Abstract: A method of determining an air volume in an active purge system may include checking whether an engine operates in an idle state; determining an air volume reaching a combustion chamber of the engine in response to a signal received from a sensor provided in an intake pipe; checking whether an evaporation gas collected in a canister is introduced into the intake pipe; estimating an amount of the evaporation gas introduced into the intake pipe and primarily correcting the air volume determined according to the estimated amount of the evaporation gas; checking whether an opening holding time of an intake valve in the engine is varied due to an operation of a continuously variable valve duration (CVVD) system electrically connected to the controller; and deriving a correction variable by substituting an operation duty of the CVVD system into a formula, a table, or a map provided in advance, and secondarily correcting the primarily corrected air volume according to the correction variable.

Abstract: A two-component adhesive composition includes: (i) a first part of a (meth)acrylate-based monomer mixture including components (a1) to (a3) below: (a1) an alkyl (meth)acrylate compound, and any one or more of a (meth)acrylate compound having an alkoxysilyl group, and a (meth)acrylate compound having an unsaturated functional group except for an acryloyl group, (a2) 50 to 100 parts by weight of an adhesive reinforcing agent relative to the 100 parts by weight of the (meth)acrylate-based monomer mixture, and (a3) 1 to 10 parts by weight of a filler relative to the 100 parts by weight of the (meth)acrylate-based monomer mixture; and (ii) a second part including components (b1) and (b2) below with a weight ratio of 1:1 to 20:1, where (b1) 100 parts by weight of an epoxy resin, and (b2) 50 to 150 parts by weight of an initiator with respect to (b1).

Abstract: An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.

Abstract: A method of securing brake booster negative pressure is provided. The method includes operating a purge pump that is connected to a canister having evaporation gas absorbed thereon and a brake booster and determining whether the evaporation gas is injected into an intake pipe by the operation of the purge pump. Whether a negative pressure of the brake booster is insufficient is determined and when the evaporation gas is being injected into the intake pipe and the negative pressure is insufficient, a degree of opening of a valve provided in a line connecting the canister and the purge pump is adjusted.

Abstract: Disclosed embodiments include an embedded thin-film capacitor and a magnetic inductor that are assembled in two adjacent build-up layers of a semiconductor package substrate. The thin-film capacitor is seated on a surface of a first of the build-up layers and the magnetic inductor is partially disposed in a recess in the adjacent build up layer. The embedded thin-film capacitor and the integral magnetic inductor are configured within a die shadow that is on a die side of the semiconductor package substrate.

Abstract: The disclosure in the specification relates to an artificial recombinant chromosome and the use thereof, and more particularly to an artificial recombinant chromosome generated by the recombination of two or more chromosomes and a production of a transgenic animal using a cell including the same. Especially, in the disclosure in the specification, an interchromosomal exchange between the recipient chromosome and the donor chromosome has many merits to produce the artificial recombinant chromosome for producing the transgenic animal.

Abstract: Embodiments are generally directed to indium solder metallurgy to control electro-migration. An embodiment of an electronic device includes a die; and a package substrate, wherein the die is bonded to the package substrate by an interconnection. The interconnection includes multiple interconnects, and wherein the interconnection includes a solder. The solder for the interconnection includes a combination of tin (Sn), copper (Cu), and indium (In).

Abstract: A semiconductor package may include a semiconductor package first side, an embedded bridge interconnect, a first via, and a second via. The bridge interconnect may include a bridge interconnect first side with a conductive pad and a bridge interconnect second side. The distance between the bridge interconnect first side and the semiconductor package first side may be less than a distance between the bridge interconnect second side and the semiconductor package first side. The first and second vias may each include a first end that is narrower than a second end. The semiconductor package first side may be closer to the first end of the first via than the second end of the first via, and closer to the second end of the second via than the first end of the second via. The first side of the semiconductor package may be configured to electrically couple to a die.

Abstract: An active purge system for a hybrid vehicle may include an active purge unit for compressing evaporation gas generated in a fuel tank and supplying the compressed evaporation gas to an intake pipe. The active purge system may further include a control unit for controlling the active purge unit, wherein the control unit controls an amount of the evaporation gas to be purged according to a state of charge of a battery.

Abstract: The present invention provides a gene including an M13 p5 expressing cassette, which includes a promoter, a ribosome binding site (RBS) and a protein 5 (p5) coding region, wherein at least one base of sequences between the RBS and the p5 coding region is mutated. Using this gene may increase production of single-stranded DNA.

Abstract: The disclosure in the specification relates to an artificial recombinant chromosome and the use thereof, and more particularly to an artificial recombinant chromosome generated by the recombination of two or more chromosomes and a production of a transgenic animal using a cell including the same. Especially, in the disclosure in the specification, an interchromosomal exchange between the recipient chromosome and the donor chromosome has many merits to produce the artificial recombinant chromosome for producing the transgenic animal.

