Patents by Inventor Koichi Yoshida

Koichi Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030087862
    Abstract: Clarification of the relationship between the functions of E1AF gene and the invasion and metastasis of cancers, and application thereof to cancer control, more specifically the control of cancer cell invasion by controlling the expression of E1AF gene and the products of expression, and the detection and diagnosis of cancers by detecting the products of expression of E1aF gene.
    Type: Application
    Filed: June 13, 2002
    Publication date: May 8, 2003
    Applicant: Takara Shuzo Co., Ltd.
    Inventors: Kei Fujinaga, Koichi Yoshida, Fumihiro Higashino
  • Patent number: 6528310
    Abstract: Clarification of the relationship between the functions of E1AF gene and the invasion and metastasis of cancers, and application thereof to cancer control, more specifically the control of cancer cell invasion by controlling the expression of E1AF gene and the products of expression, and the detection and diagnosis of cancers by detecting the products of expression of E1aF gene.
    Type: Grant
    Filed: June 23, 2000
    Date of Patent: March 4, 2003
    Assignee: Takara Shuzo Co., Ltd.
    Inventors: Kei Fujinaga, Koichi Yoshida, Fumihiro Higashino
  • Patent number: 6519258
    Abstract: A temporarily saved band value management table for managing temporarily saved band value is provided, as is a band management table for managing empty band value in the storage device of an ATM exchange comprising a storage device, a control device, and the like. The control device selects a corresponding empty band value for a temporarily saved band value when a first camp-on request is received from a terminal, and sets the empty band value to “0.” In addition, the control device adds to the temporarily saved band value a band value released by a break in communication when a camp-on request is registered, and grants permission for communication to the terminal that has issued this camp-on request when the temporarily saved band value is higher than the band value required by a registered camp-on request. The control device determines whether or not a connection request can be accepted on the basis of the empty band value stored in the band management table.
    Type: Grant
    Filed: November 24, 1997
    Date of Patent: February 11, 2003
    Assignee: Fujitsu Limited
    Inventors: Atsushi Tsukazoe, Takashi Kato, Koichi Yoshida, Tomoko Yamashita
  • Patent number: 6481616
    Abstract: To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.
    Type: Grant
    Filed: October 17, 2001
    Date of Patent: November 19, 2002
    Assignee: Matsushita Electric Industrial Co. Ltd.
    Inventors: Makoto Imanishi, Akihiro Yamamoto, Hiroyuki Otani, Shinzo Eguchi, Takahiro Yonezawa, Kazushi Higashi, Koichi Yoshida, Kouji Hirotani
  • Publication number: 20020030087
    Abstract: To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.
    Type: Application
    Filed: October 17, 2001
    Publication date: March 14, 2002
    Inventors: Makoto Imanishi, Akihiro Yamamoto, Hiroyuki Otani, Shinzo Eguchi, Takahiro Yonezawa, Kazushi Higashi, Koichi Yoshida, Kouji Hirotani
  • Patent number: 6328196
    Abstract: To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.
    Type: Grant
    Filed: December 17, 1998
    Date of Patent: December 11, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Makoto Imanishi, Akihiro Yamamoto, Hiroyuki Otani, Shinzo Eguchi, Takahiro Yonezawa, Kazushi Higashi, Koichi Yoshida, Kouji Hirotani
  • Patent number: 6096542
    Abstract: Clarification of the relationship between the functions of E1AF gene and the invasion and metastasis of cancers, and application thereof to cancer control, more specifically the control of cancer cell invasion by controlling the expression of E1AF gene and the products of expression, and the detection and diagnosis of cancers by detecting the products of expression of E1AF gene.
    Type: Grant
    Filed: August 7, 1997
    Date of Patent: August 1, 2000
    Assignee: Takara Shuzo Co., Ltd.
    Inventors: Kei Fujinaga, Koichi Yoshida, Fumihiro Higashino
  • Patent number: 6069673
    Abstract: A CRT focus correcting method and correcting circuit are arranged as follows. Size data of a picture size set externally are compared with size data of a reference picture size, and when it is detected that a picture size has been changed, calculation correction data are obtained based on reference correction data and both the size data. When a parabola waveform voltage based on the calculation correction data is applied to a focus coil, a CRT focus is corrected according to a change in the picture size.
