Patents by Inventor Koji Maruyama

Koji Maruyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11941182
    Abstract: A housing of an example of an electronic apparatus has a top surface and a bottom surface and has a flat shape. A power supply section having a flat shape is a power supply section, which is a housing case capable of accommodating a battery or is a battery, and the power supply section is provided at a position inside the housing that intersects with a reference plane perpendicular to the up-down direction. A first substrate is provided parallel to the reference plane on the top surface side relative to the power supply section. A second substrate is provided parallel to the reference plane on the bottom surface side relative to the power supply section. The electronic apparatus includes at least one of a vibrator and a speaker at a position that intersects with the reference plane.
    Type: Grant
    Filed: March 28, 2023
    Date of Patent: March 26, 2024
    Assignee: Nintendo Co., Ltd.
    Inventors: Wakana Ohori, Kazuhiro Maruyama, Yoshitaka Tamura, Masaya Takei, Takahiro Sato, Koji Saito, Mitsuru Katayama
  • Patent number: 11916154
    Abstract: The present technology relates to a light receiving element and a ranging module that can improve characteristics. A light receiving element includes: light receiving regions each including a first voltage application unit to which a first voltage is applied, a first charge detection unit provided around the first voltage application unit, a second voltage application unit to which a second voltage different from the first voltage is applied, and a second charge detection unit provided around the second voltage application unit; and an isolation portion that is arranged at a boundary between the light receiving regions adjacent to each other, and isolates the light receiving regions from each other. The present technology can be applied to a light receiving element.
    Type: Grant
    Filed: December 27, 2022
    Date of Patent: February 27, 2024
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Koji Neya, Takuya Maruyama
  • Publication number: 20230377843
    Abstract: A control method of a plasma processing apparatus including a first electrode that places a workpiece thereon includes supplying a bias power to the first electrode, and supplying a source power having a frequency higher than that of the bias power into a plasma processing space. The source power has a first state and a second state. The control method further includes a first control process of alternately applying the first state and the second state of the source power in synchronization with a signal synchronized with a cycle of a radio frequency of the bias power, or a phase within one cycle of a reference electrical state that represents any one of a voltage, current, and electromagnetic field measured in a power feeding system of the bias power.
    Type: Application
    Filed: July 31, 2023
    Publication date: November 23, 2023
    Applicant: Tokyo Electron Limited
    Inventors: Chishio KOSHIMIZU, Taichi HIRANO, Toru HAYASAKA, Shinji KUBOTA, Koji MARUYAMA, Takashi DOKAN
  • Patent number: 11764082
    Abstract: A control method of a plasma processing apparatus including a first electrode and a second electrode includes supplying a bias power to the first electrode, and supplying a negative DC voltage to the second electrode. The negative DC voltage periodically repeats a first state that takes a first voltage value and a second state that takes a second voltage value having an absolute value smaller than the first voltage value. The control method further includes a first control process of applying the first state of the negative DC voltage in a partial time period within each cycle of a signal synchronized with a cycle of a radio frequency of the bias power, or in a partial time period within each cycle of a periodically varying parameter measured in a transmission path of the bias power, and applying the second state continuously with the first state.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: September 19, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Chishio Koshimizu, Shinji Kubota, Koji Maruyama, Takashi Dokan, Koichi Nagami
  • Patent number: 11742182
    Abstract: A control method of a plasma processing apparatus including a first electrode that places a workpiece thereon includes supplying a bias power to the first electrode, and supplying a source power having a frequency higher than that of the bias power into a plasma processing space. The source power has a first state and a second state. The control method further includes a first control process of alternately applying the first state and the second state of the source power in synchronization with a signal synchronized with a cycle of a radio frequency of the bias power, or a phase within one cycle of a reference electrical state that represents any one of a voltage, current, and electromagnetic field measured in a power feeding system of the bias power.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: August 29, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Chishio Koshimizu, Taichi Hirano, Toru Hayasaka, Shinji Kubota, Koji Maruyama, Takashi Dokan
  • Patent number: 11742181
    Abstract: A control method of a plasma processing apparatus including a first electrode that places a workpiece thereon includes supplying a bias power to the first electrode, and supplying a source power having a frequency higher than that of the bias power into a plasma processing space. The source power has a first state and a second state. The control method further includes a first control process of alternately applying the first state and the second state of the source power in synchronization with a signal synchronized with a cycle of a radio frequency of the bias power, or a phase within one cycle of a reference electrical state that represents any one of a voltage, current, and electromagnetic field measured in a power feeding system of the bias power.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: August 29, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Chishio Koshimizu, Taichi Hirano, Toru Hayasaka, Shinji Kubota, Koji Maruyama, Takashi Dokan
