Patents by Inventor KYU OH

KYU OH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10777514
    Abstract: Techniques are provided for an inductor at a second level interface between a first substrate and a second substrate. In an example, the inductor can include a winding and a core disposed inside the winding. The winding can include first conductive traces of a first substrate, second conductive traces of a second non-semiconductor substrate, and a plurality of connectors configured to connect the first substrate with the second substrate. Each connector of the plurality of connectors can be located between a trace of the first conductive traces and a corresponding trace of the second conductive traces.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: September 15, 2020
    Assignee: Intel Corporation
    Inventors: Cheng Xu, Yikang Deng, Kyu Oh Lee, Ji Yong Park, Srinivas Pietambaram, Ying Wang, Chong Zhang, Rui Zhang, Junnan Zhao
  • Patent number: 10759979
    Abstract: In the present invention, there is provided an adhesive composition which comprises carbon nanotubes and thus, exhibits high adhesive strength due to excellent lap shear strength.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: September 1, 2020
    Assignee: LG Chem, Ltd.
    Inventors: Wan Kyu Oh, Seung Young Park, Gyeong Shin Choi
  • Publication number: 20200273776
    Abstract: An integrated circuit package may be formed having a heat transfer fluid chamber, wherein the heat transfer fluid chamber may be positioned to allow a heat transfer fluid to directly contact an integrated circuit device within the integrated circuit package. In one embodiment, a first surface of the integrated circuit device may be electrically attached to a first substrate. The first substrate may then may be electrically attached to a second substrate, such that the integrated circuit device is between the first substrate and the second substrate. The second substrate may include a cavity, wherein the heat transfer fluid chamber may be formed between a second surface of the integrated circuit device and the cavity of the second substrate. Thus, at least a portion of a second surface of the integrated circuit device is exposed to the heat transfer fluid which flows into the heat transfer fluid chamber.
    Type: Application
    Filed: February 27, 2019
    Publication date: August 27, 2020
    Applicant: Intel Corporation
    Inventors: Cheng Xu, Junnan Zhao, Zhimin Wan, Ying Wang, Yikang Deng, Chong Zhang, Jiwei Sun, Zhenguo Jiang, Kyu-Oh Lee
  • Publication number: 20200271065
    Abstract: The present disclosure relates to a method for removing residual purge gas in operating an active purge system and includes determining evaporation gas purge stop in a control unit, closing a PCSV mounted on a purge line connecting a canister and an intake pipe, and determining whether all of the evaporation gas flowed into the intake pipe is flowed into a combustion chamber, so that all of the evaporation gas flowed into an intake pipe during travelling can be flowed into and combusted in the combustion chamber.
    Type: Application
    Filed: December 3, 2019
    Publication date: August 27, 2020
    Inventors: Tae-Ho Ahn, Jeong-Ho Seo, Young-Kyu Oh
  • Publication number: 20200266149
    Abstract: Techniques of protecting cored or coreless semiconductor packages having materials formed from dissimilar metals from galvanic corrosion are described. An exemplary semiconductor package comprises one or more build-up layers; first and second semiconductor components (e.g., die, EMIB, etc.) on or embedded in the one or more build-up layers. The first semiconductor component may be electrically coupled to the second semiconductor component via a contact pad and an interconnect structure that are formed in the one or more build-up layers. The contact pad can comprise a contact region, a non-contact region, and a gap region that separates the contact region from the non-contact region. Coupling of the contact pad and an interconnect structure is performed by coupling only the contact region with the interconnect structure. Also, a surface area of the contact region can be designed to substantially equal to a surface area of the interconnect structure.
    Type: Application
    Filed: December 30, 2017
    Publication date: August 20, 2020
    Inventors: Cheng XU, Junnan ZHAO, Ji Yong PARK, Kyu Oh LEE
  • Publication number: 20200251467
    Abstract: Disclosed embodiments include an embedded thin-film capacitor and a magnetic inductor that are assembled in two adjacent build-up layers of a semiconductor package substrate. The thin-film capacitor is seated on a surface of a first of the build-up layers and the magnetic inductor is partially disposed in a recess in the adjacent build up layer. The embedded thin-film capacitor and the integral magnetic inductor are configured within a die shadow that is on a die side of the semiconductor package substrate.
