Patents by Inventor Kyu Oh Lee

Kyu Oh Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200006210
    Abstract: A chip package that includes a die coupled to a package substrate. The substrate includes a first ground layer and a dielectric material engaging the first ground layer. A solder resist layer engages the dielectric material and a routing layer is disposed at least partially within the solder resist layer. A second ground layer engages the solder resist layer.
    Type: Application
    Filed: June 27, 2018
    Publication date: January 2, 2020
    Inventors: Cheng Xu, Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji Yong Park
  • Publication number: 20200008302
    Abstract: A package substrate is disclosed. The package substrate includes a substrate core, a cavity below the substrate core that extends from a surface of a first resist layer to a bottom surface of the package substrate, and a first terminal and a second terminal in the first resist layer. The package substrate also includes one or more passive components that are coupled inside the cavity to the first terminal and the second terminal.
    Type: Application
    Filed: June 29, 2018
    Publication date: January 2, 2020
    Inventors: Rahul JAIN, Prithwish CHATTERJEE, Kyu-oh LEE
  • Publication number: 20200005994
    Abstract: Apparatuses, systems and methods associated with a substrate assembly with an encapsulated magnetic feature for an inductor are disclosed herein. In embodiments, a substrate assembly may include a base substrate, a magnetic feature encapsulated within the base substrate, and a coil, wherein a portion of the coil extends through the magnetic feature. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: June 27, 2018
    Publication date: January 2, 2020
    Inventors: Kyu-Oh LEE, Rahul JAIN, Sai VADLAMANI, Cheng XU, Ji Yong PARK, Junnan ZHAO, Seo Young KIM
  • Publication number: 20190393217
    Abstract: Disclosed embodiments include an embedded thin-film capacitor and a magnetic inductor that are assembled in two adjacent build-up layers of a semiconductor package substrate. The thin-film capacitor is seated on a surface of a first of the build-up layers and the magnetic inductor is partially disposed in a recess in the adjacent build up layer. The embedded thin-film capacitor and the integral magnetic inductor are configured within a die shadow that is on a die side of the semiconductor package substrate.
    Type: Application
    Filed: May 3, 2019
    Publication date: December 26, 2019
    Inventors: Cheng Xu, Rahul Jain, Seo Young Kim, Kyu Oh Lee, Ji Yong Park, Sai Vadlamani, Junnan Zhao
  • Publication number: 20190385780
    Abstract: Techniques are provided for an inductor at a first level interface between a first die and a second die. In an example, the inductor can include a winding and a core disposed inside the winding. The winding can include first conductive traces of a first die, second conductive traces of a second die, and a plurality of connectors configured to connect the first die with the second die. Each connector of the plurality of connecters can be located between a trace of the first conductive traces and a corresponding trace of the second conductive traces.
    Type: Application
    Filed: June 19, 2018
    Publication date: December 19, 2019
    Inventors: Cheng Xu, Yikang Deng, Kyu Oh Lee, Ji Yong Park, Srinivas Pietambaram, Ying Wang, Chong Zhang, Rui Zhang, Junnan Zhao
  • Publication number: 20190385959
    Abstract: Techniques are provided for an inductor at a second level interface between a first substrate and a second substrate. In an example, the inductor can include a winding and a core disposed inside the winding. The winding can include first conductive traces of a first substrate, second conductive traces of a second non-semiconductor substrate, and a plurality of connectors configured to connect the first substrate with the second substrate. Each connector of the plurality of connecters can be located between a trace of the first conductive traces and a corresponding trace of the second conductive traces.
    Type: Application
    Filed: June 19, 2018
    Publication date: December 19, 2019
    Inventors: Cheng Xu, Yikang Deng, Kyu Oh Lee, Ji Yong Park, Srinivas Pietambaram, Ying Wang, Chong Zhang, Rui Zhang, Junnan Zhao
  • Publication number: 20190373736
    Abstract: Described herein are systems and methods for creating a cavity within a substrate. The systems and methods may include passing a plasma gas over a first surface of the substrate. The plasma gas may include a reactant gas. The systems and methods also may include removing a portion of the substrate by reacting the reactant gas with a constituent of the first surface of the substrate, thereby forming the cavity.
    Type: Application
    Filed: March 31, 2017
    Publication date: December 5, 2019
    Inventors: Rahul Jain, Kyu Oh Lee, Ji Yong Park, Sai Vadlamani
  • Publication number: 20190355654
    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.
