Abstract: An electrical connector assembly includes a metal housing for being installed on a printed circuit board, a first connector, and a second connector. The metal housing is provided with a receiving space. The receiving space has a first insertion opening and a second insertion opening, the first insertion opening is located at the front end of the metal housing, and the second insertion opening is located at the rear end of the metal housing. The first connector is inserted into the receiving space through the first insertion opening, and the second connector is inserted into the receiving space through the second insertion opening and butted with the first connector. The first connector and the metal housing are permanently locked with each other by a buckle structure therebetween, such that the first connector cannot be disengaged from the metal housing.

Abstract: A fan is provided. The fan includes a frame, a rotor and a stator. The rotor is received in the frame and includes a magnetic part, a metal housing, a hub and a plurality of blades. The metal housing is telescoped on the magnetic part. The hub is telescoped on the metal housing. The blades are formed on the hub. The stator is received in the frame. The stator includes a plurality of silicon-steel sheets which form a silicon-steel sheet outside diameter, the silicon-steel sheet outside diameter is greater than 42 mm and wherein the rated speed of the fan is greater than 8000 RPM.

Abstract: An electronic device package includes a substrate, an electronic device, and a first packaging layer. The electronic device and the first packaging layer are disposed on the substrate and the electronic device is located between the substrate and the first packaging layer. The first packaging layer includes a first oxynitride layer and a second oxynitride layer, wherein the second oxynitride layer is located between the first oxynitride layer and the electronic device. A composition of the first oxynitride layer includes SiNx1Oy1, a composition of the second oxynitride layer includes SiNx2Oy2, and x1>x2.

Abstract: A package of electronic device including a substrate, at least one electronic device and an encapsulation layer is provided. The substrate has a device area and a light transmitting area located outside the device area. The at least one electronic device is disposed on the device area of the substrate. The encapsulation layer is disposed on the substrate and covers the at least one electronic device. The encapsulation layer extends continuously from the device area to the light transmitting area, and a nitrogen content of the encapsulation layer on the device area is higher than a nitrogen content of the encapsulation layer on the light transmitting area. A display panel is also provided.

Abstract: A miniature pump includes a cylinder, a piston module, a driving module and a wall body. The cylinder has a first end and a second end opposite to each other along a direction. The piston module is accommodated in the cylinder. The piston module has at least one pumping chamber structure protruded towards the second end, and the pumping chamber structure is able to extend or retract along the direction. The driving module is located at the second end and connected to the pumping chamber structure, configured to drive the pumping chamber structure to extend or retract along the direction. The wall body at least partially surrounds a position of the pumping chamber structure near the first end, and is located between the cylinder and the pumping chamber structure.

Abstract: The woven textile has a first end and an opposite second end. A longitudinal direction is defined by the first end and the second end. The woven textile includes an upper layer, a lower layer, and at least one binding thread. The upper layer includes at least one first braid woven by a plurality of filaments and extending in a meandering way to form a plurality of hollow portions. The lower layer includes at least one second braid woven by a plurality of filaments and extending in a meandering way to form a plurality of hollow portions. The binding thread fixes the first braid and the second braid together by weaving so that the upper layer and the lower layer are positioned by the binding thread.

Abstract: A device comprises a first interconnect structure over a first active device layer, a first power circuit in the first active device layer, a second active device layer over and in contact with the first interconnect structure, a first switch in the second active device layer, a second interconnect structure over and in contact with the second active device layer, a third active device layer over and in contact with the second interconnect structure, a second power circuit in the third active device layer and a third interconnect structure over and in contact with the third active device layer and connected to a power source, wherein the power source is configured to provide power to the first power circuit through the first switch.

Abstract: An in-mold vibratile injection compression molding method and molding apparatus thereof are described. While performing a filling stage, a first piezoelectric actuator and a second piezoelectric actuator are use to vibrate the molding material along at least two directions for precisely filling the molding material into the micro-structure by adjusting the filling flow velocity of the molding material associated with the proper molding material temperature and by maintaining a molding material temperature of a skin solidified layer in the cavity between a glass transition temperature and a melting temperature in order to avoid the form error, to increase the groove filling rate and to improve the residual stress.

Abstract: Embodiments of the present invention are directed to a computer-implemented method for stress monitoring. Methods include receiving, by a processor, a plurality of user stress labels corresponding to a plurality of events. Methods also include determining an individualized stress profile based at least in part upon the user stress labels. Methods also include receiving heart rate sensor data from a wearable device. Methods also include extracting a cardiovascular feature from the heart rate sensor data. Methods also include determining a stress index based at least in part upon the individualized stress profile and the cardiovascular feature. Methods also include outputting the stress index.

