Patents by Inventor Koichi Yoshida

Koichi Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9925637
    Abstract: The porous polyurethane polishing pad includes a porous polyurethane matrix having large pores extending upward from a base surface and open to a polishing surface. A series of pillow structures is formed from the porous matrix that include the large pores and the small pores. The pillow structures have a downward surface extending from the top polishing surface for forming downwardly sloped side walls at an angle from 30 to 60 degrees from the polishing surface. The large pores open to the downwardly sloped sidewalls and are less vertical than the large pores. The large pores are offset 10 to 60 degrees from the vertical direction in a direction more orthogonal to the sloped sidewalls.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: March 27, 2018
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Koichi Yoshida, Kazutaka Miyamoto, Katsumasa Kawabata, Henry Sanford-Crane, Hui Bin Huang, George C. Jacob, Shuiyuan Luo
  • Publication number: 20180073936
    Abstract: A temperature sensor includes a temperature detector, an element electrode wire, a lead wire, and an intermediate member. Each of the lead wire and the intermediate member is made of a Ni-based alloy or an Fe-based alloy. The element electrode wire and the intermediate member are welded together in such a manner that opposing surfaces, facing each other abut against each other to constitute an element-side weld. The intermediate member and the lead wire are welded together such that they overlap each other in a longitudinal direction Z to constitute a lead-side weld. The lead wire is extended closer to the temperature detector than the element-side weld is located. A gap between the element electrode wire and the lead wire at least in the longitudinal direction Z is filled with a filler. The element electrode wire, the element-side weld, and the lead wire are fixed to one another by the filler.
    Type: Application
    Filed: April 1, 2016
    Publication date: March 15, 2018
    Inventors: Toshiya OZEKI, Koichi YOSHIDA, Motoki SATO, Masaki HIRONAKA
  • Publication number: 20180037706
    Abstract: The porous polyurethane polishing pad includes a porous matrix having large pores that extend upward from a base surface and open to an upper surface. The large pores are interconnected with small pores. The porous matrix is a blend of two thermoplastic polymers. The first thermoplastic polyurethane has by molecular percent, 45 to 60 adipic acid, 10 to 30 MDI-ethylene glycol and 15 to 35 MDI and an Mn of 40,000 to 60,000 and a Mw of 125,000 to 175,000 and an Mw to Mn ratio of 2.5 to 4 The second thermoplastic polyurethane has by molecular percent, 40 to 50 adipic acid, 20 to 40 adipic acid butane diol, 5 to 20 MDI-ethylene glycol and 5 to 25 MDI and an Mn of 60,000 to 80,000 and a Mw of 125,000 to 175,000 and an Mw to Mn ratio of 1.5 to 3.
    Type: Application
    Filed: August 4, 2016
    Publication date: February 8, 2018
    Inventors: Shuiyuan Luo, George C. Jacob, Henry Sanford-Crane, Koichi Yoshida, Katsumasa Kawabata, Shusuke Kitawaki, Shogo Takahashi, Yosuke Takei
  • Publication number: 20180036860
    Abstract: The method forms a porous polyurethane polishing pad by coagulating thermoplastic polyurethane to create a porous matrix having large pores extending upward from a base surface and open to an upper surface. The large pores are interconnected with small pores. Heating a press to temperature below or above the softening onset temperature of the thermoplastic polyurethane forms a series of pillows. Plastic deforming side walls of the pillow structures forms downwardly sloped side walls. The downwardly sloped side walls extend from all sides of the pillow structures. The large pores open to the downwardly sloped sidewalls are less vertical than the large pores open to the top polishing surface and are offset 10 to 60 degrees from the vertical direction.
    Type: Application
    Filed: August 4, 2016
    Publication date: February 8, 2018
    Inventors: Koichi Yoshida, Kazutaka Miyamoto, Katsumasa Kawabata, Henry Sanford-Crane, Hui Bin Huang, George C. Jacob, Shuiyuan Luo
  • Publication number: 20180036862
    Abstract: The porous polyurethane polishing pad includes a porous polyurethane matrix having large pores extending upward from a base surface and open to a polishing surface. A series of pillow structures is formed from the porous matrix that include the large pores and the small pores. The pillow structures have a downward surface extending from the top polishing surface for forming downwardly sloped side walls at an angle from 30 to 60 degrees from the polishing surface. The large pores open to the downwardly sloped sidewalls and are less vertical than the large pores. The large pores are offset 10 to 60 degrees from the vertical direction in a direction more orthogonal to the sloped sidewalls.