    Type: Application
    Filed: May 21, 2018
    Publication date: November 21, 2019
    Applicant: Intel Corporation
    Inventors: Cheng Xu, Jiwei Sun, Ji Yong Park, Kyu Oh Lee, Yikang Deng, Zhichao Zhang, Liwei Cheng, Andrew James Brown
  • Publication number: 20190355675
    Abstract: Techniques for fabricating a semiconductor package having magnetic materials embedded therein are described. For one technique, fabrication of package includes: forming a pad and a conductive line on a build-up layer; forming a raised pad structure on the build-up layer, the raised pad comprising a pillar structure on the pad; encapsulating the conductive line and the raised pad structure in a magnetic film comprising one or more magnetic fillers; planarizing a top surface of the magnetic film until top surfaces of the raised pad structure and the magnetic film are co-planar; depositing a primer layer on the top surfaces; removing one or more portions of the primer layer above the raised pad structure to create an opening; and forming a via in the opening on the raised pad structure. The primer layer may comprise one or more of a build-up layer, a photoimageable dielectric layer, and a metal mask.
    Type: Application
    Filed: May 17, 2018
    Publication date: November 21, 2019
    Inventors: Kyu-Oh LEE, Sai VADLAMANI, Rahul JAIN, Junnan ZHAO, Ji Yong PARK, Cheng XU, Seo Young KIM
  • Patent number: 10473479
    Abstract: An electronic device is provided and includes a camera configured to obtain an image, and a location information sensor configured to obtain (or sense) a current location of the electronic device. The electronic device further includes a direction information sensor configured to obtain (or sense) direction information about a direction in which the camera obtains the image and a memory configured to store information about the current location. A processor configured to operatively connect with the location information sensor, the direction information sensor, and the memory, may be further configured to obtain map information corresponding to the current location and arrange and display an orientation of the obtained map information with an orientation corresponding to the direction information. The processor may be configured to output the obtained map information together with a live video obtained by the camera.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: November 12, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung Yeon Chung, Jong Kyun Shin, Pragam Rathore, Ki Hyoung Son, Dong Oh Lee, Kyu Hyung Choi, Won Sik Lee, Hyun Yeul Lee
  • Patent number: 10468352
    Abstract: Semiconductor packages with embedded bridge interconnects, and related assemblies and methods, are disclosed herein. In some embodiments, a semiconductor package may have a first side and a second side, and may include a bridge interconnect, embedded in a build-up material, having a first side with a plurality of conductive pads. The semiconductor package may also include a via having a first end that is narrower than a second end. The bridge interconnect and via may be arranged so that the first side of the semiconductor package is closer to the first side of the bridge interconnect than to the second side of the bridge interconnect, and so that the first side of the semiconductor package is closer to the first end of the via than to the second end of the via. Other embodiments may be disclosed and/or claimed.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: November 5, 2019
    Assignee: Intel Corporation
    Inventor: Kyu-Oh Lee
  • Patent number: 10468374
    Abstract: Examples relate to a die interconnect substrate comprising a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. The die interconnect substrate further comprises a substrate structure comprising a substrate interconnect electrically insulated from the bridge die, wherein the bridge die is embedded in the substrate structure. The die interconnect substrate further comprises a first interface structure for attaching a semiconductor die to the substrate structure, wherein the first interface structure is connected to the first bridge die pad. The die interconnect substrate further comprises a second interface structure for attaching a semiconductor die to the substrate structure, wherein the second interface structure is connected to the substrate interconnect. A surface of the first interface structure and a surface of the second interface structure are at the same height.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: November 5, 2019
    Assignee: Intel Corporation
    Inventors: Rahul Jain, Ji Yong Park, Kyu Oh Lee
  • Publication number: 20190328880
    Abstract: The present invention relates to an amphiphilic block copolymer composition which provides enhanced stability to a micelle formed by an amphiphilic block copolymer in an aqueous phase.
    Type: Application
    Filed: November 29, 2017
    Publication date: October 31, 2019
    Applicant: SAMYANG BIOPHARMACEUTICALS CORPORATION
    Inventors: Bong Oh KIM, Kyu Jin KYUNG, Sa Won LEE
  • Patent number: 10446500
    Abstract: Semiconductor packages with embedded bridge interconnects, and related assemblies and methods, are disclosed herein. In some embodiments, a semiconductor package may have a first side and a second side, and may include a bridge interconnect, embedded in a build-up material, having a first side with a plurality of conductive pads. The semiconductor package may also include a via having a first end that is narrower than a second end. The bridge interconnect and via may be arranged so that the first side of the semiconductor package is closer to the first side of the bridge interconnect than to the second side of the bridge interconnect, and so that the first side of the semiconductor package is closer to the first end of the via than to the second end of the via. Other embodiments may be disclosed and/or claimed.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: October 15, 2019
    Assignee: Intel Corporation
    Inventor: Kyu-Oh Lee
  • Publication number: 20190304933
    Abstract: Embodiments include an electronic package that includes a first layer that comprises a dielectric material and a second layer over the first layer, where the second layer comprises a magnetic material. In an embodiment, a third layer is formed over the second layer, where the third layer comprises a dielectric material. In an embodiment, the third layer entirely covers a first surface of the second layer. In an embodiment a first conductive layer and a second conductive layer are embedded within the second layer. In an embodiment, sidewalls of the first conductive layer and the second conductive layer are substantially vertical.
