Abstract: A power-on method for a server device includes generating a stand-by power to a server module of the server device when a blade enable signal is asserted; asserting, by the server module, a power-on signal to a storage module of the server device; performing, by the storage module, a first boot-on process when the storage module receives the asserted power-on signal; transmitting, by the storage module, an asserted ready signal to the server module when the first boot-on process finishes; and performing, by the server module, a second boot-on process via a normal power when the server module receives the asserted ready signal.

Abstract: A server system and a control method thereof are provided. The server system includes a first computing module, a power distribution board (PDB) module, a first storage apparatus, and a second storage apparatus. The PDB module is connected to the first computing module and is configured to distribute the power of the server system. The first storage apparatus and the second storage apparatus are connected to the PDB module. After finishing a boot operation, the first computing module determines whether a second computing module connected to the PDB module is present, such that the first computing module controls the PDB module to select and distribute the first storage apparatus and the second storage apparatus to the first computing module and the second computing module. Therefore, the server system can achieve different data access applications in the server system by only using a general-purpose PDB module.

Abstract: A server control method and a chassis controller are proposed. The server control method includes: determining whether the chassis controller is connected to a blade server when a power of the chassis controller is on; when the chassis controller is connected to the blade serve, further determining whether the blade server operates normally; when the blade server operates normally, switching the chassis controller to a slave device of the blade server, and controlling a just a bunch of disk (JBOD) system in response to a control command of the blade server.

Abstract: A storage system and a data transferring method thereof are provided. The storage system includes at least one drawer storage device, a backplane board and a processing unit. Each of the drawer storage devices accommodates at least one storage device, and has a first connecting interface. The backplane board has a second connecting interface. The backplane board and each of the drawer storage devices are connected with each other through a transmission line. The first connecting interface and the second connecting interface are connected or isolated with each other. The processing unit detects a connection status between the first connecting interface and the second connecting interface, and determines to transfer data through at least one of the transmission line and a connection between the first connecting interface and the second connecting interface according to the connection status.

Abstract: A welding jig and welding process for planar magnetic components are provided. The welding jig includes a fixed piece and an elastic piece. The fixed piece includes a base and a carrier. The base has an opening, bumps at the bottom of the opening and a pair of operation ends extending from the opening. The carrier is fixed on the base and located in the opening, and has multiple through holes. When the bumps are located respectively in the through holes, an accommodation interval is formed between adjacent pairs of the bumps for the placement of the planar magnetic components. The elastic piece is secured to the fixed piece, and when the planar magnetic components are placed in the accommodation intervals of the fixed piece, the elastic piece covers the planar magnetic components and the planar magnetic components abut against two side edges of the elastic piece.

Abstract: The present invention provides a structure of a resistor comprising: a substrate having an interfacial layer thereon; a resistor trench formed in the interfacial layer; at least a work function metal layer covering the surface of the resistor trench; at least two metal bulks located at two ends of the resistor trench and adjacent to the work function metal layer; and a filler formed between the two metal bulks inside the resistor trench, wherein the metal bulks are direct in contact with the filler.

Abstract: A test key structure for use in measuring step height includes a substrate, and a pair of test contacts. The substrate includes an isolation region and a diffusion region. The test contact pair includes a first test contact and a second test contact for measuring electrical resistances. The first test contact is disposed on the diffusion region and the second test contact is disposed on the isolation region.

Abstract: The present invention provides a structure of a resistor comprising: a substrate having an interfacial layer thereon; a resistor trench formed in the interfacial layer; at least a work function metal layer covering the surface of the resistor trench; at least two metal bulks located at two ends of the resistor trench and adjacent to the work function metal layer; and a filler formed between the two metal bulks inside the resistor trench, wherein the metal bulks are direct in contact with the filler.

Abstract: A test key structure for use in measuring step height includes a substrate, and a pair of test contacts. The substrate includes an isolation region and a diffusion region. The test contact pair includes a first test contact and a second test contact for measuring electrical resistances. The first test contact is disposed on the diffusion region and the second test contact is disposed on the isolation region.

Abstract: Management methods for use in an electronic system having electronic devices and a host device in a daisy-chain configuration are provided. The Management method includes determining that the electronic system has a first connected combination when detecting that first electronic device and second electronic device have been connected with the host device; searching for a first set of software that are suitable for a combination of the first and second electronic devices according to the first connected combination; and installing or activating the first set of software that are suitable for a combination of the first and second electronic devices.

Abstract: Management methods for use in an electronic system having electronic devices and a host device in daisy-chain configuration are provided. The host device has a configuration setting. First, an arrangement sequence among the host device and the electronic devices is detected. Then, the configuration setting of the host device is adjusted according to the detected arrangement sequence of the host device and the electronic devices such that the host device uses the electronic devices to perform a specific operation corresponding to the detected arrangement sequence.

