Abstract: A method of fabricating a semiconductor device includes following steps. A substrate is provided, wherein a first dielectric layer having a trench therein is formed on the substrate, a source/drain region is formed in the substrate at two sides of the trench, and a second dielectric layer is formed on the substrate in the trench. A first physical vapor deposition process is performed to form a Ti-containing metal layer in the trench. A second physical vapor deposition process is performed to form an Al layer on the Ti-containing metal layer in the trench. A thermal process is performed to anneal the Ti-containing metal layer and the Al layer so as to form a work function metal layer. A metal layer is formed to fill the trench.

Abstract: A semiconductor device for electrostatic discharge (ESD) protection includes a silicon controlled rectifier (SCR) including a semiconductor substrate, a first well formed in the substrate, a second well formed in the substrate, a first p-type region formed in the first well to serve as an anode, and a first n-type region partially formed in the second well to serve as a cathode, a p-type metal-oxide-semiconductor (PMOS) transistor formed in the first well including a gate, a first diffused region and a second diffused region separated apart from the first diffused region, a second n-type region formed in the first well electrically connected to the first diffused region of the PMOS transistor, and a second p-type region formed in the substrate electrically connected to the second diffused region of the PMOS transistor.

Abstract: A transient voltage suppressor without leakage current is disclosed, which comprises a P-substrate. There is an N-type epitaxial layer formed on the P-substrate, and a first N-heavily doped area, a first P-heavily doped area, an electrostatic discharge (ESD) device and at least one deep isolation trench are formed in the N-epitaxial layer. A first N-buried area is formed in the bottom of the N-epitaxial layer to neighbor the P-substrate and located below the first N-heavily doped area and the first P-heavily doped area. The ESD device is coupled to the first N-heavily doped area. The deep isolation trench is not only adjacent to the first N-heavily doped area, but has a depth greater than a depth of the first N-buried area, thereby separating the first N-buried area and the ESD device.

Abstract: The present invention provides an unpacking device for glass substrate and which includes a bracket and a plurality of sucking heads mounted thereon. A plurality of altitude sensors is incorporated to trigger an alarm if the altitude sensors are not synchronized during the pickup operation.

Abstract: A pick-and-place apparatus for handling glass substrate is disclosed and which comprises a chassis and a transportation platform which includes a transferring device disposed on the chassis and includes a first frame and a plurality of transferring rods rotationally disposed across the first frame along a first reference direction. A vertical displacing mechanism is provided for moving the transportation platform to move vertically to a pre-determined height. And a horizontal displacing device is provided for moving the transportation platform to more along the first reference direction such that the transferring device can be moved in and out of the cartridge, wherein the first transferring rods rotationally move the glass substrate into the cartridge or out of the cartridge.

Abstract: The present invention relates to a stacking machine, which comprises a base, a body movably arranged on the base, and a translational mechanism for driving the body to make a translational motion on the base. The synchronous belt used in the present invention can effectively resolve the problem of slipping caused by wheel rolling, and thus enables the movement of the stacking machine to be more accurate, with the highest speed of the movement also increased significantly. Besides that, the synchronous belt mechanism is more accurate in positioning, which reduces the number of times of repeated adjustments and maintenance caused by bigger positioning errors.

Abstract: The present invention relates to a substrate transfer system, comprising a number of roller assemblies used for mobile transfer of the glass substrate on it, and a controller used for controlling rotation of the roller assemblies; the substrate transfer system further comprises a substrate positioning device, which is arranged at the end of the transfer direction of the glass substrate by the roller assemblies; the substrate positioning device comprises a positioning pole, which is used for blocking and positioning the glass substrate transferred by the roller assemblies; and a buffer positioning mechanism on which the positioning pole is mounted on, providing mobile buffer for the positioning pole and driving the positioning pole to reset. A buffer reset mechanism is arranged for controlling the position of the positioning pole, and the positioning deviation of the substrate can be further eliminated; it can provide buffer contact for eliminating the risk of fragmentation.