    Type: Application
    Filed: March 28, 2018
    Publication date: October 3, 2019
    Inventors: Cheng XU, Kyu-Oh LEE, Junnan ZHAO, Rahul JAIN, Ji Yong PARK, Sai VADLAMANI, Seo Young KIM
  • Publication number: 20190304661
    Abstract: Embodiments include an inductor that comprises an inductor trace and a magnetic body surrounding the inductor trace. In an embodiment, the magnetic body comprises a first step surface and a second step surface. Additional embodiments include an inductor that includes a barrier layer. In an embodiment, an inductor trace is formed over a first surface of the barrier layer. Embodiments include a first magnetic body over the inductor trace and the first surface of the barrier layer, and a second magnetic body over a second surface of the barrier layer opposite the first surface. In an embodiment, a width of the second magnetic body is greater than a width of the first magnetic body.
    Type: Application
    Filed: March 28, 2018
    Publication date: October 3, 2019
    Inventors: Cheng Xu, Kyu-Oh Lee, Junnan Zhao, Rahul Jain, Ji Yong Park, Sai Vadlamani, Seo Young Kim
  • Patent number: 10424561
    Abstract: An integrated circuit (IC) structure includes a first IC package (ICP), including a first resist surface provided with a first plurality of conductive contacts (CCs), a first recess including a second resist surface disposed at a bottom of the recess and having a second plurality of CCs, and a second recess, including a third resist surface disposed at a bottom of the recess and provided with a fourth plurality of CCs. The IC structure further includes an IC component with a first surface and a second surface, the second surface having a third plurality of CCs coupled to the second plurality of CCs of the first ICP. The IC structure further includes a second ICP having a first surface and a second surface, with one or more CCs located at the second surface and coupled to at least one of the first plurality of CCs of the first ICP.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: September 24, 2019
    Assignee: Intel Corporation
    Inventors: Kyu-Oh Lee, Islam A. Salama, Ram S. Viswanath, Robert L. Sankman, Babak Sabi, Sri Chaitra Jyotsna Chavali
  • Patent number: 10384431
    Abstract: A method for forming a substrate structure for an electrical component includes placing an electrically insulating laminate on a substrate and applying hot pressure to the electrically insulating laminate by a heatable plate. An average temperature of a surface temperature distribution within a center area of the heatable plate is higher than 80° C. during applying the hot pressure. Further, an edge area of the heatable plate laterally surrounds the center area and a temperature of the heatable plate within the edge area decreases from the center area towards an edge of the heatable plate during applying the hot pressure. A temperature at a location located vertically above an edge of the substrate during applying the hot pressure is at least 5° C. lower than the average temperature of the surface temperature distribution within the center area.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: August 20, 2019
    Assignee: Intel Corporation
    Inventors: Ji Yong Park, Sri Chaitra J. Chavali, Siddharth K. Alur, Kyu Oh Lee
  • Publication number: 20190244922
    Abstract: Techniques and mechanisms for providing effective connectivity with surface level microbumps on an integrated circuit package substrate. In an embodiment, different metals are variously electroplated to form a microbump which extends through a surface-level dielectric of a substrate to a seed layer including copper. The microbump includes nickel and tin, wherein the nickel aids in mitigating an absorption of seed layer copper. In another embodiment, the microbump has a mass fraction of tin, or a mass fraction of nickel, that is different in various regions along a height of the microbump.
    Type: Application
    Filed: April 16, 2019
    Publication date: August 8, 2019
    Inventors: Rahul JAIN, Kyu Oh LEE, Amanda E. SCHUCKMAN, Steve S. CHO
  • Patent number: 10373951
    Abstract: Disclosed embodiments include an embedded thin-film capacitor and a magnetic inductor that are assembled in two adjacent build-up layers of a semiconductor package substrate. The thin-film capacitor is seated on a surface of a first of the build-up layers and the magnetic inductor is partially disposed in a recess in the adjacent build up layer. The embedded thin-film capacitor and the integral magnetic inductor are configured within a die shadow that is on a die side of the semiconductor package substrate.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: August 6, 2019
    Assignee: Intel Corporation
    Inventors: Cheng Xu, Rahul Jain, Seo Young Kim, Kyu Oh Lee, Ji Yong Park, Sai Vadlamani, Junnan Zhao