Abstract: Triazine polymers obtained by reacting (a) monocyanate; and (b) dicyanate and/or prepolymers thereof are used in forming interconnection structures for bonding an integrated semiconductor device to a carrier substrate.

Abstract: Disclosed is a printed circuit board and a method of preparing the printed circuit board, The printed circuit board has two types of plated through holes. The first type of plated through holes extend to and through an exterior surface of the printed circuit board for receipt of a pin-in-through-hole module or component pin. The second type of plated through holes are for surface mount technology and terminate below the exterior surface of the printed circuit board. These plated through holes contain a fill composition.

Abstract: Triazine polymers obtained by reacting (a) monocyanate; and (b) dicyanate and/or prepolymers thereof are used in forming interconnection structures for bonding an integrated semiconductor device to a carrier substrate.

Abstract: Disclosed is a printed circuit board and a method of preparing the printed circuit board. The printed circuit board has two types of plated through holes. The first type of plated through holes extend to and through an exterior surface of the printed circuit board for receipt of a pin-in-through-hole module or component pin. The second type of plated through holes are for surface mount technology and terminate below the exterior surface of the printed circuit board. These plated through holes contain a fill composition.

Abstract: Triazine polymers are obtained reacting (a) monocyanate; and (b) dicyanate and/or prepolymers thereof. The polymers are useful in forming interconnection structures for forming an integrated semiconductor device to a carrier substrate.

Abstract: Trisphenol PA tricyanate, prepolymers and crosslinked polymers thereof are provided. Blends of trifunctional cyanates and fluorinated or non-fluorinated difunctional cyanate are provided. The crosslinked polymers exhibit low dielectric loss properties and high glass transition temperatures and are suitable as the matrix material for structural composites including printed circuit boards.

Abstract: A rigid-flexible circuit board is fabricated by providing a core having a dielectric substrate and conductive layer thereon. A sub-composite comprising a polyimide and rigid dielectric substrate adjacent the conductive layer and in both the rigid and flexible segments of the board is provided. A release layer corresponding to the flexible segment of the board is provided. A rigid bonding layer is provided at rigid segments of the board but not at the flexible segments. A composite is formed by providing a second conductive layer adjacent the rigid bonding layer. The composite is laminated. Portions of the second conductive layer corresponding to the flexible segment and release layer are removed.

Abstract: Disclosed are thin film triazine adhesives on organic carriers, method for making them and microelectronic circuit packages incorporating them. The circuit package has a substrate made up of organic, dielectric, polymeric sheets. At least one pair of the polymeric sheets face each other and are adhesively joined together by a triazine polymer.

Abstract: Amorphous prepolymers from composition containing bisphenol P dicyanate and bisphenol M dicyanate as well as the cured polymers therefrom are prepared. The prepolymers are especially useful for circuit boards and structural composites.

Abstract: Trisphenol PA tricyanate, prepolymers and crosslinked polymers thereof are provided. Blends of trifunctional cyanates and fluorinated or non-fluorinated difunctional cyanate are provided. The crosslinked polymers exhibit low dielectric loss properties and high glass transition temperatures and are suitable as the matrix material for structural composites including printed circuit boards.

Abstract: A composite for providing a rigid-flexible circuit board includes at least one core that contains a dielectric substrate and at least one conductive layer thereon; at least one sub-composite that includes a polyimide and a rigid dielectric substrate; a release layer; at least one rigid bonding layer and a second conductive layer. The composite is used in the fabrication of a rigid-flexible circuit board.

Abstract: The present invention features a highly oriented, triazine superstructural network, whose structural alignment is magnetically induced in the liquid crystalline phase during the curing process of its liquid crystalline cyanate ester precursor. High mechanical strength cross-linked network structures are prepared from a new class of liquid crystalline dicyanate compounds. Optionally ring substituted di-(4-hydroxyphenyl)-terephthalate is synthesized as a precursor in the preparation of highly structured triazine networks. The orientation of the triazine networks has been accomplished by magnetically aligning the liquid crystalline phase of the precursor during the curing reaction.