Abstract: A manufacturing process of an etch stop layer is provided. The manufacturing process includes steps of providing a substrate; forming a gate stack structure over the substrate, wherein the gate stack structure at least comprises a dummy polysilicon layer and a barrier layer; removing the dummy polysilicon layer to define a trench and expose a surface of the barrier layer; forming a repair layer on the surface of the barrier layer and an inner wall of the trench; and forming an etch stop layer on the repair layer. In addition, a manufacturing process of the gate stack structure with the etch stop layer further includes of forming an N-type work function metal layer on the etch stop layer within the trench, and forming a gate layer on the N-type work function metal layer within the trench.

Abstract: The present invention provides an unpacking device for glass substrate and which includes a bracket and a plurality of sucking heads mourned thereon, and a plurality of altitude. The sucking heads are used to pickup a working target, and the altitude sensors are arranged between the bracket and the sucking heads. The unpacking device of the present invention can readily reduce the breakage of the glass substrates and also protect the sucking heads from being damaged.

Abstract: A pick-and-place apparatus for handling glass substrate is disclosed and which comprises a chassis and a transportation platform which includes a transferring device disposed on the chassis and includes a first frame and a plurality of transferring rods rotationally disposed across the first frame along a first reference direction. A vertical displacing mechanism is provided for moving the transportation platform to move vertically to a pre-determined height. And a horizontal displacing device is provided for moving the transportation platform to more along the first reference direction such that the transferring device can be moved in and out of the cartridge, wherein the first transferring rods rotationally move the glass substrate into the cartridge or out of the cartridge.

Abstract: A vertical transient voltage suppressor for protecting an electronic device is disclosed. The vertical transient voltage includes a conductivity type substrate having highly doping concentration; a first type lightly doped region is arranged on the conductivity type substrate, wherein the conductivity type substrate and the first type lightly doped region respectively belong to opposite types; a first type heavily doped region and a second type heavily doped region are arranged in the first type lightly doped region, wherein the first and second type heavily doped regions and the conductivity type substrate belong to same types; and a deep first type heavily doped region is arranged on the conductivity type substrate and neighbors the first type lightly doped region, wherein the deep first type heavily doped region and the first type lightly doped region respectively belong to opposite types, and wherein the deep first type heavily doped region is coupled to the first type heavily doped region.

Abstract: A cartridge for carrying glass substrate is provided, and the cartridge comprises a pair of side beams each is provided with at least two pillars along a first direction. Each of the pillars is configured with a plurality of fixtures detachably juxtaposed vertically. A plurality of supporting units is arranged between the fixtures of the side beams so as to define a plurality of supporting surfaces vertically. And a plurality of free locking units detachably are secured to the fixtures on the common surface so as to allow the moving of the fixtures on the common surface as a whole. With the provision of the cartridge of the present invention, the damaged glass substrate can be conveniently and effectively removed without tempering other glass substrates which are intact and undamaged.

Abstract: The present invention provides a device of replacing and charging battery at environment monitoring terminal and battery replacement system. Through the battery positioning mechanism disposed at both battery charging device and environment monitoring terminal, and anodes and cathodes disposed for contacting the battery electrodes, the battery replacement device can replace the full-discharged battery at environment monitoring terminal and a full-charged battery at the battery charging device. In this manner, the system can automatically replace the battery at environment monitoring terminal without manual replacement so as to reduce battery replacement time.

Abstract: The present invention provides a glass substrate inspection device and an inspection method that are applicable to inspect if breaking exists in a glass substrate deposited in a cartridge. The inspection device includes at least one detector assembly and at least one processing unit. The detector assembly includes a light-transmitting element located at one side of the glass substrate and two light-receiving elements respectively located at two sides of the glass substrate. The processing unit determines if difference of brightness detected by the two light-receiving elements is within a predetermined range, whereby breaking is determined existing in the glass substrate when the difference of brightness is not within the predetermined range. With this arrangement, the present invention can reduce or prevent a broken glass substrate from entering a display panel manufacture line.

