Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.

Abstract: Provided is a method of preparing an acrylonitrile dimer, the method including: supplying an acrylonitrile monomer, a phosphorus-based catalyst, an alcohol solvent, and an ionic liquid to a reactor to perform a dimerization reaction to prepare a single-phase dimerization reaction product (S10); supplying a reactor discharge stream including the dimerization reaction product to a first distillation column, separating the alcohol solvent and an unreacted acrylonitrile monomer from an upper discharge stream, and supplying a lower discharge stream including an acrylonitrile dimer, the ionic liquid, and the phosphorus-based catalyst to a second distillation column (S20); and separating an upper discharge stream including the acrylonitrile dimer and separating a lower discharge stream including the ionic liquid and the phosphorus-based catalyst, from the second distillation column (S30).

Abstract: Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a package substrate with a die side and a land side. In an embodiment, a pad is on the land side. In an embodiment, a dielectric layer covers sidewalls of the pad, and a surface finish is over an exposed surface of the pad.

Abstract: The present invention relates to an air conditioner for a vehicle, which can remarkably improve resistance against an air flow in an air passageway, thereby enhancing efficiency. The air conditioner for a vehicle includes: a case having an air inlet, an air outlet, and an air passageway formed therein; a blower unit for blowing air to the air inlet; and a cooling means and a heating means disposed in the air passageway of the case in an air flow direction in order, wherein the air outlet of the case includes a floor outlet and vent outlets, the floor outlet and the vent outlets are arranged below the heating means in a height direction, and the floor outlet is arranged within a range of the width of the heating means.

Abstract: The present disclosure relates to an active purge system and an active purge method for a hybrid vehicle, and changes a control method for the throughput of the evaporation gas according to the engine torque according to a change in an optimal operating line, the system efficiency, or the state of charge (SOC) condition of a battery using an active purge unit for pressing the evaporation gas generated by a fuel tank and supplying the pressed evaporation gas to an intake pipe, thereby efficiently purging the evaporation gas.

Abstract: Techniques for fabricating a semiconductor package having magnetic materials embedded therein are described. For one technique, fabrication of package includes: forming a pad and a conductive line on a build-up layer; forming a raised pad structure on the build-up layer, the raised pad comprising a pillar structure on the pad; encapsulating the conductive line and the raised pad structure in a magnetic film comprising one or more magnetic fillers; planarizing a top surface of the magnetic film until top surfaces of the raised pad structure and the magnetic film are co-planar; depositing a primer layer on the top surfaces; removing one or more portions of the primer layer above the raised pad structure to create an opening; and forming a via in the opening on the raised pad structure. The primer layer may comprise one or more of a build-up layer, a photoimageable dielectric layer, and a metal mask.

Abstract: Embodiments disclosed herein include electronic packages with fin pitch first level interconnects. In an embodiment, the electronic package comprises a die and a package substrate attached to the die by a plurality of first level interconnects (FLIs). In an embodiment, individual ones of the plurality of FLIs comprise, a first pad on the package substrate, a solder on the first pad, a second pad on the die, and a bump on the second pad. In an embodiment, the bump comprises a porous nanostructure, and the solder at least partially fills the porous nanostructure.

Abstract: Techniques are provided for an inductor at a first level interface between a first die and a second die. In an example, the inductor can include a winding and a core disposed inside the winding. The winding can include first conductive traces of a first die, second conductive traces of a second die, and a plurality of connectors configured to connect the first die with the second die. Each connector of the plurality of connecters can be located between a trace of the first conductive traces and a corresponding trace of the second conductive traces.

Abstract: Methods/structures of forming embedded inductor structures are described. Embodiments include forming a first interconnect structure on a dielectric material of a substrate, selectively forming a magnetic material on a surface of the first interconnect structure, forming an opening in the magnetic material, and forming a second interconnect structure in the opening. Build up layers are then formed on the magnetic material.

Abstract: The disclosure in the specification relates to an artificial recombinant chromosome and the use thereof, and more particularly to an artificial recombinant chromosome generated by the recombination of two or more chromosomes and a production of a transgenic animal using a cell including the same. Especially, in the disclosure in the specification, an interchromosomal exchange between the recipient chromosome and the donor chromosome has many merits to produce the artificial recombinant chromosome for producing the transgenic animal.

Abstract: The present invention relates to an air conditioner for a vehicle, which can remarkably improve resistance against an air flow in an air passageway, thereby enhancing efficiency. The air conditioner for a vehicle includes: a case having an air inlet, an air outlet, and an air passageway formed therein; a blower unit for blowing air to the air inlet; and a cooling means and a heating means disposed in the air passageway of the case in an air flow direction in order, wherein the air outlet of the case includes a floor outlet and vent outlets, the floor outlet and the vent outlets are arranged below the heating means in a height direction, and the floor outlet is arranged within a range of the width of the heating means.