    Type: Application
    Filed: August 4, 2016
    Publication date: February 8, 2018
    Inventors: Koichi Yoshida, Kazutaka Miyamoto, Katsumasa Kawabata, Henry Sanford-Crane, Hui Bin Huang, George C. Jacob, Shuiyuan Luo
  • Patent number: 9829405
    Abstract: A microelectromechanical pressure sensor structure that comprises a planar base, a side wall layer and a diaphragm plate. The side wall layer forms side walls that extend away from the planar base into contact with the diaphragm plate. The side wall layer is formed of at least three layers, a first layer and a second layer of insulating material and a third layer of conductive material, wherein the third layer is between the first layer and the second layer. The conducting layer provides a shield electrode within the isolating side wall layer. This shield electrode is adapted to reduce undesired effects to the capacitive measurement results.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: November 28, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Heikki Kuisma, Koichi Yoshida
  • Publication number: 20170117650
    Abstract: To provide a surface protective agent composition that suppresses corrosion of members of different kinds of metals close to each other due to corrosion current between the metals of the members, and to provide an electric connection structure and a method for producing an electric connection structure using the same. The surface protective agent composition contains (a) a lubricant base oil; (b) a prescribed amount of at least one compound selected from the group consisting of particular phosphorus compounds and a metal salt or an amine salt thereof; and (c) a prescribed amount of an amide compound, and in the case where the component (b) does not contain the metal salt of the phosphorus compound, the surface protective agent composition further contains (d) a prescribed amount of a salicylate of a particular metal and/or a basic (or perbasic) salt thereof, and the electric connection structure containing a surface protective layer consisting of the surface protective agent composition.
    Type: Application
    Filed: March 24, 2015
    Publication date: April 27, 2017
    Applicants: JX Nippon Oil & Energy Corporation, Sumitomo Electric Industries, Ltd., Sumitomo Wiring Systems, Ltd., Autonetworks Technologies, Ltd., Kyushu University, National University Corporation
    Inventors: Koichi Yoshida, Takashi Arai, Yuji Shitara, Kenichi Komiya, Makoto Mizoguchi, Hideki Nomura, Takuji Otsuka, Junichi Ono, Hiroki Hirai, Kazuo Nakashima, Tatsuya Hase, Takehiro Hosokawa, Kazuhiro Goto
  • Patent number: 9633831
    Abstract: A method of polishing a sapphire substrate is provided, comprising: providing a substrate having an exposed sapphire surface; providing a chemical mechanical polishing slurry, wherein the chemical mechanical polishing slurry comprises, as initial components: colloidal silica abrasive, wherein the colloidal silica abrasive has a negative surface charge; and, wherein the colloidal silica abrasive exhibits a multimodal particle size distribution with a first particle size maximum between 2 and 25 nm; and, a second particle size maximum between 75 and 200 nm; optionally, a biocide; optionally, a nonionic defoaming agent; and, optionally, a pH adjuster. A chemical mechanical polishing composition for polishing an exposed sapphire surface is also provided.
    Type: Grant
    Filed: August 26, 2013
    Date of Patent: April 25, 2017
    Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Nitta Haas Incorporated
    Inventors: Allen S. Bulick, Hideaki Nishizawa, Kazuki Moriyama, Koichi Yoshida, Shunji Ezawa, Selvanathan Arumugam
  • Patent number: 9627145
    Abstract: An electrolytic capacitor according to the present invention employs a capacitor element wherein an anode foil having an anode internal terminal and a cathode foil having a cathode internal terminal are wound or laminated through a separator. The end of the anode foil faces with the cathode foil through the separator and the surface area of the cathode internal terminal is provided with an enlargement treatment, whereby the small area portion of the cathode foil that faces with the anode foil is eliminated, and the charge/discharge characteristics are thus improved.
    Type: Grant
    Filed: July 22, 2013
    Date of Patent: April 18, 2017
    Assignee: NIPPON CHEMI-CON CORPORATION
    Inventors: Fusayoshi Endoh, Kentaro Nakaaki, Masashi Ozawa, Koichi Yoshida, Osamu Nakamura
  • Publication number: 20160378892
    Abstract: Methods and apparatus provide for, at each of plural calculation timings, associating pieces of position information indicating the positions of objects in a virtual space at the calculation timing with leaves and creates a complete binary tree in which position information reflecting pieces of the position information of child nodes is associated with an internal node, and a node shuffling section that shuffles 2·2n (n?1) child nodes regarding each group of 2n nodes on the basis of the position information associated with each of the 2·2n child nodes belonging to the 2n nodes in each layer sequentially from the immediately-upper layer of the lowermost layer in the complete binary tree; and carrying out collision determination between objects by using the complete binary tree resulting from the shuffling by the node shuffling section.