Abstract: Embodiments of technical solutions are described for a health management system that facilitates adaptively tracking a health-management goal. An example computer-implemented method includes receiving a cumulative target for a predetermined duration for a user, and generating a target activity time-series for the predetermined duration to meet the cumulative target. The method further includes receiving a user-activity time-series for the user that indicates activity performed by the user to meet the cumulative target and monitoring a difference between the target activity time-series and the user-activity time-series. The method further includes determining, based on the difference, a probability value that indicates the user missing the cumulative target, and generating an updated target activity time-series for the user in response to the probability value being above a predetermined threshold.

Abstract: A flexible electronic module including a patterned flexible substrate, a stretchable material layer, and at least one electronic device is provided. The patterned flexible substrate includes at least one distributed region, and the stretchable material layer connects the distributed region. The electronic device is disposed on at least one of the patterned flexible substrate and the stretchable material layer. A manufacturing method of the flexible electronic module is also provided.

Abstract: A photonic microwave time delay apparatus and method thereof are disclosed. The microwave-modulated optical signal generation module of the photonic microwave time delay apparatus generates a microwave-modulated optical signal. The microwave-modulated optical signal is injected into the photonic microwave time delay module of the photonic microwave time delay apparatus, wherein the photonic microwave time delay module includes a microwave-time-delay laser. The optical power and carrier frequency of the microwave-modulated optical signal are adjusted so as to excite the laser cavity resonance red-shift effect in the microwave-time-delay laser. Under such operation, the microwave-time-delay laser emits a microwave-modulated optical signal with a microwave time delay.

Abstract: Embodiments of mechanisms for forming power gating cells and virtual power circuits on multiple active device layers are described in the current disclosure. Power gating cells and virtual power circuits are formed on separate active device layers to allow interconnect structure for connecting with the power source be formed on a separate level from the interconnect structure for connecting the power gating cells and the virtual power circuits. Such separation prevents these two types of interconnect structures from competing for the same space. Routings for both types of interconnect structures become easier. As a result, metal lengths of interconnect structures are reduced and the metal widths are increased. Reduced metal lengths and increased metal widths reduce resistance, improves resistance-capacitance (RC) delay and electrical performance, and improves interconnect reliability, such as reducing electro-migration.

Abstract: A protection circuit applied to an alternating current (AC) power source includes a sample-and-hold unit, a detection unit, and a discharge signal generation unit. The sample-and-hold unit samples a peak value of a direct current (DC) voltage during each period of a corresponding AC voltage, wherein the AC power source provides the AC voltage. The detection unit generates a detection signal when the DC voltage crosses a reference voltage corresponding to the peak value. The discharge signal generation unit generates a count signal when the discharge signal generation unit does not receive the detection signal within a predetermined time of a period of the AC voltage, accumulates the count signal, and generates a discharge signal to a discharge unit when a number of accumulated count signals is greater than a predetermined value, wherein the discharge unit discharges an X capacitor according to the discharge signal.

Abstract: A nut and support element assembly structure includes: a nut having a screw hole, an end side, and a lateral side; a support element having a bottom resting portion, two end side abutting portions disposed at the end sides of the nut, respectively, and two lateral side clamping portions connected to the end side abutting portions to clamp the nut from the lateral sides. A nut and support element assembly structure includes: a nut having a screw hole, an end side, and a lateral side; a support element having a bottom resting portion, two end side abutting portions disposed at the end sides of the nut, respectively, and two lateral side clamping portions connected to the bottom resting portion to clamp the nut from the lateral sides. A screwing-fixing assembly for use with the nut and support element assembly structure is further provided.

Abstract: An antenna structure includes a first antenna with a first feed point feeding current, a first radiating portion, a second radiating portion, and a first ground point. The first radiating portion is electrically connected to the first feed point and receives radiation signals in a first frequency band. The second radiating portion is electrically connected to the first feed point and receives and sends radiation signals in a second frequency band. The first ground point is spaced apart from the first feed point and is electrically connected to the second radiating portion.

Abstract: A nameplate assembly for a bag has a base, a nameplate and at least one connecting unit, the nameplate is disposed in an accommodating recess of the base, and the at least one connecting unit is mounted in at least one connecting recess of the base. The nameplate is connected and fixed on the base by the connecting unit. The base further includes a pressing recess formed in an end of the accommodating recess, the nameplate extending to a position above the pressing recess. The nameplate can be easily mounted on the base by the magnetic force from the connecting unit and can be easily removed by being pressed into the pressing recess. Therefore, the nameplate assembly is efficient in manufacturing and is easy to use.

Abstract: An embodiment cell shift scheme includes abutting a first transistor cell against a second transistor cell and shifting a place and route boundary away from a polysilicon disposed between the first transistor cell and the second transistor cell. In an embodiment, the cell shift scheme includes shifting the place and route boundary to prevent a mismatch between a layout versus schematic (LVS) netlist and a post-simulation netlist.