Abstract: A processing end point detection method detects a timing of a processing end point (e.g., polishing stop, changing of polishing conditions) by calculating a characteristic value of a surface of a workpiece (an object of polishing) such as a substrate. This method includes producing a spectral waveform indicating a relationship between reflection intensities and wavelengths at a processing end point, with use of a reference workpiece or simulation calculation, based on the spectral waveform, selecting wavelengths of a local maximum value and a local minimum value of the reflection intensities, calculating the characteristic value with respect to a surface, to be processed, from reflection intensities at the selected wavelengths, setting a distinctive point of time variation of the characteristic value at a processing end point of the workpiece as the processing end point, and detecting the processing end point of the workpiece by detecting the distinctive point during processing of the workpiece.

Abstract: A processing end point detection method detects a timing of a processing end point (e.g., polishing stop, changing of polishing conditions) by calculating a characteristic value of a surface of a workpiece (an object of polishing) such as a substrate. This method includes producing a spectral waveform indicating a relationship between reflection intensities and wavelengths at a processing end point, with use of a reference workpiece or simulation calculation, based on the spectral waveform, selecting wavelengths of a local maximum value and a local minimum value of the reflection intensities, calculating the characteristic value with respect to a surface, to be processed, from reflection intensities at the selected wavelengths, setting a distinctive point of time variation of the characteristic value at a processing end point of the workpiece as the processing end point, and detecting the processing end point of the workpiece by detecting the distinctive point during processing of the workpiece.

Abstract: An inkjet printer includes a platen, a printing head, a feeding device, a pre-heater and a print heater. The printing head is configured to move in a right-left direction above the platen and to eject solvent ink from nozzles of the printing head on a printing surface of a medium at a printing position. The feeding device is configured to feed the medium on the platen in a forward direction substantially perpendicular to the right-left direction. The temperature controller is configured to control a pre-heater heating temperature of the pre-heater and a print heater heating temperature of the print heater such that a surface temperature of the printing surface of the medium at the printing position becomes within a range of from 30° C. to 70° C.

Abstract: A method for manufacturing a semiconductor device for forming a deep hole in a substrate by using a photoresist film formed on the substrate includes a positioning step of positioning a substrate inside an etching chamber, the substrate having a photoresist film including an opening part formed thereon, a first etching step of performing plasma etching on the substrate positioned inside the etching chamber by using a first mixed gas including at least SiF4 and O2 with the photoresist film as a mask, and a second etching step of forming a hole in the substrate by performing plasma etching on the substrate by using a second mixed gas including at least SF6, O2, and HBr after the first etching step.

Abstract: An inkjet printer includes a platen, a printing head, a feeding device, a pre-heater and a print heater. The printing head is configured to move in a right-left direction above the platen and to eject solvent ink from nozzles of the printing head on a printing surface of a medium at a printing position. The feeding device is configured to feed the medium on the platen in a forward direction substantially perpendicular to the right-left direction. The temperature controller is configured to control a pre-heater heating temperature of the pre-heater and a print heater heating temperature of the print heater such that a surface temperature of the printing surface of the medium at the printing position becomes within a range of from 30° C. to 70° C.

Abstract: An inkjet printer includes a printing head configured to eject solvent ink from nozzles of the printing head on a medium at a printing position. A medium is made of a polyvinyl chloride film. The solvent ink includes an organic pigment of from 3 to 7 weight %, a resin of 15 weight % or less, and solvents. A print heater is configured to heat the medium at the printing position. The print heater is arranged separately from a pre-heater. A temperature controller is configured to control a pre-heater heating temperature of the pre-heater and a print heater heating temperature of the print heater such that a surface temperature of the medium at the printing position becomes within a range of from 30° C. to 70° C.

Abstract: Producing a metal composite material by mixing hydrated ceramic particles, having water of crystallization that is bound within fine pores which have an average pore diameter of 1 nm or more and 80 nm or less, with a reinforcing material, the resulting mixture being sintered to form a preform which is then impregnated with a melt of an aluminum alloy and subjected to surface polishing. The ceramic particles, from which water of crystallization has been removed while the average pore diameter of the pores thereof is maintained, are dispersed uniformly, it is possible to obtain the metal composite material in which the ceramic particles that have fine pores are exposed on surfaces evenly in a stable manner by surface polishing that is conducted after the melt impregnation. The metal composite material can permit infiltration of a lubricating oil into the fine pores.

Abstract: According to one embodiment, a data reproduction apparatus comprises a reproduction module configured to reproduce image data, a resolution selection module configured to select one of resolutions, an image quality mode selection module configured to select on or off state of an image quality mode, a selection disable module configured to disable the resolution selection module to select a prescribed resolution when the image quality mode selection module selects the on state of the image quality mode, and an image processor configured to improve a quality of the image data reproduced by the reproduction module in accordance with the resolution selected by the resolution selection module when the image quality mode selection module selects the on state of the image quality mode.

Abstract: A fluorine-containing compound gas, e.g., SF6 gas, is converted into a plasma and a silicon portion of an object to be processed is etched by the plasma. At the same time, using a light source having a peak intensity of light in a wavelength range of light absorption of a reaction product, e.g., SiF4, for which, to be more precise, ranges from 9 ?m to 10 ?m, the light is irradiated onto a surface of an object to be processed from the light source. The SiF4 molecules absorb the light, become activated and gain kinetic energy to be used in gaining an easy escape from a hole. As a consequence, an amount (a partial pressure) of fluorine radicals (F*) used as an etchant is increased and an etching rate of a silicon is increased.

