Patents by Inventor Kun-Hsien Lin
Kun-Hsien Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220052035Abstract: A vertical electrostatic discharge protection device includes a heavily-doped semiconductor substrate, a first semiconductor epitaxial layer, a first doped buried layer, a second semiconductor epitaxial layer, a first doped well, at least one second doped well, and a first heavily-doped area. The epitaxial layers are stacked on the substrate. The first doped buried layer is formed in the first semiconductor epitaxial layer. The first doped well is formed in the second semiconductor epitaxial layer. The first doped well is formed on the first doped buried layer, and the doping concentration of the first doped well is lower than that of the first doped buried layer. The second doped well is formed in the second semiconductor epitaxial layer. The second doped well is adjacent to the first doped well.Type: ApplicationFiled: August 14, 2020Publication date: February 17, 2022Inventors: CHING-WEN WANG, CHIH-WEI CHEN, MEI-LIAN FAN, KUN-HSIEN LIN
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Publication number: 20210399117Abstract: A bidirectional electrostatic discharge protection device and a method for fabricating the same is disclosed. The protection device includes a heavily-doped semiconductor substrate, a first semiconductor epitaxial layer, a second semiconductor epitaxial layer, a heavily-doped area, and a lightly-doped area. The substrate, the heavily-doped area, and the lightly-doped area have a first conductivity type and the epitaxial layers have a second conductivity type. The first semiconductor epitaxial layer and the second semiconductor epitaxial layer are sequentially formed on the substrate, and the heavily-doped area and the lightly-doped area are formed in the second semiconductor epitaxial layer.Type: ApplicationFiled: June 23, 2020Publication date: December 23, 2021Inventors: CHIH-WEI CHEN, KUN-HSIEN LIN
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Publication number: 20210188315Abstract: State estimation and sensor fusion switching methods for autonomous vehicles thereof are provided. The autonomous vehicle includes at least one sensor, at least one actuator and a processor, and is configured to transfer and transport an object. In the method, a task instruction for moving the object and data required for executing the task instruction are received. The task instruction is divided into a plurality of work stages according to respective mapping locations, and each of the work stages is mapped to one of a transport state and an execution state, so as to establish a semantic hierarchy. A current location of the autonomous vehicle is detected by using the sensor and mapped to one of the work stages in the semantic hierarchy, so as to estimate a current state of the autonomous vehicle.Type: ApplicationFiled: December 18, 2019Publication date: June 24, 2021Applicant: Industrial Technology Research InstituteInventors: Xin-Lan Liao, Kun-Hsien Lin, Lih-Guong Jang, Wei-Liang Wu, Yi-Yuan Chen
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Patent number: 10985155Abstract: An embedded NMOS triggered silicon controlled rectification device includes a P-type substrate, at least one rectifying zone, and at least one trigger. The rectifying zone includes a first N-type heavily doped area, an N-type well, and a first P-type heavily doped area. Alternatively, the device includes an N-type substrate, a first P-type well, at least one rectifying zone, and at least one trigger. The rectifying zone includes a second P-type well, a first N-type heavily doped area, and a first P-type heavily doped area. The trigger cooperates with the P-type substrate or the first P-type well to form at least one NMOSFET. The trigger is independent to the rectifying zone. The first P-type heavily doped area is arranged between the trigger and the first N-type heavily doped area.Type: GrantFiled: September 26, 2019Date of Patent: April 20, 2021Assignee: Amazing Microelectronic Corp.Inventors: Kun-Hsien Lin, Zi-Ping Chen, Che-Hao Chuang, Tun-Chih Yang
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Publication number: 20210098445Abstract: An embedded NMOS triggered silicon controlled rectification device includes a P-type substrate, at least one rectifying zone, and at least one trigger. The rectifying zone includes a first N-type heavily doped area, an N-type well, and a first P-type heavily doped area. Alternatively, the device includes an N-type substrate, a first P-type well, at least one rectifying zone, and at least one trigger. The rectifying zone includes a second P-type well, a first N-type heavily doped area, and a first P-type heavily doped area. The trigger cooperates with the P-type substrate or the first P-type well to form at least one NMOSFET. The trigger is independent to the rectifying zone. The first P-type heavily doped area is arranged between the trigger and the first N-type heavily doped area.Type: ApplicationFiled: September 26, 2019Publication date: April 1, 2021Inventors: KUN-HSIEN LIN, ZI-PING CHEN, CHE-HAO CHUANG, TUN-CHIH YANG