    Type: Grant
    Filed: November 19, 1997
    Date of Patent: May 30, 2000
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Koichi Yoshida, Koji Tanaka
  • Patent number: 6052893
    Abstract: The present invention provides a method of manufacturing a small electronic component, by which its yield can be enhanced. The invention comprises the steps of: a component mounting step of mounting a necessary electronic component 2-4 on a substrate 1; a coating layer forming step of forming a coating layer 14 for covering and sealing the substrate 1 in its entirety including the electronic component 2-4 with a coating material having high heat resistance; and a package layer forming step of forming a package layer 17 for covering and sealing a circumference of the coating layer 14 with a thermoplastic resin material 12. In the package layer forming step, adverse effects by the heat from the thermoplastic resin 12 to the electronic components 2-4 and the substrate 1 are inhibited with the coating layer 14.
    Type: Grant
    Filed: June 3, 1998
    Date of Patent: April 25, 2000
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Koichi Yoshida, Tetsuo Fukushima, Kenichiro Suetsugu
  • Patent number: 6017812
    Abstract: The present invention provides a bump bonding method that can prevent bumps from being inappropriately shaped.
    Type: Grant
    Filed: July 21, 1998
    Date of Patent: January 25, 2000
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takahiro Yonezawa, Osamu Nakao, Shinji Kanayama, Akihiro Yamamoto, Makoto Imanishi, Koichi Yoshida
  • Patent number: 5899375
    Abstract: The object is to provide a bump bonder wherein the drop of the tact efficiency of bump formation can be reduced to a low level by discard-bonding of unsatisfactory balls (3) so that satisfactory bumps can be formed. It features arranging a discard bonding chip (19) on bonding stage (17), which holds in their prescribed positions the semiconductor chips (13a), (13b) that are to be subjected to bump formation and performing discard bonding to discard bonding chip (19). Due to this construction, discard bonding can be effected without needing to move the capillary far from the bonding stage (17), which is the working position.
    Type: Grant
    Filed: September 24, 1997
    Date of Patent: May 4, 1999
    Assignee: Matsushita Electric Industrial Co., LTD.
    Inventors: Koichi Yoshida, Akihiro Yamamoto, Takahiro Yonezawa, Makoto Imanishi
  • Patent number: 5889760
    Abstract: In an ATM switching system, calls are equally distributed. The ATM switching system is arranged by a transmission path storing unit for storing therein a transmission path to which a first terminal is connected; a terminal storing unit for storing therein a plurality of second terminals which constitute a group and the representative of which group is predetermined; a communication time calculating unit for calculating communication time by subtracting a communication start time instant between the first terminal and the second terminals from a communication end time instant between the first terminal and the second terminal; a communication amount calculating unit for calculating a communication amount by multiplying the communication time calculated in the communication time calculating unit by a use bandwidth; and a communication amount accumulating unit for accumulating the communication amount calculated in the communication amount calculating unit with respect to each of the second terminals.
    Type: Grant
    Filed: July 17, 1996
    Date of Patent: March 30, 1999
    Assignee: Fujitsu Limited
    Inventors: Koichi Yoshida, Atsushi Tsukazoe, Hiroya Tomita
  • Patent number: 5858481
    Abstract: An electronic circuit substrate is sealed with a sealing material made of thermoplastic resin having a thermal-expansion coefficient close to that of a ceramic substrate by a compound filler dispersedly mixed in the sealing material. The filler includes at least two of milled fiber, glass fiber, and flaked filler.
    Type: Grant
    Filed: January 30, 1997
    Date of Patent: January 12, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tetsuo Fukushima, Koichi Yoshida, Kenichiro Suetsugu
  • Patent number: 5812551
    Abstract: Disclosed is an ATM exchange for granting permission to a camp-on request in a short time.A temporarily saved band value management table for managing temporarily saved band value is provided, as is a band management table for managing empty band value in the storage device of an ATM exchange comprising a storage device, a control device, and the like. The control device selects a corresponding empty band value for a temporarily saved band value when a first camp-on request is received from a terminal, and sets the empty band value to "0." In addition, the control device adds to the temporarily saved band value a band value released by a break in communication when a camp-on request is registered, and grants permission for communication to the terminal that has issued this camp-on request when the temporarily saved band value is higher than the band value required by a registered camp-on request.
    Type: Grant
    Filed: March 21, 1996
    Date of Patent: September 22, 1998
    Assignee: Fujitsu Limited
    Inventors: Atsushi Tsukazoe, Takashi Kato, Koichi Yoshida, Tomoko Yamashita
  • Patent number: 5442242
    Abstract: An apparatus for driving an expansion pole such as an expansion corner rod of an automobile including a motor for extending and shrinking said expansion pole, a main switch provided within a room of the automobile, and an auxiliary switch provided on the automobile at such a position that the auxiliary switch can be actuated from an outside of the automobile. When the auxiliary switch is actuated from the outside of the automobile, the motor is driven in a reverse direction to shrink the expansion pole. Therefore, the expansion pole can be shrunk without actuating the main switch provided within the room of the automobile. The auxiliary switch may be arranged within the expansion pole such that the auxiliary switch is actuated when the expansion pole is pushed down, pulled up or tilted.