Abstract: An inkjet printer includes a printing head configured to eject solvent ink from nozzles of the printing head on a medium at a printing position. A medium is made of a polyvinyl chloride film. The solvent ink includes an organic pigment of from 3 to 7 weight %, a resin of 15 weight % or less, and solvents. A print heater is configured to heat the medium at the printing position. The print heater is arranged separately from a pre-heater. A temperature controller is configured to control a pre-heater heating temperature of the pre-heater and a print heater heating temperature of the print heater such that a surface temperature of the medium at the printing position becomes within a range of from 30° C. to 70° C.

Abstract: A plasma etching apparatus includes an evacuable processing chamber for performing a plasma etching process on a target object; a mounting table for mounting thereon the target object in the processing chamber; and a shower head facing the mounting table, for introducing a processing gas for generating a plasma to the processing chamber. Further, the apparatus includes a ring-shaped protrusion protruded from a bottom surface of the shower head toward the mounting table; and a plurality of gas introducing openings inclusively arranged in an area smaller than the target object in an inner central portion of the ring-shaped protrusion on the bottom surface of the shower head.

Abstract: A plasma processing method for use in a processing chamber of a plasma processing apparatus having a mounting table and a ceiling portion, there being formed a plasma processing space between the mounting table and the ceiling portion, includes the steps of mounting a target object on the mounting table, setting a gap between the ceiling portion and the mounting table to be greater than about 25 mm and less than about 65 mm, and performing a plasma processing on the target object by generating a plasma in the processing space. The target object includes an opening pattern having openings and at least parts of the openings are equal to or greater than about 500 ?m.

Abstract: According to one embodiment, a data reproduction apparatus comprises a reproduction module configured to reproduce image data, a resolution selection module configured to select one of resolutions, an image quality mode selection module configured to select on or off state of an image quality mode, a selection disable module configured to disable the resolution selection module to select a prescribed resolution when the image quality mode selection module selects the on state of the image quality mode, and an image processor configured to improve a quality of the image data reproduced by the reproduction module in accordance with the resolution selected by the resolution selection module when the image quality mode selection module selects the on state of the image quality mode.

Abstract: According to one embodiment, an information playback apparatus according to one embodiment includes a storage module configured to store a vendor table including a formal vendor ID of a self apparatus and one or more registered vendor IDs, and vendor commands respectively associated with the formal vendor ID and the registered vendor IDs, a connection module configured to connect a partner device so as to transfer video data, audio data, and vendor commands, a detection module configured to detect a vendor ID of the partner device, and a vendor ID control module configured to transmit either one of the formal vendor ID of the self apparatus and a temporary vendor ID of the self apparatus selected from the registered vendor IDs to the partner device based on the vendor ID of the partner device.

Abstract: The present invention relates to a processing end point detection method for detecting a timing of a processing end point (e.g., polishing stop, changing of polishing conditions) by calculating a characteristic value of a surface of a workpiece (an object of polishing) such as a substrate.

Abstract: By steps of forming first masks 13, 14 each having a first pattern on a first surface of a substrate 11 on which a membrane is to be formed, etching the first surface of the substrate 11 by using the first masks 13, 14 to forming first support beams 15, positioning a second surface of the substrate 11 on the basis of the first pattern on the first surface, forming a second mask 17 having a second pattern on the second surface of the substrate 11 based on the alignment and etching the second surface of the substrate 11 in dry by using the second mask 17 to form the second support beams 20, a membrane member 22a where the first and second support beams 15, 20 are formed on both surfaces of the membrane 12 is manufactured. Consequently, it is possible to provide the membrane member that is sufficient in strength and is hard to be deformed by heat.

Abstract: According to one embodiment, an information playback apparatus according to one embodiment includes a storage module configured to store a vendor table including a formal vendor ID of a self apparatus and one or more registered vendor IDs, and vendor commands respectively associated with the formal vendor ID and the registered vendor IDs, a connection module configured to connect a partner device so as to transfer video data, audio data, and vendor commands, a detection module configured to detect a vendor ID of the partner device, and a vendor ID control module configured to transmit either one of the formal vendor ID of the self apparatus and a temporary vendor ID of the self apparatus selected from the registered vendor IDs to the partner device based on the vendor ID of the partner device.

Abstract: According to one embodiment, a moving image and audio reproduction device includes an extraction block which extracts a composition of an Elementary Stream in an Audio Stream included in content and a setting shown in the Elementary Stream, and a signal processing part which reproduces the Audio Stream in accordance with the composition of the Elementary Stream in the Audio Stream and the setting shown in the Elementary Stream, extracted by the extraction block.

Abstract: A fluorine-containing compound gas, e.g., SF6 gas, is converted into a plasma and a silicon portion of an object to be processed is etched by the plasma. At the same time, using a light source having a peak intensity of light in a wavelength range of light absorption of a reaction product, e.g., SiF4, for which, to be more precise, ranges from 9 ?m to 10 ?m, the light is irradiated onto a surface of an object to be processed from the light source. The SiF4 molecules absorb the light, become activated and gain kinetic energy to be used in gaining an easy escape from a hole. As a consequence, an amount (a partial pressure) of fluorine radicals (F*) used as an etchant is increased and an etching rate of a silicon is increased.

Abstract: The present invention relates to a semiconductor device in which an electrode of a device formed on a substrate such as a semiconductor wafer and an electrode of a wiring structure such as an interposer are connected to each other through a connecting electrode extending through the substrate, and a method of manufacturing the same. A semiconductor device according to the present invention comprises a first substrate including a front surface and a back surface, a first device having a first electrode being formed on the front surface; and a wiring structure formed with a second electrode, the wiring structure having a principal surface. The first electrode of the first device and the second electrode of the wiring structure are connected to each other by a connecting electrode extending through the first substrate from the front surface to the back surface thereof. Substantially all the back surface of the first substrate is bonded to the principal surface of the wiring structure.