Abstract: The present invention discloses a stacking device and an air purification system thereof. The stacking device includes vertically arranged stacking arms and a manipulator mechanism provided on the stacking arms; the stacking arms forming an axially extending duct and comprising first airflow driving devices; the duct forming air inflow openings that are in communication with an outside space of the stacking arms and an air outflow opening arranged at a lower end of the stacking arms; wherein the first airflow driving devices draw in air of the outside space of the stacking arms through the air inflow openings of the duct and drive air inside the duct to flow downward to be discharged through the air outflow opening of the duct to the lower end of the stacking arms.

Abstract: This invention discloses a transferring apparatus for transferring a glass substrate from a cartridge in case the glass substrate disposed therein is damaged or defective. The transferring apparatus includes a chassis, and a conveying device. The conveying device includes a frame and a plurality of transferring rods arranged in a common plane and along a longitudinal direction. A first driving device disposed on the chassis and is interlinked with the conveying device. The first driving device moves the frame along the first horizontal direction such that the frame can be moved in and out from the cartridge to carry the damaged glass substrate. The driving device further drives the transferring rods to rotate centered with its own axis. By the provision of the transferring apparatus, a damaged or defective glass substrate can be properly transferred out of the cartridge without damaging adjacent glass substrate. This can be performed automatically so as to increase the efficiency, while reducing labors.

Abstract: The present invention further provides a vacuum pickup device for manufacturing process of a flat panel and which comprises a detecting unit and a first vacuum circuit and a second vacuum circuit independent from each other. The first vacuum circuit is interconnected with a first nozzle, a first vacuum tube and a first vacuum reservoir in serial. The second vacuum circuit is interconnected with a second nozzle, a second vacuum tube and a second vacuum reservoir in serial. A joint sucking area is defined by the first and second nozzles jointly, and the detecting unit is used to monitor an operation status of the first and second vacuum circuits. Wherein either one of the first and second vacuum circuits is detected as a normal operational status, then the sucking process will remain in operation; and wherein when either the first vacuum circuit or the second vacuum circuit is detected as an abnormal status, the sucking process is halted.

Abstract: The present invention discloses an automatic particle measurement cart and an automatic particle measurement system for clean room and a measurement method thereof. The automatic measurement cart includes an automatic piloting device, which guides the cart to move along a pre-set path. The automatic piloting device includes a reading head, which recognizes the pres-set detective path and detects multiple pre-set measurement points. The cart moves along the detective path. A measurement device measures particles at the measurement points. A data processing device receives particle data measured by the measurement device and provides output according to a pre-set rule. With the above manner, the present invention can automatically measure clean room particles at a given site so as to reduce human labor involved and improve the preciseness of measurement result.

Abstract: A gate stack structure with an etch stop layer is provided. The gate stack structure is formed over a substrate. A spacer is formed on a sidewall of the gate stack structure. The gate stack structure includes a gate dielectric layer, a barrier layer, a repair layer and the etch stop layer. The gate dielectric layer is formed on the substrate. The barrier layer is formed on the gate dielectric layer. The barrier layer and an inner sidewall of the spacer collectively define a trench. The repair layer is formed on the barrier layer and an inner wall of the trench. The etch stop layer is formed on the repair layer.

Abstract: A silicon-controlled-rectifier (SCR) with adjustable holding voltage is disclosed, which comprises a heavily doped semiconductor layer and an epitaxial layer formed on the heavily doped semiconductor layer. A first N-well having a first P-heavily doped area is formed in the epitaxial layer. A second N-well or a first P-well is formed in the epitaxial layer. When the second N-well is formed in the epitaxial layer, a P-doped area is located between the first N-well and the second N-well. Besides, a first N-heavily doped area is formed in the second N-well or the first P-well. At least one deep isolation trench is formed in the epitaxial layer and located between the first P-heavily doped area and the first N-heavily doped area. A distance between the deep isolation trench and the heavily doped semiconductor layer is larger than zero.