Abstract: A welding jig and welding process for planar magnetic components are provided. The welding jig includes a fixed piece and an elastic piece. The fixed piece includes a base and a carrier. The base has an opening, bumps at the bottom of the opening and a pair of operation ends extending from the opening. The carrier is fixed on the base and located in the opening, and has multiple through holes. When the bumps are located respectively in the through holes, an accommodation interval is formed between adjacent pairs of the bumps for the placement of the planar magnetic components. The elastic piece is secured to the fixed piece, and when the planar magnetic components are placed in the accommodation intervals of the fixed piece, the elastic piece covers the planar magnetic components and the planar magnetic components abut against two side edges of the elastic piece.

Abstract: An electric device with multiple data connection ports is provided. The electric device includes a body, a processing unit, and a detecting switch unit. The body includes M surfaces and N data connection ports disposed on the surfaces. The processing unit includes a first interface control unit and a second interface control unit. The detecting switch unit detects whether the data connection ports are connected. While detecting the ith and the jth data connection ports are connected, the detecting switch unit assigns the ith and the jth data connection ports to be controlled by the first interface control unit and the second interface control unit respectively, and disables the data connection ports other than the ith and the jth data connection ports. Thus, the electric device can connect to the other electric devices with the form of the data connection ports flexibility.

Abstract: A pendulum-type landslide monitoring system includes an outer tube for being implanted into a ground to be monitored; a plurality of measuring units, vertically aligned inside the outer tube for independently measuring displacement at different depths in the ground; a guiding tube inside the outer tube for a flexible image capturing device to pass therethrough; and a water-level monitoring tube installed in the outer tube. Thereby, the flexible image capturing device can capture data of the displacement obtained by the measuring units, for an operator to identify displacement of a sliding surface in the ground, and to visually observe images of flowing groundwater captured by the flexible image capturing device in the outer tube, in order to further determining groundwater flow patterns as well stratums in the ground.

Abstract: A fastener for securing a cargo container includes a hollow connector, a first pull rod, a second pull rod and an elastic element. The hollow connector includes first and second members provided with first and second bores, respectively, and a receiving cavity between the first and second end members. The first pull rod extends through the first bore into the cavity, while the second pull rod extends through the second bore into the cavity and has a retaining head attached thereto. The elastic element is disposed around the second pull rod between the second end member and the retaining head for biasing the retaining head to move away from the second end member. The receiving cavity is open to expose the elastic element and the retaining head. The fastener may further include a limiting unit to prevent distorted movement of, and a pressure-equalizing member to evenly distribute pressure on, the elastic element.

Abstract: Memory cells comprising: a semiconductor substrate having at least two source/drain regions separated by a channel region; a charge-trapping structure disposed above the channel region; and a gate disposed above the charge-trapping structure; wherein the charge-trapping structure comprises a bottom insulating layer, a first charge-trapping layer, and a second charge-trapping layer, wherein an interface between the bottom insulating layer and the substrate has a hydrogen concentration of less than about 3×10/cm?2, and methods for forming such memory cells.

Abstract: A resistance random access memory in a bridge structure is disclosed that comprises a contact structure where first and second electrodes are located within the contact structure. The first electrode has a circumferential extending shape, such as an annular shape, surrounding an inner wall of the contact structure. The second electrode is located within an interior of the circumferential extending shape and separated from the first electrode by an insulating material. A resistance memory bridge is in contact with an edge surface of the first and second electrodes. The first electrode in the contact structure is connected to a transistor and the second electrode in the contact structure is connected to a bit line. A bit line is connected to the second electrode by a self-aligning process.

Abstract: Structures and methods to form a bistable resistive random access memory for reducing the amount of heat dissipation from electrodes by confining a heating region in the memory cell device are described. The heating region is confined in a kernel comprising a programmable resistive memory material that is in contact with an upper programmable resistive memory member and a lower programmable resistive memory member. The lower programmable resistive member has sides that align with sides of a bottom electrode comprising a tungsten plug. The lower programmable resistive member and the bottom electrode function a first conductor so that the amount of heat dissipation from the first conductor is reduced. The upper programmable resistive memory material and a top electrode function as a second conductor so that the amount of heat dissipation from the second conductor is reduced.

Abstract: A memory device includes first and second electrodes separated by an insulating member comprising upwardly and inwardly tapering surfaces connected by a surface segment. A bridge, comprising memory material, such as a phase change material, switchable between electrical property states by the application of energy, is positioned across the surface segment and in contact with the electrodes to define an inter-electrode path defined at least in part by the length of the surface segment. According to a method for making a memory cell device, the tapering surfaces may be created by depositing a dielectric material cap using a high density plasma (HDP) deposition procedure. The electrodes and the dielectric material cap may he planarized to create the surface segment on the dielectric material. At least one of the dielectric material depositing step and the planarizing step may be controlled so that the length of the surface and segment is within a chosen dimensional range, such as between 10 nm and 100 nm.

Abstract: The present invention discloses a power management architecture, the present invention comprises a user spacer located over a Kernel space, wherein the user space includes a PM (power management) aware application over a PM library having a PM manager; and the Kernel space having an interface over an APM daemon and device drivers, the APM daemon including a policy engine, a hardware located under the APM daemon and the device drivers.