Patents by Inventor Kunio Harada

Kunio Harada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040035702
    Abstract: An electrophoresis member is produced by laying a plurality of capillaries on an adhesive layer born on a support layer to form a capillary layer, laminating thereon a second support layer, and partially removing the first support layer, the first adhesive layer and the second support layer to partially expose the capillaries to form a window portion for irradiation and detection and a sample injection portion for injecting a sample.
    Type: Application
    Filed: July 29, 2003
    Publication date: February 26, 2004
    Inventors: Hiroshi Kawazoe, Tomoyuki Kamata, Atsushi Takahashi, Tsuyoshi Sonehara, Tatemi Ido, Kunio Harada
  • Patent number: 6663468
    Abstract: The problem of non-uniform polishing properties of a circumferential surface area of a substrate, so-called edge sagging phenomenon, is solved. When a thin film formed on a top surface of the substrate is polished while holding a back surface of the substrate, local stress at a circumferential end of the substrate is reduced by a guide installed so as to surround the substrate. Also, a deformation of the outer circumferential end portion of the substrate is reduced by a recessed groove provided on the guide. Since a thin film formed on the surface can be polished to be flat throughout the surface of the substrate without an occurrence of non-uniform polishing properties of the outer circumferential surface area of the substrate, so-called edge sagging phenomenon, a high-performance semiconductor device can be manufactured at a high yield and low costs.
    Type: Grant
    Filed: January 5, 2001
    Date of Patent: December 16, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Yoshio Kawamura, Kan Yasui, Masahiko Sato, Souichi Katagiri, Masayuki Nagasawa, Kunio Harada, Satoshi Osabe, Ui Yamaguchi
  • Publication number: 20030219891
    Abstract: A small sized, cost-effective genetic testing apparatus that provides high sensitivity testing, for performing genetic testing simply and at low cost. An optical sensor array for the apparatus and method for luminometric assay comprises a means that simultaneously selects 2 pixels and detects minute amounts of chemiluminescence by obtaining the differential output of the respective signals.
    Type: Application
    Filed: January 9, 2003
    Publication date: November 27, 2003
    Applicant: Hitachi, Ltd.
    Inventors: Yoshiaki Yazawa, Hideki Kambara, Masao Kamahori, Kunio Harada, Kazunori Okano
  • Publication number: 20030159519
    Abstract: A lateral force-measuring device and a vehicle inspecting system could be provided.
    Type: Application
    Filed: February 22, 2002
    Publication date: August 28, 2003
    Applicant: KABUSHIKI KAISHA HARADAKUNI
    Inventor: Kunio Harada
  • Patent number: 6573520
    Abstract: An electron beam lithography system to conduct drawing on a sample with an electron beam within a first chamber. A second chamber is provided which is separated from the first chamber and has a volume smaller than that of the first chamber. A member is provided which is capable of placing the sample on a part separable from an X-Y stage within the first chamber and moving the separable part with the sample thereon to a position for drawing on the sample with the electron beam within the first chamber. A loading arrangement is provided for removing the separable part and the sample from the X-Y stage and moving the separated part to the second chamber from the first chamber. The separable part of the X-Y stage is independently removable from the sample and from the second chamber to outside of the second chamber.
    Type: Grant
    Filed: March 23, 2000
    Date of Patent: June 3, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Hidetoshi Satoh, Hiroshi Tsuji, Kunio Harada, Yasunari Sohda
  • Publication number: 20020048014
    Abstract: A personal identification system, which uses a vein pattern of a finger, optimizes the amount of light of a light source based on a captured finger image and emphasizes the vein pattern during image processing for identification.
    Type: Application
    Filed: September 18, 2001
    Publication date: April 25, 2002
    Applicant: Hitachi, Ltd.
    Inventors: Miyuki Kono, Shin-ichiro Umemura, Takafumi Miyatake, Kunio Harada, Yoshitoshi Ito, Hironori Ueki
  • Publication number: 20020028308
    Abstract: The present invention provides a method for producing a high-quality capillary tube used in an electrophoresis apparatus in a safe and inexpensive manner.
    Type: Application
    Filed: September 4, 2001
    Publication date: March 7, 2002
    Applicant: Hitachi, Ltd.
    Inventors: Kunio Harada, Masao Kamahori, Hideki Kambara, Sumio Yamaguchi, Sukeyoshi Tsunekawa
  • Publication number: 20010007795
    Abstract: To solve a problem of non-uniform polishing properties of a circumferential surface area of a substrate, so-called edge sagging phenomenon. When a thin film formed on a top surface of the substrate is polished while holding a back surface of the substrate, local stress at a circumferential end of the substrate is reduced by a guide installed so as to surround the substrate. Also, a deformation of the outer circumferential end portion of the substrate is reduced by a recessed groove provided on the guide. Since a thin film formed on the surface can be polished to be flat throughout the surface of the substrate without an occurrence of non-uniform polishing properties of the outer circumferential surface area of the substrate, so-called edge sagging phenomenon, a high-performance semiconductor device can be manufactured at a high yield and low costs.