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Publication number: 20210074621Abstract: A semiconductor package includes an interconnect substrate, an insulating adhesive, a transient voltage suppressor (TVS) chip, at least one first conductive wire, and at least one second conductive wire. The interconnect substrate includes a bottom layer and a top layer, the bottom layer includes two first conductive blocks and a first insulating block therebetween, the top layer includes two second conductive blocks and a second insulating block therebetween, the second conductive blocks are respectively formed on the first conductive blocks, and the second insulating block is formed on the first insulating block. The insulating adhesive is formed on the second insulating block. The TVS chip is formed on the insulating adhesive without overlapping the second conductive blocks. The first conductive wire and the second conductive wire are respectively electrically connected to the second conductive blocks and electrically connected to the TVS chip.Type: ApplicationFiled: September 10, 2019Publication date: March 11, 2021Inventors: ZI-PING CHEN, KUN-HSIEN LIN, CHE-HAO CHUANG, YIMING TSENG
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Patent number: 10930636Abstract: A transient voltage suppression device includes a lightly-doped semiconductor structure, a first doped well, a first heavily-doped area, a first buried area, and a second heavily-doped area. The lightly-doped semiconductor structure has a first conductivity type. The first doped well has a second conductivity type and is formed in the lightly-doped semiconductor structure. The first heavily-doped area has the second conductivity type and is formed in the first doped well. The first buried area has the first conductivity type and is formed in the lightly-doped semiconductor structure and under the first doped well, and the first buried area is adjacent to the first doped well. The second heavily-doped area has the second conductivity type and is formed in the lightly-doped semiconductor structure.Type: GrantFiled: August 20, 2018Date of Patent: February 23, 2021Assignee: Amazing Microelectronic Corp.Inventors: Kun-Hsien Lin, Zi-Ping Chen, Che-Hao Chuang
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Patent number: 10923466Abstract: A vertical transient voltage suppression device includes a semiconductor substrate having a first conductivity type, a first doped well having a second conductivity type, a first heavily-doped area having the first conductivity type, a second heavily-doped area having the first conductivity type, and a diode. The first doped well is arranged in the semiconductor substrate and spaced from the bottom of the semiconductor substrate, and the first doped well is floating. The first heavily-doped area is arranged in the first doped well. The second heavily-doped area is arranged in the semiconductor substrate. The diode is arranged in the semiconductor substrate and electrically connected to the second heavily-doped area through a conductive trace.Type: GrantFiled: July 24, 2018Date of Patent: February 16, 2021Assignee: AMAZING MICROELECTRONIC CORP.Inventors: Kun-Hsien Lin, Chih-Wei Chen, Mei-Lian Fan
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Patent number: 10918714Abstract: Glycosphingolipids (GSLs) bearing ?-glucose (?-Glc) that preferentially stimulate human invariant NKT (iNKT) cells are provided. GSLs with ?-glucose (?-Glc) that exhibit stronger induction in humans (but weaker in mice) of cytokines and chemokines and expansion and/or activation of immune cells than those with ?-galactose (?-Gal) are disclosed. GSLs bearing ?-glucose (?-Glc) and derivatives of ?-Glc with F at the 4 and/or 6 positions are provided. Methods for iNKT-independent induction of chemokines by the GSL with ?-Glc and derivatives thereof are disclosed. Methods for immune stimulation in humans using GSLs with ?-Glc and derivatives thereof are provided.Type: GrantFiled: October 30, 2018Date of Patent: February 16, 2021Assignee: ACADEMIA SINICAInventors: Chi-Huey Wong, Alice L. Yu, Kun-Hsien Lin, Tai-Na Wu
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Patent number: 10903204Abstract: A lateral transient voltage suppressor device is provided, comprising a doped substrate, a lateral clamping structure disposed on the doped substrate, a buried doped layer disposed between the doped substrate and the lateral clamping structure for isolation, at least one diode module, and at least one trench arranged in the doped substrate, having a depth not less than that of the buried doped layer, and being disposed between the lateral clamping structure and the at least one diode module for electrical isolation. The doped substrate and the buried doped layer have opposite conductivity types such that the doped substrate is electrically floating. The buried doped layer can be further disposed to separate the diode module from the doped substrate. By employing the proposed invention, the lateral transient voltage suppressor device is advantageous of maintaining both a lower clamping voltage as well as a reduced dynamic resistance.Type: GrantFiled: July 24, 2018Date of Patent: January 26, 2021Assignee: AMAZING MICROELECTRONIC CORP.Inventors: Che-Hao Chuang, Chih-Ting Yeh, Kun-Hsien Lin