  • Patent number: 11476089
    Abstract: A control method of a plasma processing apparatus including a first electrode that places a workpiece thereon includes supplying a bias power to the first electrode, and supplying a source power having a frequency higher than that of the bias power into a plasma processing space. The source power has a first state and a second state. The control method further includes a first control process of alternately applying the first state and the second state of the source power in synchronization with a signal synchronized with a cycle of a radio frequency of the bias power, or a phase within one cycle of a reference electrical state that represents any one of a voltage, current, and electromagnetic field measured in a power feeding system of the bias power.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: October 18, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Chishio Koshimizu, Taichi Hirano, Toru Hayasaka, Shinji Kubota, Koji Maruyama, Takashi Dokan
  • Publication number: 20220216036
    Abstract: A control method of a plasma processing apparatus including a first electrode that places a workpiece thereon includes supplying a bias power to the first electrode, and supplying a source power having a frequency higher than that of the bias power into a plasma processing space. The source power has a first state and a second state. The control method further includes a first control process of alternately applying the first state and the second state of the source power in synchronization with a signal synchronized with a cycle of a radio frequency of the bias power, or a phase within one cycle of a reference electrical state that represents any one of a voltage, current, and electromagnetic field measured in a power feeding system of the bias power.
    Type: Application
    Filed: March 22, 2022
    Publication date: July 7, 2022
    Applicant: Tokyo Electron Limited
    Inventors: Chishio KOSHIMIZU, Taichi HIRANO, Toru HAYASAKA, Shinji KUBOTA, Koji MARUYAMA, Takashi DOKAN
  • Patent number: 11286894
    Abstract: A fuel pump module includes a fuel pump, a housing, a filter, a bracket, a lid, a fuel passage, and a pressure regulating valve. The fuel pump supplies a fuel in a fuel tank that defines an opening to an outside of the fuel tank. The housing has a cylindrical shape and supports the fuel pump. The bracket connects the filter to the housing. The lid covers the opening and defines a discharge port through which the fuel is supplied to the outside. The fuel passage connects the fuel pump to the discharge port. The pressure regulating valve has a gravity center inside a space defined by a first virtual cylindrical surface including the housing. A minimum circumscribed circle of both the housing and the filter is smaller than the opening.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: March 29, 2022
    Assignees: DENSO CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takemasa Fujiseki, Teppei Matsumoto, Tohru Sekido, Shinichi Morita, Shoma Fujita, Koji Maruyama
  • Patent number: 11260491
    Abstract: When a tip of a blade cascade is ground with a grindstone, a jig is inserted between blade cascades of a blisk and a jig is inserted between blade cascades. A blade locking section of the jig locks with a side section in the width direction of a corresponding rotor blade via a damping member made from rubber or the like. A disk locking section of the jig locks with a disk of the blade cascade which the blade locking section locks with.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: March 1, 2022
    Assignee: IHI Corporation
    Inventors: Koji Maruyama, Yu Eto, Yasutaka Kishimoto
  • Patent number: 11242829
    Abstract: A fuel pump module includes: a pump unit; a lid provided to close an opening of a fuel tank; and a flexible fuel tube. The pump unit includes a fuel pump configured to pump fuel out of the fuel tank, a housing that holds the fuel pump, and a filter configured to filter the fuel. The lid has a discharge port to supply the fuel to outside of the fuel tank. The flexible fuel tube connects the pump unit and the discharge port. The housing includes a guide portion configured to fix the pump unit to a fixing member having a pair of rails provided in the fuel tank, and a separation regulating member configured to regulate the guide portion from separating from the pair of rails by engaging with the fixing member.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: February 8, 2022
    Assignees: DENSO CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Teppei Matsumoto, Takemasa Fujiseki, Shinichi Morita, Shoma Fujita, Koji Maruyama
  • Publication number: 20220028665
    Abstract: A decrease of an etching rate of a substrate can be suppressed, and energy of ions irradiated to an inner wall of a chamber main body can be reduced. A plasma processing apparatus includes a DC power supply configured to generate a negative DC voltage to be applied to a lower electrode of a stage. In a plasma processing performed by using the plasma processing apparatus, a radio frequency power is supplied to generate plasma by exciting a gas within a chamber. Further, the negative DC voltage from the DC power supply is periodically applied to the lower electrode to attract ions in the plasma onto the substrate placed on the stage. A ratio occupied, within each of cycles, by a period during which the DC voltage is applied to the lower electrode is set to be equal to or less than 40%.