    Type: Application
    Filed: January 5, 2001
    Publication date: July 12, 2001
    Inventors: Yoshio Kawamura, Kan Yasui, Masahiko Sato, Souichi Katagiri, Masayuki Nagasawa, Kunio Harada, Satoshi Osabe, Ui Yamaguchi
  • Patent number: 5644554
    Abstract: A magnetic head is supported with variable stiffness for loading onto the disk surface and unloading off the disk surface. The magnetic head is attached to an end of a thin leaf spring which has been curved in advance, and the leaf spring is interposed between two flat plates, with one of the flat plates being slidable. With the slidable flat plate being moved to the position where the plate overlies a fitting section of the magnetic head, a head support point is provided at a first position with respect to the magnetic head, the thin leaf spring takes an extending straightened state, and at the same time, the thin leaf spring, two flat plates, and magnetic head fitting section form a unitary member with a high stiffness for supporting the magnetic head thereby to load the magnetic head onto the disk surface.
    Type: Grant
    Filed: March 29, 1993
    Date of Patent: July 1, 1997
    Assignee: Hitachi, Ltd.
    Inventors: Kunio Harada, Toshimitsu Kaku, Masuo Kasai, Masahiro Ojima
  • Patent number: 5505778
    Abstract: An apparatus for treating solid surface using a thermally excited molecular beam according to the present invention is capable of completely preventing flying of contaminant caused by a heating source to a sample. To achieve this, in the present invention, the heating source for exciting the molecules is hermetically separated from the sample. Alternatively, a container where the heating source is housed and a container where the sample is accommodated are separated such that a conductance between the two containers is sufficiently small. In this way, chemical reactions between the molecular beam of the reactive gas which is highly reactive and the heating source heated to high temperatures can be eliminated, and flying of the contaminant to the sample can thus be greatly reduced. As a result, flying of the contaminating substances caused by the heating source to the sample can be prevented, and reduction in the surface treating rate of the sample, caused by the contaminant, can be prevented.
    Type: Grant
    Filed: July 15, 1991
    Date of Patent: April 9, 1996
    Assignee: Hitachi, Ltd.
    Inventors: Tetsuo Ono, Susumu Hiraoka, Sakae Saito, Kunio Harada, Mituhiro Tachibana, Shigeo Kubota, Keizo Suzuki
  • Patent number: 4715054
    Abstract: A plasma X-ray source comprises inner and outer cylindrical electrodes disposed coaxially and with a certain distance with respect to each other, an electrical insulator disposed between end portions of the inner and outer cylindrical electrodes, and a discharge vessel disposed to envelop the inner and outer cylindrical electrodes. A pulse voltage is applied between the inner and outer cylindrical electrodes to produce plasma in the discharge vessel. An electrically conductive spherical shield is disposed to envelop a space where the plasma is pinched, and the spherical shield is maintained at a potential equal to that applied to the outer cylindrical electrode.
    Type: Grant
    Filed: November 7, 1985
    Date of Patent: December 22, 1987
    Assignee: Hitachi, Ltd.
    Inventors: Yasuo Kato, Kunio Harada, Shigeo Kubota, Yoshio Watanabe, Seiichi Murayama
  • Patent number: 4563900
    Abstract: In an acoustic microscope wherein an acoustic wave is projected to a predetermined specimen by an acoustic lens, and a disturbed acoustic wave from the specimen is imaged; an acoustic microscope characterized in that the lens has a ring which is arranged around it, whereby a liquid to serve as an acoustic propagation medium is held between the ring and the specimen by capillarity.
    Type: Grant
    Filed: April 26, 1984
    Date of Patent: January 14, 1986
    Assignee: Hitachi, Ltd.
    Inventors: Kunio Harada, Sumio Yamaguchi, Hiroshi Kanda, Isao Ishikawa, Yuzuru Ohji
  • Patent number: 4352974
    Abstract: A plasma etcher wherein the provision of a gas outlet directly in an etching chamber is avoided and wherein a subchamber having a sufficient capacity is connected to the etching chamber through a joint part, the gas outlet being provided in this subchamber. With the apparatus, the distribution of etching rates in plasma etching becomes uniform.
    Type: Grant
    Filed: July 29, 1980
    Date of Patent: October 5, 1982
    Assignee: Hitachi, Ltd.
    Inventors: Tatsumi Mizutani, Norio Kanai, Kunio Harada, Hideo Komatsu, Shinya Iida