    Type: Grant
    Filed: May 20, 1993
    Date of Patent: August 15, 1995
    Assignee: Yoshiko Co., Ltd.
    Inventor: Koichi Yoshida
  • Patent number: 5441476
    Abstract: A body temperature regulation system includes a discriminator which controls room temperature based on human body and room temperatures monitored by individual sensors. With this simple feedback system, the user can quickly fall asleep and reach a state of deep sleep.
    Type: Grant
    Filed: May 11, 1993
    Date of Patent: August 15, 1995
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Masako Kitado, Hiroyuki Inbe, Koichi Yoshida, Izumi Mihara
  • Patent number: 5424907
    Abstract: Solid electrolytic capacitors comprise a valve metal member having a dielectric film, with or without a conductive underlying layer, formed on the member, and a conductive polymer film formed on the layer. The conductive polymer film is formed by electrolytic polymerization of a polymerizable monomer contained in a system which comprises the monomer, a support electrolyte, and at least one member selected from silicic acids and silicates with or without phenol compounds. By this, the life of the capacitor even under high temperature and high humidity conditions is significantly improved. Methods for fabricating such capacitors are also described.
    Type: Grant
    Filed: February 17, 1993
    Date of Patent: June 13, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshikuni Kojima, Masao Fukuyama, Yasuo Kudoh, Koichi Yoshida
  • Patent number: 5424026
    Abstract: The invention provides an apparatus for compressively molding cushioning material using a quadrangular cylindrical molding box having an end side closed by a receiver mold, whereas the other end of said molding box receives supply of dry raw material consisting of fiberized paper or pulp by a volume corresponding to several times the actual volume of a molded body. A compressive mold inserted from the other end of the molding box is shifted to one-end side of the molding box to compress supplied raw material between a receiver mold. Simultaneously, a core member is retreated to a predetermined position of said one-end side in association with the shifting movement of the compressive mold. As a result, the core portion having thin thickness and the interior of the core member can securely be compressed and molded with even density.
    Type: Grant
    Filed: February 4, 1994
    Date of Patent: June 13, 1995
    Assignees: Settsu Corporation, Hitachi Zosen Corporation
    Inventors: Masatoshi Tohbo, Shigeru Miyawaki, Koichi Yoshida, Seiichi Yonekawa, Kiyohisa Ueda, Katsuhiro Yamaji, Eiji Koyanagi, Masahiro Takeda, Hidetoshi Hirata
  • Patent number: 5410572
    Abstract: In a disclosed PLL circuit, a constant voltage output by a constant voltage power supply 6 for obtaining a signal with a frequency equivalent to that obtained in a synchronized state is added to a signal output by a filter 3 by means of an adder 7. A signal output by the adder 7 representing the sum of the voltage output by the constant-voltage power supply and the signal output by the filter is supplied to a voltage-controlled oscillator 4. With a reference signal Pi supplied, the PLL circuit functions like an ordinary PLL circuit. When the signal Pi becomes unavailable, however, a signal output by a reference-signal-input detecting circuit 5 for monitoring the reference signal Pi puts integrating components employed by the filter 3 in a short-circuit state, initializing information accumulated in the integrating components. In addition, the output of the filter is set to zero.
    Type: Grant
    Filed: September 1, 1993
    Date of Patent: April 25, 1995
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Koichi Yoshida
  • Patent number: 5344595
    Abstract: This invention provides a paper molded cushion having a sufficient shock absorbing ability without substantial deformation during the drying process even if the shape of the cushion is very complex. The process comprises the steps of mechanically fluffing waste paper or pulp, adding a proper amount of adhesive to the fluffed paper of pulp, mixing uniformly, casting the mixture in a mold having water drainage small apertures thereof, heating said mold with the mixture therein by dielectric heating or microwave heating, thereby drying the molded paper cushion to a predetermined water content level and taking out the molded paper cushion from the mold.
    Type: Grant
    Filed: March 15, 1993
    Date of Patent: September 6, 1994
    Assignee: Settsu Corporation
    Inventors: Shinji Aoki, Shigeru Miyawaki, Koichi Yoshida, Seiichi Yonekawa