Abstract: An active purge system includes a canister in which a vaporized gas produced in an fuel tank is collected and a purge line that connects the canister to an intake pipe. A purge pump is mounted in the purge line, a purge valve is mounted in the purge line to be positioned between the purge pump and the intake pipe, and a cylinder is connected to the intake pipe. A valve controller changes the operation timing, operation maintenance time, and the operation degree of an intake valve and an exhaust valve disposed at the upper portion of the cylinder. A compression ratio variation device is mounted on a connecting rod and a crankshaft that are connected to a piston to change the top dead center or the bottom dead center of the piston reciprocating in the cylinder.

Abstract: A method of compensating fuel for each cylinder of an engine during purging may include, compensating a fuel injection time for each cylinder depending on an amount of intake air for each cylinder, an injection pressure of the injector, and an internal pressure of a combustion chamber of the engine; pressurizing a vaporized gas adsorbed into a canister and injecting the pressurized vaporized gas into the intake pipe by operating an active purge pump; and estimating an amount of vaporized gas reaching each combustion chamber and converting the fuel injection time depending on the estimated amount of vaporized gas.

Abstract: An active purge system includes a canister in which a vaporized gas produced in an fuel tank is collected and a purge line that connects the canister to an intake pipe. A purge pump is mounted in the purge line, a purge valve is mounted in the purge line to be positioned between the purge pump and the intake pipe, and a cylinder is connected to the intake pipe. A valve controller changes the operation timing, operation maintenance time, and the operation degree of an intake valve and an exhaust valve disposed at the upper portion of the cylinder. A compression ratio variation device is mounted on a connecting rod and a crankshaft that are connected to a piston to change the top dead center or the bottom dead center of the piston reciprocating in the cylinder.

Abstract: Techniques are provided for an inductor at a second level interface between a first substrate and a second substrate. In an example, the inductor can include a winding and a core disposed inside the winding. The winding can include first conductive traces of a first substrate, second conductive traces of a second non-semiconductor substrate, and a plurality of connectors configured to connect the first substrate with the second substrate. Each connector of the plurality of connectors can be located between a trace of the first conductive traces and a corresponding trace of the second conductive traces.

Abstract: An active purge system may include: a canister to collect therein an evaporation gas evaporated from a fuel tank; a purge line to connect the canister to an intake pipe; a purge pump to pressurize the evaporation gas to allow the evaporation gas to move from the canister to the intake pipe; a purge valve installed on the purge line to be located between the purge pump and the intake pipe; and an engine connected to the intake pipe. In particular, the engine includes an injector installed on a cylinder head, an intake valve, and an exhaust valve.

Abstract: Disclosed are a backlight unit for planar lighting apparatuses and a manufacturing method thereof. The backlight unit simplifies a layer structure to be formed into the shape of a vehicle interior trim part, and has a thin thickness and improved flexibility. The backlight unit includes a light emitting device configured to emit light; a light guide panel having polycarbonate and configured to disperse the light received from a light emitting device; a reflective sheet having fibers and provided below the light guide panel to reflect the light dispersed by the light guide panel; and an acrylic adhesive sheet interposed between the light guide panel and the reflective sheet. The reflective sheet includes pores.

Abstract: A method of securing brake booster negative pressure is provided. The method includes operating a purge pump that is connected to a canister having evaporation gas absorbed thereon and a brake booster and determining whether the evaporation gas is injected into an intake pipe by the operation of the purge pump. Whether a negative pressure of the brake booster is insufficient is determined and when the evaporation gas is being injected into the intake pipe and the negative pressure is insufficient, a degree of opening of a valve provided in a line connecting the canister and the purge pump is adjusted.

Abstract: An intake and exhaust system for preventing generation of condensed water may include: an exhaust gas recirculation (EGR) system circulating some of combustion gas from an exhaust pipe to an intake pipe; an active purging system compressing and supplying evaporation gas generated from a fuel tank to the intake pipe; and a controller to control the EGR system and the active purging system. In particular, the controller calculates a saturated water vapor pressure based on temperature at a position between the EGR system and the intake pipe, and calculates a saturated water vapor pressure based on temperature of the intake pipe and then compares one of the two saturated water vapor pressures with a water vapor pressure of intake air so as to reduce an EGR rate of the EGR system or a purging rate of the active purging system based on the comparison result.

Abstract: Embodiments include semiconductor packages. A semiconductor package includes a plurality of build-up layers and a plurality of conductive layers in the build-up layers. The conductive layers include a first conductive layer and a second conductive layer. The first conductive layer is over the second conductive layer and build-up layers, where a first via couples the first and second conductive layers. The semiconductor package also includes a thin film capacitor (TFC) in the build-up layers, where a second via couples the TFC to the first conductive layer, and the second via has a thickness less than a thickness of the first via. The first conductive layer may be first level interconnects. The build-up layers may be dielectrics. The TFC may include a first electrode, a second electrode, and a dielectric. The first electrode may be over the second electrode, and the dielectric may be between the first and second electrodes.