    Type: Application
    Filed: April 22, 2020
    Publication date: August 6, 2020
    Inventors: Cheng Xu, Rahul Jain, Seo Young Kim, Kyu Oh Lee, Ji Yong Park, Sai Vadlamani, Junnan Zhao
  • Patent number: 10727279
    Abstract: An organic light emitting diode (OLED) display device includes an OLED with a plurality of sub-pixels. A first portion of light-absorption filter layer is between the OLED and an emission surface at locations corresponding to selected sub-pixel locations. The first portion of light-absorption filter layer includes a first light-absorption dye and a second light-absorption dye such that the first portion has a light transmittance curve that has a first valley between 470 nm and 550 nm and has a second valley between 570 nm and 620 nm. At the selected sub-pixel locations, there is a color filter between the OLED and the light-absorption filter.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: July 28, 2020
    Assignee: LG Display Co., Ltd.
    Inventors: Su-Jin Chang, Ji-Su Yoon, Je-Beom Park, Dong-Ryul Jung, Kyu-Oh Kwon, Min-Jae Kang
  • Patent number: 10724015
    Abstract: The present invention relates to a mutant microorganism in which a gene that encodes phosphofructokinase-2 is disrupted or deleted to reduce glycolytic flux to thereby improve the ability of the microorganism to produce N-acetylglucosamine, and to a method of producing N-acetylglucosamine using the mutant microorganism. The mutant microorganism according to the present invention has advantages in that it has high resistance to various chemical substances, grows rapidly, is easily cultured, and produces N-acetylglucosamine with high efficiency, indicating that it is useful for production of a large amount of N-acetylglucosamine.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: July 28, 2020
    Assignee: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Min-Kyu Oh, Sang-Woo Lee
  • Patent number: 10704483
    Abstract: A blended fuel injection control method may include a cold-starting determination step in which a controller determines whether a cold-starting condition is satisfied on the basis of output values that can be obtained by a vehicle; a detection step in which the controller detects the content of ethanol in blended fuel of gasoline and ethanol when determining the cold-starting condition is satisfied; and a first injection control step in which the controller controls the blended fuel to be injected selectively in one of a Multi-Point Injection (MPI) mode, an MPI & GDI mode combining MPI and Gasoline Direct Injection (GDI) modes, and a GDI mode in accordance with the content of ethanol in the blended fuel until an engine RPM reaches an early peak RPM in engine-cranking.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: July 7, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventor: Young Kyu Oh
  • Patent number: 10704479
    Abstract: An active fuel vapor purge system includes: a turbocharger having a turbine and a compressor; a canister collecting fuel vapor; a purge pump pumping the collected fuel vapor; a main purge line connecting the canister and the purge pump; a first purge line branched from the main purge line and joined to an intake manifold at downstream of the compressor; a second purge line branched from the main purge line and jointed to an intake line at upstream of the compressor; purge control solenoid valves respectively disposed in the first purge line and the second purge line; a hydrocarbon sensor measuring an amount of hydrocarbon; a pressure sensor measuring an upstream pressure and a downstream pressure of the purge pump; and a controller controlling operation of the purge pump based on the amount of hydrocarbon and pressures at a front end and at a rear end of the purge pump.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: July 7, 2020
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Young Kyu Oh, Jeong Ho Seo, Yong Seok Kim, Yeong Jin Nam, Taeho Ahn, Sung Wook Park
  • Publication number: 20200211927
    Abstract: Microelectronic assemblies that include a cooling channel, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a surface, a die having a surface, and a fluidic channel between the surface of the die and the surface of the package substrate, wherein a top surface of the fluidic channel is defined by the surface of the die and a bottom surface of the fluidic channel is defined by the surface of the package substrate. In some embodiments, a microelectronic assembly may include a package substrate having a surface; a die having a surface; and an interposer having a fluidic channel between the surface of the die and the surface of the package substrate.