    Type: Application
    Filed: April 25, 2014
    Publication date: December 29, 2016
    Applicant: Sony Interactive Entertainment Inc.
    Inventors: Hitoshi Ishikawa, Hiroshi Matsuike, Koichi Yoshida
  • Publication number: 20150361272
    Abstract: The rust preventive oil composition of the present invention comprises a base oil comprising a mineral oil and a naphthenic acid salt, with the base oil content of 50 mass % or more based on the total amount of the rust preventive oil composition. According to the present invention, a rust preventive oil composition capable of suppressing the generation of rust for a long period can be provided, having both of a water removal property and a finger print removal property.
    Type: Application
    Filed: January 30, 2014
    Publication date: December 17, 2015
    Applicant: JX NIPPON OIL & ENERGY CORPORATION
    Inventors: Koichi YOSHIDA, Tadaaki MOTOYAMA, Junichi SHIBATA
  • Patent number: 9212426
    Abstract: A rust preventive oil composition containing a first mineral oil that is a mineral oil having a kinematic viscosity at 40° C. of 6 mm2/s or less, a second mineral oil that is a mineral oil having a kinematic viscosity at 40° C. of 250 mm2/s or more, a fatty acid amine salt, an ester, and one or more rust preventive agents selected from the group consisting of a sarcosine-type compound, a nonionic surfactant, a sulfonic acid salt, an amine, a carboxylic acid, a fatty acid amine salt, a carboxylic acid salt, a paraffin wax, an oxidized wax salt, and a boron compound.
    Type: Grant
    Filed: October 29, 2012
    Date of Patent: December 15, 2015
    Assignee: JX NIPPON OIL & ENERGY CORPORATION
    Inventors: Junichi Shibata, Koichi Yoshida, Tadaaki Motoyama
  • Patent number: 9150759
    Abstract: A chemical mechanical polishing composition for polishing silicon wafers is provided, containing: water, optionally, an abrasive; a cation according to formula (I); piperazine or a piperazine derivative according to formula (II); and, a quaternary ammonium compound; wherein the chemical mechanical polishing composition exhibits a pH of 9 to 12. Also provided are methods of making and using the chemical mechanical polishing composition.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: October 6, 2015
    Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc, Nitta Haas Incorporated
    Inventors: Yasuyuki Itai, Naresh Kumar Penta, Naoko Kawai, Hiroyuki Nakano, Shinichi Haba, Yoshiharu Ota, Takayuki Matsushita, Masashi Teramoto, Sakiko Nakashima, Tomoyuki Toda, Koichi Yoshida, Lee Melbourne Cook
  • Publication number: 20150204744
    Abstract: A microelectromechanical pressure sensor structure that comprises a planar base, a side wall layer and a diaphragm plate. The side wall layer forms side walls that extend away from the planar base into contact with the diaphragm plate. The side wall layer is formed of at least three layers, a first layer and a second layer of insulating material and a third layer of conductive material, wherein the third layer is between the first layer and the second layer. The conducting layer provides a shield electrode within the isolating side wall layer. This shield electrode is adapted to reduce undesired effects to the capacitive measurement results.
    Type: Application
    Filed: January 20, 2015
    Publication date: July 23, 2015
    Inventors: Heikki KUISMA, Koichi YOSHIDA
  • Publication number: 20150169804
    Abstract: Disclosed herein is a simulation apparatus which simulates a position of each of plural objects, which move in a virtual space together with time, at each of plural time points of calculation. The apparatus includes: an object pair information acquisition unit acquiring plural pieces of information of object pairs each including, as components thereof, two objects which contact with each other at each of the plural time points of calculation; an allocation unit allocating, at each of the plural time points of calculation, each of the plural object pairs to one of plural groups such that two or more object pairs which include a common object do not belong to the same group; and a calculation unit calculating, at each of the plural time points of calculation, an influence of contact of two objects included in each of the plural object pairs upon positions of the two objects.