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Patent number: 10769836Abstract: A method and an apparatus for establishing a coordinate system and a data structure product are provided. The method includes following steps: obtaining at least one layer related to an arrangement of an indoor space to generate a layout pattern in a 2D or 3D model; obtaining locations of positioning devices located within the indoor space and labelling the locations in the layout pattern; dividing the layout pattern into multiple view tiles according to a unit area or a unit volume for displaying the layout pattern; dividing a portion of the layout pattern around the labelled positioning devices into multiple positioning tiles according to the labelled locations of the positioning devices; and selecting at least one representative point of the view tiles and the positioning tiles as a reference point to define a reference frame and establishing the coordinate system based on the reference frame.Type: GrantFiled: December 27, 2017Date of Patent: September 8, 2020Assignee: Industrial Technology Research InstituteInventors: Po-Yu Huang, Xin-Lan Liao, Wei-Liang Wu, Lih-Guong Jang, Kun-Hsien Lin, Yi-Yuan Chen
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Patent number: 10748053Abstract: A ticket authentication method and a ticket authentication device are provided. The ticket authentication method includes the following steps. A first electronic device outputs an e-ticket. A second electronic device acquires the e-ticket. The second electronic device outputs a visible light verification code. The first electronic device acquires the visible light verification code and generates a composite code according to a certification data and the verification code. The second electronic device acquires the visible light composite code, and determines whether the composite code matches the certification data and the verification code. When the composite code matches the certification data and the verification code, the second electronic determines that the authentication of the e-ticket is successful.Type: GrantFiled: December 29, 2016Date of Patent: August 18, 2020Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yi-Yuan Chen, Xin-Lan Liao, Kun-Hsien Lin, Lih-Guong Jang, Chi-Neng Liu, Nien-Chu Wu, Po-Yu Huang
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Publication number: 20200090139Abstract: A voucher verification auxiliary method is provided, including: when a user device is approaching a voucher verification auxiliary device, generating an encryption key for the user device to encrypt voucher data with the encryption key to generate first encrypted data; reading and decrypting the first encrypted data to obtain the voucher data; encrypting the voucher data to generate and transmit second encrypted data to a verification center; decrypting the second encrypted data to obtain the voucher data, generating a verification result after verifying the voucher data, encrypting the verification result to become third encrypted data, and transmitting the third encrypted data back to the voucher verification auxiliary device; decrypting the third encrypted data to obtain the verification result; transmitting the verification result to a voucher receiving terminal. A voucher verification auxiliary device and a voucher verification auxiliary system are also provided.Type: ApplicationFiled: January 9, 2019Publication date: March 19, 2020Inventors: Yi-Yuan Chen, Kun-Hsien Lin, Yi-Chang Wang, Yao-Tai Tseng
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Patent number: 10573635Abstract: A transient voltage suppression device with improved electrostatic discharge (ESD) robustness includes a semiconductor substrate having a first conductivity type, a first doped well having a second conductivity type, a first heavily-doped area having the first conductivity type, a second doped well having the second conductivity type, a second heavily-doped area having the first conductivity type, and a first current blocking structure. The first doped well is arranged in the semiconductor substrate. The first heavily-doped area is arranged in the first doped well. The second doped well is arranged in the semiconductor substrate. The second heavily-doped area is arranged in the second doped well. The first current blocking structure is arranged in the semiconductor substrate, spaced from the bottom of the semiconductor substrate, and arranged between the first doped well and the second doped well.Type: GrantFiled: July 23, 2018Date of Patent: February 25, 2020Assignee: Amazing Microelectronics Corp.Inventors: Chih-Wei Chen, Yu-Shu Shen, Kun-Hsien Lin