    Type: Application
    Filed: October 7, 2021
    Publication date: January 27, 2022
    Inventors: Koichi Nagami, Kazunobu Fujiwara, Tatsuro Ohshita, Takashi Dokan, Koji Maruyama, Kazuya Nagaseki, Shinji Himori
  • Patent number: 11170979
    Abstract: A decrease of an etching rate of a substrate can be suppressed, and energy of ions irradiated to an inner wall of a chamber main body can be reduced. A plasma processing apparatus includes a DC power supply configured to generate a negative DC voltage to be applied to a lower electrode of a stage. In a plasma processing performed by using the plasma processing apparatus, a radio frequency power is supplied to generate plasma by exciting a gas within a chamber. Further, the negative DC voltage from the DC power supply is periodically applied to the lower electrode to attract ions in the plasma onto the substrate placed on the stage. A ratio occupied, within each of cycles, by a period during which the DC voltage is applied to the lower electrode is set to be equal to or less than 40%.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: November 9, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Koichi Nagami, Kazunobu Fujiwara, Tatsuro Ohshita, Takashi Dokan, Koji Maruyama, Kazuya Nagaseki, Shinji Himori
  • Publication number: 20210327681
    Abstract: A control method of a plasma processing apparatus including a first electrode that places a workpiece thereon includes supplying a bias power to the first electrode, and supplying a source power having a frequency higher than that of the bias power into a plasma processing space. The source power has a first state and a second state. The control method further includes a first control process of alternately applying the first state and the second state of the source power in synchronization with a signal synchronized with a cycle of a radio frequency of the bias power, or a phase within one cycle of a reference electrical state that represents any one of a voltage, current, and electromagnetic field measured in a power feeding system of the bias power.
    Type: Application
    Filed: June 28, 2021
    Publication date: October 21, 2021
    Applicant: Tokyo Electron Limited
    Inventors: Chishio KOSHIMIZU, Taichi HIRANO, Toru HAYASAKA, Shinji KUBOTA, Koji MARUYAMA, Takashi DOKAN
  • Patent number: 11041241
    Abstract: A plasma processing apparatus includes: a shower head including a ceiling plate having a plurality of gas holes, and a base member having a space so as to supply the processing gas to the plurality of gas holes; a temperature adjustment mechanism provided in the shower head; an acquisition unit configured to acquire a combination of a plasma parameter and pressure in the space in the base member; an estimation unit configured to estimate temperature of the ceiling plate corresponding to the acquired combination of the parameter and the pressure with reference to temperature information indicating the temperature of the ceiling plate corresponding to the combination of the parameter and the pressure; and a temperature controller configured to control the temperature adjustment mechanism such that the estimated temperature of the ceiling plate becomes target temperature when a plasma processing is performed.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: June 22, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Akihiro Yokota, Kazuki Moyama, Koji Maruyama
  • Publication number: 20210095624
    Abstract: A fuel pump module includes: a pump unit; a lid provided to close an opening of a fuel tank; and a flexible fuel tube. The pump unit includes a fuel pump configured to pump fuel out of the fuel tank, a housing that holds the fuel pump, and a filter configured to filter the fuel. The lid has a discharge port to supply the fuel to outside of the fuel tank. The flexible fuel tube connects the pump unit and the discharge port. The housing includes a guide portion configured to fix the pump unit to a fixing member having a pair of rails provided in the fuel tank, and a separation regulating member configured to regulate the guide portion from separating from the pair of rails by engaging with the fixing member.
