming includes first, second and third data bit program operations. In the first and second data bit program operation, the first and second non-volatile memory cells are programmed with the first or second threshold voltage level in order to store first and second bits of data. In the third data bit program operation, the first non-volatile memory cell is programmed with the third or fourth threshold voltage level according to the first and second bits of the data in order to store a third bit of the data. Fourth and fifth data bit program operations also may be provided.

Abstract: A flash memory device comprises memory cells connected between a bit line and a common source line, word lines connected to the memory cells, a common source line feedback circuit connected to a common source line (CSL) to detect the voltage level of the common source line, and a CSL feedback control logic configured to control a voltage level of a selected word line or a selected bit line to be compensated to a substantially constant value during a sensing operation of the memory cells based on the detected voltage level of the CSL.

Abstract: A NAND flash memory device includes a control circuit configured to apply, during a program operation, a first word line voltage to non-selected ones of a plurality of serially-connected memory cells, a second word line voltage greater than the first word line voltage to a selected one of the plurality of memory cells, and a third word line voltage lower than the first word line voltage to a dummy memory cell connected in series with the plurality of memory cells. In other embodiments, a control circuit is configured to program a dummy memory cell before and/or after each erase operation on a plurality of memory cells connected in series therewith. In still other embodiments, a control circuit is configured to forego erasure of a dummy memory cell while erasing a plurality of memory cells connected in series therewith.

Abstract: Methods of operating non-volatile memory devices can compensate for threshold voltage disturbances caused by overhead data programming during block erase operations. These methods include erasing a spare array of nonvolatile memory cells and a corresponding main array of nonvolatile memory cells that shares word lines with the spare array. This erasing operation is followed by writing updated overhead data (e.g., an erase count) into the spare array and then performing a soft program operation. This soft program operation is performed on at least a first portion of the main array to thereby narrow a threshold voltage distribution of erased memory cells within the first portion of the main array. The soft program operation is then followed by an operation to verify an erased status of at least the first portion of the main array and an operation to communicate that the main and spare arrays of nonvolatile memory cells have been properly erased to a memory controller.

Abstract: Flash memory devices are provided including a plurality of layers stacked vertically. Each of the plurality of layers include a plurality of memory cells. A row decoder is electrically coupled to the plurality of layers and configured to supply a wordline voltage to the plurality of layers. Memory cells provided in at least two layers of the plurality of layers belong to a same memory block and wordlines associated with the memory cells in the at least two layers of the plurality of layers are electrically coupled.

Abstract: A high integration memory array architecture of the present invention includes a memory cell array including memory cells arranged in a predetermined configuration, and selection transistors having different threshold voltages so as to select a memory string of the memory cell array. By applying a proper bias voltage to the selection transistors, specific memory strings can be selected, so that operations for the memory array can be performed without intervening with adjacent memory cells.