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Publication number: 20200058636Abstract: A transient voltage suppression device includes a lightly-doped semiconductor structure, a first doped well, a first heavily-doped area, a first buried area, and a second heavily-doped area. The lightly-doped semiconductor structure has a first conductivity type. The first doped well has a second conductivity type and is formed in the lightly-doped semiconductor structure. The first heavily-doped area has the second conductivity type and is formed in the first doped well. The first buried area has the first conductivity type and is formed in the lightly-doped semiconductor structure and under the first doped well, and the first buried area is adjacent to the first doped well. The second heavily-doped area has the second conductivity type and is formed in the lightly-doped semiconductor structure.Type: ApplicationFiled: August 20, 2018Publication date: February 20, 2020Inventors: KUN-HSIEN LIN, ZI-PING CHEN, CHE-HAO CHUANG
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Publication number: 20200035665Abstract: A lateral transient voltage suppressor device is provided, comprising a doped substrate, a lateral clamping structure disposed on the doped substrate, a buried doped layer disposed between the doped substrate and the lateral clamping structure for isolation, at least one diode module, and at least one trench arranged in the doped substrate, having a depth not less than that of the buried doped layer, and being disposed between the lateral clamping structure and the at least one diode module for electrical isolation. The doped substrate and the buried doped layer have opposite conductivity types such that the doped substrate is electrically floating. The buried doped layer can be further disposed to separate the diode module from the doped substrate. By employing the proposed invention, the lateral transient voltage suppressor device is advantageous of maintaining both a lower clamping voltage as well as a reduced dynamic resistance.Type: ApplicationFiled: July 24, 2018Publication date: January 30, 2020Inventors: Che-Hao CHUANG, Chih-Ting YEH, Kun-Hsien LIN
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Publication number: 20200035664Abstract: A vertical transient voltage suppression device includes a semiconductor substrate having a first conductivity type, a first doped well having a second conductivity type, a first heavily-doped area having the first conductivity type, a second heavily-doped area having the first conductivity type, and a diode. The first doped well is arranged in the semiconductor substrate and spaced from the bottom of the semiconductor substrate, and the first doped well is floating. The first heavily-doped area is arranged in the first doped well. The second heavily-doped area is arranged in the semiconductor substrate. The diode is arranged in the semiconductor substrate and electrically connected to the second heavily-doped area through a conductive trace.Type: ApplicationFiled: July 24, 2018Publication date: January 30, 2020Inventors: Kun-Hsien LIN, Chih-Wei CHEN, Mei-Lian FAN
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Publication number: 20200027873Abstract: A transient voltage suppression device with improved electrostatic discharge (ESD) robustness includes a semiconductor substrate having a first conductivity type, a first doped well having a second conductivity type, a first heavily-doped area having the first conductivity type, a second doped well having the second conductivity type, a second heavily-doped area having the first conductivity type, and a first current blocking structure. The first doped well is arranged in the semiconductor substrate. The first heavily-doped area is arranged in the first doped well. The second doped well is arranged in the semiconductor substrate. The second heavily-doped area is arranged in the second doped well. The first current blocking structure is arranged in the semiconductor substrate, spaced from the bottom of the semiconductor substrate, and arranged between the first doped well and the second doped well.Type: ApplicationFiled: July 23, 2018Publication date: January 23, 2020Inventors: CHIH-WEI CHEN, YU-SHU SHEN, KUN-HSIEN LIN
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Patent number: 10533034Abstract: Glycosphingolipids (GSLs) compositions and methods for iNKT-independent induction of chemokines are disclosed.Type: GrantFiled: January 9, 2018Date of Patent: January 14, 2020Assignee: ACADEMIA SINICAInventors: Chi-Huey Wong, Alice L. Yu, Kun-Hsien Lin, Tai-Na Wu
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Patent number: 10510377Abstract: A system and method for combining light codes and a video are provided. The system includes an editing device and a storage device. The editing device identifies the content of a video to obtain a playback period of a plurality of frames having at least one candidate object in the video. The storage device stores at least one candidate object code and at least one light code symbol, and the light code symbol has a correspondence with the candidate object code. The editing device matches playback period of the frames having the at least one candidate object with the light code symbol, so as to provide a light code output table corresponding to the video.Type: GrantFiled: October 27, 2017Date of Patent: December 17, 2019Assignee: Industrial Technology Research InstituteInventors: Po-Yu Huang, Xin-Lan Liao, Lih-Guong Jang, Kun-Hsien Lin, Chi-Neng Liu