    Type: Application
    Filed: September 28, 2020
    Publication date: April 1, 2021
    Inventors: Teppei MATSUMOTO, Takemasa FUJISEKI, Shinichi MORITA, Shoma FUJITA, Koji MARUYAMA
  • Publication number: 20210095625
    Abstract: A fuel pump module includes a fuel pump, a housing, a filter, a bracket, a lid, a fuel passage, and a pressure regulating valve. The fuel pump supplies a fuel in a fuel tank that defines an opening to an outside of the fuel tank. The housing has a cylindrical shape and supports the fuel pump. The bracket connects the filter to the housing. The lid covers the opening and defines a discharge port through which the fuel is supplied to the outside. The fuel passage connects the fuel pump to the discharge port. The pressure regulating valve has a gravity center inside a space defined by a first virtual cylindrical surface including the housing. A minimum circumscribed circle of both the housing and the filter is smaller than the opening.
    Type: Application
    Filed: September 28, 2020
    Publication date: April 1, 2021
    Inventors: Takemasa FUJISEKI, Teppei MATSUMOTO, Tohru SEKIDO, Shinichi MORITA, Shoma FUJITA, Koji MARUYAMA
  • Publication number: 20210043472
    Abstract: A control method of a plasma processing apparatus including a first electrode and a second electrode includes supplying a bias power to the first electrode, and supplying a negative DC voltage to the second electrode. The negative DC voltage periodically repeats a first state that takes a first voltage value and a second state that takes a second voltage value having an absolute value smaller than the first voltage value. The control method further includes a first control process of applying the first state of the negative DC voltage in a partial time period within each cycle of a signal synchronized with a cycle of a radio frequency of the bias power, or in a partial time period within each cycle of a periodically varying parameter measured in a transmission path of the bias power, and applying the second state continuously with the first state.
    Type: Application
    Filed: July 17, 2019
    Publication date: February 11, 2021
    Applicant: Tokyo Electron Limited
    Inventors: Chishio KOSHIMIZU, Shinji KUBOTA, Koji MARUYAMA, Takashi DOKAN, Koichi NAGAMI
  • Publication number: 20200411286
    Abstract: A control method of a plasma processing apparatus including a first electrode that places a workpiece thereon includes supplying a bias power to the first electrode, and supplying a source power having a frequency higher than that of the bias power into a plasma processing space. The source power has a first state and a second state. The control method further includes a first control process of alternately applying the first state and the second state of the source power in synchronization with a signal synchronized with a cycle of a radio frequency of the bias power, or a phase within one cycle of a reference electrical state that represents any one of a voltage, current, and electromagnetic field measured in a power feeding system of the bias power.
    Type: Application
    Filed: September 10, 2020
    Publication date: December 31, 2020
    Applicant: Tokyo Electron Limited
    Inventors: Chishio KOSHIMIZU, Taichi HIRANO, Toru HAYASAKA, Shinji KUBOTA, Koji MARUYAMA, Takashi DOKAN
  • Patent number: 10879086
    Abstract: A substrate cleaning device 1 includes a substrate holding unit 10 configured to hold a substrate W, a first cleaning unit 11 having a first cleaning member 11a caused to come into contact with a first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, a second cleaning unit 12 having a second cleaning member 12a caused to come into contact with the first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, and a controller 50 configured to control the first and second cleaning units 11, 12 so that, when any one of the first cleaning member 11a and the second cleaning member 12a cleans the first surface WA of the substrate W held by the substrate holding unit 10, the other cleaning member is at a position apart from the substrate W held by the substrate holding unit 10.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: December 29, 2020
    Assignee: EBARA CORPORATION
    Inventors: Takeshi Sakurai, Eiji Hirai, Kaoru Hamaura, Mitsuru Miyazaki, Koji Maruyama