    Type: Application
    Filed: December 27, 2018
    Publication date: July 2, 2020
    Applicant: Intel Corporation
    Inventors: Zhimin Wan, Cheng Xu, Yikang Deng, Junnan Zhao, Ying Wang, Chong Zhang, Kyu Oh Lee, Chandra Mohan Jha, Chia-Pin Chiu
  • Publication number: 20200209464
    Abstract: Disclosed are a backlight unit for planar lighting apparatuses and a manufacturing method thereof. The backlight unit simplifies a layer structure to be formed into the shape of a vehicle interior trim part, and has a thin thickness and improved flexibility. The backlight unit includes a light emitting device configured to emit light; a light guide panel having polycarbonate and configured to disperse the light received from a light emitting device; a reflective sheet having fibers and provided below the light guide panel to reflect the light dispersed by the light guide panel; and an acrylic adhesive sheet interposed between the light guide panel and the reflective sheet. The reflective sheet includes pores.
    Type: Application
    Filed: October 9, 2019
    Publication date: July 2, 2020
    Inventors: Hong Chan JEON, Hong Mo KOO, Mi Jung YUN, Dong Kyu OH, Seul Ah LEE, Byoung Chul PARK
  • Patent number: 10692847
    Abstract: Discussed generally herein are methods and devices for multichip packages that include an inorganic interposer. A device can include a substrate including low density interconnect circuitry therein, an inorganic interposer on the substrate, the inorganic interposer including high density interconnect circuitry electrically connected to the low density interconnect circuitry, the inorganic interposer including inorganic materials, and two or more chips electrically connected to the inorganic interposer, the two or more chips electrically connected to each other through the high density interconnect circuitry.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: June 23, 2020
    Assignee: Intel Corporation
    Inventors: Daniel Sobieski, Kristof Darmawikarta, Sri Ranga Sai Boyapati, Merve Celikkol, Kyu Oh Lee, Kemal Aygun, Zhiguo Qian
  • Publication number: 20200191085
    Abstract: A method for controlling the air-fuel ratio of a vehicle includes: calculating the air amount charged in a cylinder of an engine by using a fresh air amount, a residual air amount remaining inside the cylinder of the engine, and a backflow gas amount flowing back into the cylinder upon the valve overlap of an intake vale and an exhaust valve of the engine, correcting it with the purge gas flow rate supplied to an intake manifold of the engine when the active purge system is operated, calculating the final fuel amount by correcting the fuel amount injected by a fuel injection device with the amount of the fuel component contained in the purge gas when the active purge system is operated, and controlling the air-fuel ratio based on the final air amount and the final fuel amount.
    Type: Application
    Filed: November 4, 2019
    Publication date: June 18, 2020
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventor: Young-Kyu OH
  • Publication number: 20200182206
    Abstract: An intake and exhaust system for preventing generation of condensed water may include: an exhaust gas recirculation (EGR) system circulating some of combustion gas from an exhaust pipe to an intake pipe; an active purging system compressing and supplying evaporation gas generated from a fuel tank to the intake pipe; and a controller to control the EGR system and the active purging system. In particular, the controller calculates a saturated water vapor pressure based on temperature at a position between the EGR system and the intake pipe, and calculates a saturated water vapor pressure based on temperature of the intake pipe and then compares one of the two saturated water vapor pressures with a water vapor pressure of intake air so as to reduce an EGR rate of the EGR system or a purging rate of the active purging system based on the comparison result.