    Type: Application
    Filed: December 9, 2014
    Publication date: June 18, 2015
    Inventors: Hitoshi Ishikawa, Hiroshi Matsuike, Koichi Yoshida
  • Publication number: 20150169803
    Abstract: A simulation apparatus which simulates a position of each of a plurality of objects, which move in a virtual space together with time, at each of a plural calculation time is disclosed. The apparatus includes: an object connection block for applying, to each object of each three or more objects contacting with each other at each of the plural calculation time points, a pointer value indicative of a contact destination object with which the object is in contact determining one of the three or more objects as a terminal end to connect the objects; and a pointer value updating block for repeating a pointer value updating process, by which the pointer value of each object is updated to the pointer value of the contact destination object indicated by the pointer value until the pointer values of all of the objects come to indicate the object of the terminal end.
    Type: Application
    Filed: December 9, 2014
    Publication date: June 18, 2015
    Inventors: Hitoshi Ishikawa, Hiroshi Matsuike, Koichi Yoshida
  • Publication number: 20150096463
    Abstract: A rust preventive oil composition containing a first mineral oil that is a mineral oil having a kinematic viscosity at 40° C. of 6 mm2/s or less, a second mineral oil that is a mineral oil having a kinematic viscosity at 40° C. of 250 mm2/s or more, a fatty acid amine salt, an ester, and one or more rust preventive agents selected from the group consisting of a sarcosine-type compound, a nonionic surfactant, a sulfonic acid salt, an amine, a carboxylic acid, a fatty acid amine salt, a carboxylic acid salt, a paraffin wax, an oxidized wax salt, and a boron compound.
    Type: Application
    Filed: October 29, 2012
    Publication date: April 9, 2015
    Applicant: JX NIPPON OIL & ENERGY CORPORATION
    Inventors: Junichi Shibata, Koichi Yoshida, Tadaaki Motoyama
  • Publication number: 20150093900
    Abstract: A chemical mechanical polishing composition for polishing silicon wafers is provided, containing: water, optionally, an abrasive; a cation according to formula (I); piperazine or a piperazine derivative according to formula (II); and, a quaternary ammonium compound; wherein the chemical mechanical polishing composition exhibits a pH of 9 to 12. Also provided are methods of making and using the chemical mechanical polishing composition.
    Type: Application
    Filed: September 27, 2013
    Publication date: April 2, 2015
    Inventors: Yasuyuki Itai, Naresh Kumar Penta, Naoko Kawai, Hiroyuki Nakano, Shinichi Haba, Yoshiharu Ota, Takayuki Matsushita, Masashi Teramoto, Sakiko Nakashima, Tomoyuki Toda, Koichi Yoshida, Lee Melbourne Cook
  • Patent number: 8980749
    Abstract: A method for polishing a silicon wafer is provided, comprising: providing a silicon wafer; providing a polishing pad having a polishing layer which is the reaction product of raw material ingredients, including: a polyfunctional isocyanate; and, a curative package; wherein the curative package contains an amine initiated polyol curative and a high molecular weight polyol curative; wherein the polishing layer exhibits a density of greater than 0.4 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 ?m/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the silicon wafer; and, creating dynamic contact between the polishing surface and the silicon wafer.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: March 17, 2015
    Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Nitta Haas Incorporated
    Inventors: Yasuyuki Itai, Bainian Qian, Hiroyuki Nakano, David B. James, Naoko Kawai, Katsumasa Kawabata, Koichi Yoshida, Kazutaka Miyamoto, James Murnane, Fengji Yeh, Marty W. DeGroot
  • Publication number: 20150053642
    Abstract: A method of polishing a sapphire substrate is provided, comprising: providing a substrate having an exposed sapphire surface; providing a chemical mechanical polishing slurry, wherein the chemical mechanical polishing slurry comprises, as initial components: colloidal silica abrasive, wherein the colloidal silica abrasive has a negative surface charge; and, wherein the colloidal silica abrasive exhibits a multimodal particle size distribution with a first particle size maximum between 2 and 25 nm; and, a second particle size maximum between 75 and 200 nm; optionally, a biocide; optionally, a nonionic defoaming agent; and, optionally, a pH adjuster. A chemical mechanical polishing composition for polishing an exposed sapphire surface is also provided.
    Type: Application
    Filed: August 26, 2013
    Publication date: February 26, 2015
    Applicant: NITTA HAAS INCORPORATED
    Inventors: Allen S. Bulick, Hideaki Nishizawa, Kazuki Moriyama, Koichi Yoshida, Shunji Ezawa, Selvanathan Arumugam