Abstract: A method of compensating fuel for each cylinder of an engine during purging may include, compensating a fuel injection time for each cylinder depending on an amount of intake air for each cylinder, an injection pressure of the injector, and an internal pressure of a combustion chamber of the engine; pressurizing a vaporized gas adsorbed into a canister and injecting the pressurized vaporized gas into the intake pipe by operating an active purge pump; and estimating an amount of vaporized gas reaching each combustion chamber and converting the fuel injection time depending on the estimated amount of vaporized gas.

Abstract: A drying apparatus includes a main body composed of a front end frame and a rear end frame. A fan receiving part may be disposed on the upper end of the front end frame and protruding forward therefrom, and a fan assembly may be located in the fan receiving part. The open part may be disposed at the lower part of the fan receiving part of the front end frame, and the outlets may be located along the upper end edge and opposite edges of the open part. Air may be delivered to the outlets through the duct disposed at the main body.

Abstract: Disclosed herein are integrated circuit (IC) package substrates formed with a dielectric bi-layer, and related devices and methods. In some embodiments, an IC package substrate is fabricated by: forming a raised feature on a conductive layer; forming a dielectric bi-layer on the conductive layer, where the dielectric bi-layer includes a first sub-layer having a first material property and a second sub-layer having a second material property, and where the top surface of the second sub-layer is substantially planar with the top surface of the raised feature; and removing the first sub-layer until the second material property is detected to reveal the conductive feature. In some embodiments, an IC package substrate is fabricated by: forming a dielectric bi-layer on a patterned conductive layer, where the first sub-layer is less susceptible to removal than the second sub-layer; forming an opening in the dielectric bi-layer; etching; and forming a via having vertical sidewalls.

Abstract: An embodiment discloses an ultraviolet light emitting element including: a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer, and an etched region in which the first conductive semiconductor layer is exposed; a first insulating layer disposed on the light emitting structure and including a first hole which exposes a portion of the etched region; a first electrode electrically connected to the first conductive semiconductor layer; and a second electrode electrically connected to the second conductive semiconductor layer, wherein the light emitting structure includes an intermediate layer regrown on the first conductive semiconductor layer exposed in the first hole, the first electrode is disposed on the intermediate layer, the etched region includes a first etched region disposed at an inner side and a second etched region disp

Abstract: A drying apparatus is proposed. When at least one drying condition of a discharge position, a temperature, air volume, and the drying area of air is selected, the drying apparatus may discharge air according to the selected drying condition. The discharge of the air may be performed from the main body (10) and a moving bar (230) moving up and down along the front surface of the main body (100). The drying condition may be automatically or manually selected. The drying area may include entire body and partial body. The moving bar (230) may discharge air while moving up and down within a height range corresponding to the selected drying area, and may improve the effect of drying a user's body in cooperation with air discharged from the main body (100).

Abstract: A main body (100) may constitute the frame of a drying apparatus, and a moving bar (230) may be mounted to the main body (100) to move up and down along the front surface thereof. The moving bar (230) may be moved up and down by being driven by the drive assembly (210). Most of the drive assembly (210) may be installed at a position corresponding to the installation space (150) of a duct (130) formed in the main body (100).

Abstract: A drying apparatus is proposed. A moving bar (230) may be mounted to a main body (100) of the drying apparatus to move relative thereto. The inlet (248) may be formed in a side of a lower surface of the moving bar (230), the inlet allowing air to be introduced into the moving bar (230). The bar fan assembly (250) may be provided in the moving bar (230). The nozzle slot (245?) may be formed in the moving bar (230), the nozzle slot allowing the air to be discharged slantingly toward a front lower part of the main body (100). A bar casing (232) having an open lower part and a bar cover (242) covering the open lower part may constitute the exterior of the moving bar (230).

Abstract: A filter assembly and a drying apparatus having the filter assembly are proposed. The filter assembly (180) may purify air introduced into the main body (100) of the drying apparatus. The filter assembly (180) may be protruded by a predetermined distance to a side surface of the main body (100) by the moving plate (190). The filter frame (182) protruded by the moving plate (190) may be removed from the moving plate (190) to perform maintenance of filters (184, 186, 188).

Abstract: A drying apparatus is proposed. A main body (100) may constitute the frame of the drying apparatus. A front end frame (102) and a rear end frame (106) may constitute the exterior of the main body (100). A moving bar (230) may discharge air while moving up and down along the front surface of the main body (100). A duct (130) may be installed in the main body (100), and air flown by a fan assembly (160) may be separated in the duct and be discharged to a user through the edges of the front surface of the main body to dry the user. A drive assembly (210) moving the moving bar (230) up and down may be installed in the installation space (150) defined in the duct (130).