    Type: Application
    Filed: November 4, 2019
    Publication date: June 11, 2020
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Young-Kyu OH, Tae-Ho Ahn, Keum-Jin Park
  • Publication number: 20200185300
    Abstract: An integrated circuit (IC) package comprises a substrate comprising a dielectric and a thermal conduit that is embedded within the dielectric. The thermal conduit has a length that extends laterally within the dielectric from a first end to a second end. An IC die is thermally coupled to the first end of the thermal conduit. The IC die comprises an interconnect that is coupled to the first end of the thermal conduit. An integrated heat spreader comprises a lid over the IC die and at least one sidewall extending from the edge of the lid to the substrate that is thermally coupled to the second end of the thermal conduit.
    Type: Application
    Filed: December 10, 2018
    Publication date: June 11, 2020
    Applicant: INTEL CORPORATION
    Inventors: Cheng Xu, Zhimin Wan, Lingtao Liu, Yikang Deng, Junnan Zhao, Chandra Mohan Jha, Kyu-oh Lee
  • Publication number: 20200182173
    Abstract: A mixed fuel amount control system applying active purging includes: a fuel tank in which biofuel and fossil fuel are mixed and stored, an active purging device to supply an evaporated gas evaporated in the fuel tank to an intake pipe, and a concentration sensor to sense a mixing ratio of the biofuel stored in the fuel tank changes. In particular, the flow rate and the concentration of the evaporated gas of the fuel tank flowing into the intake pipe are changed according to a mixing ratio of biofuel and fossil fuel.
    Type: Application
    Filed: November 7, 2019
    Publication date: June 11, 2020
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Young-Kyu OH, Keum-Jin PARK
  • Publication number: 20200173383
    Abstract: An evaporation gas active purge system may include a purge line of connecting a canister for absorbing an evaporation gas of a fuel tank to an intake pipe; a purge pump mounted on the purge line; a purge valve mounted on the purge line to be disposed between the purge pump and the intake pipe; a pressure sensor mounted on the purge line to be disposed between the purge pump and the purge valve; and a control unit of receiving a signal from the pressure sensor, and transmitting an operating signal to the purge pump and the purge valve, wherein the control unit controls the purge pump and the purge valve by an engine condition and a vehicle speed.
    Type: Application
    Filed: November 11, 2019
    Publication date: June 4, 2020
    Applicants: Hyundai Motor Gompany, Kia Motors Gorporation
    Inventor: Young-Kyu Oh
  • Publication number: 20200168384
    Abstract: Described herein are magnetic core inductors (MCI) and methods for manufacturing magnetic core inductors. A first embodiment of the MCI can be a snake-configuration MCI. The snake-configuration MCI can be formed by creating an opening in a base material, such as copper, and providing a nonconductive magnetic material in the opening. The inductor can be further formed by forming plated through holes into the core material. The conductive elements for the inductor can be formed in the plated through holes. The nonconductive magnetic material surrounds each conductive element and plated through hole. In embodiments, a layered coil inductor can be formed by drilling a laminate to form a cavity through the laminate within the metal rings of the layered coil inductor. The nonconductive magnetic material can be provided in the cavity.
    Type: Application
    Filed: September 28, 2017
    Publication date: May 28, 2020
    Applicant: Intel Corporation
    Inventors: Junnan Zhao, Ying Wang, Cheng Xu, Kyu Oh Lee, Sheng Li, Yikang Deng
  • Publication number: 20200168569
    Abstract: Semiconductor packages having a first layer interconnect portion that includes a coaxial interconnect between a die and a package substrate are described. In an example, the package substrate includes a substrate-side coaxial interconnect electrically connected to a signal line. The die is mounted on the package substrate and includes a die-side coaxial interconnect coupled to the substrate-side coaxial interconnect. The coaxial interconnects can be joined by a solder bond between respective central conductors and shield conductors.
    Type: Application
    Filed: March 30, 2017
    Publication date: May 28, 2020
    Inventors: Sai VADLAMANI, Aleksandar ALEKSOV, Rahul JAIN, Kyu Oh LEE, Kristof Kuwawi DARMAWIKARTA, Robert Alan MAY, Sri Ranga Sai BOYAPATI, Telesphor KAMGAING