Abstract: A method of fabricating a packaging substrate is provided, including: providing a carrier having two carrying portions, each of the carrying portions having a first side and a second side opposite to the first side and the carrying portions are bonded through the second sides thereof; forming a circuit layer on the first side of each of the carrying portions; and separating the two carrying portions from each other to form two packaging substrates. The carrying portions facilitate the thinning of the circuit layers and provide sufficient strength for the packaging substrates to undergo subsequent packaging processes. The carrying portions can be removed after the packaging processes to reduce the thickness of packages and thereby meet the miniaturization requirement.

Abstract: A method of forming a device is disclosed. A substrate defined with a device region is provided. A gate having an upper and a lower portion is formed in a trench in the substrate in the device region. The upper portion forms a gate electrode and the lower portion forms a gate field plate. First and second surface doped regions are formed adjacent to the gate. The gate field plate introduces vertical reduced surface (RESURF) effect in a drift region of the device.

Abstract: A method of forming a device is disclosed. A substrate defined with a device region is provided. A gate having a gate electrode, first and second gate dielectric layers is formed in a trench. The trench has an upper trench portion and a lower trench portion. A field plate is formed in the trench. First and second diffusion regions are formed. The gate is displaced from the second diffusion region.

Abstract: A magnetic-controlled actuator (100) with an auto-locking function for joints of a manipulation arm mainly includes an inner-layer stator (10), an inner-layer mover (20), an outer-layer mover (30), an outer-layer stator (40), and a fixing shaft (50). The inner-layer mover (20), the outer-layer mover (30), and the outer-layer stator (40) have a plurality of permanent magnets, respectively. The fixed shaft (50) simultaneously penetrates through the inner-layer stator (10), the inner-layer mover (20), the outer-layer mover (30), and the outer-layer stator (40) forming a coaxial arrangement. The inner-layer mover (20) rotates relatively to the inner-layer stator (10) to output power from the actuator (100). Therefore, a cogging effect, which is produced due to interaction of the permanent magnets between the outer-layer mover (30) and the outer-layer stator (40), is automatically produces a high cogging torque for the actuator (100).

Abstract: A fabrication method of a semiconductor package is provided, which includes the steps of: forming a packaging substrate on a first carrier; bonding a second carrier to the packaging substrate; removing the first carrier; disposing a chip on the packaging substrate; forming an encapsulant on the packaging substrate for encapsulating the chip; and removing the second carrier. The first and second carriers provide the thin-type packaging substrate with sufficient rigidity for undergoing the fabrication processes without cracking or warpage, thereby meeting the miniaturization requirement and improving the product yield.

Abstract: A support structure includes a base, a pair of stands, a top hinge, and a pair of holding arms. The stands are rotatably connected to one end of the base to support the base. The top hinge is rotatably connected to the other end of the base opposite to the stands. The rotation plane of the top hinge is perpendicular to the rotation plane of the stands. The holding arms are rotatably connected to the top hinge for holding an object at any desired angle.

Abstract: An exemplary adjustable stand mechanism for supporting an electronic device includes a holding member for holding the electronic device and a support member for supporting the holding member at a selected one of different inclined angles. The support member includes a first stand rotatably engaged with the holding member, and a second stand also rotatably engaged with the holding member. The first stand selectably supports the holding member and provides a first inclined angle for the holding member. The second stand selectably supports the holding member and provides a second inclined angle for the holding member which is different from the first inclined angle.

Abstract: A substrate structure includes a substrate body and a plurality of conductive pads formed on the substrate body and each having a first copper layer, a nickel layer, a second copper layer and a gold layer sequentially stacked. The thickness of the second copper layer is less than the thickness of the first copper layer. As such, the invention effectively enhances the bonding strength between the conductive pads and solder balls to be mounted later on the conductive pads, and prolongs the duration period of the substrate structure.

Abstract: A coil structure for a coreless motor includes a plurality of first conductive traces and a plurality of second conductive traces. The first conductive traces are disposed in succession relative to one another, and are each arranged into a planar spiral configuration having a substantially polygonal shape. At least one adjacent pair of the first conductive traces cooperate to define a space therebetween. Each of the second conductive traces is disposed in the space defined by a corresponding adjacent pair of the first conductive traces, and is arranged into a planar spiral configuration that has one of a substantially triangular shape and a substantially rhombic shape so as to substantially fill the space.

Abstract: A remote conference management system includes a conferencing control terminal and a conferencing terminal in electronic communication with the conferencing control terminal. The conferencing control terminal includes a multipoint control unit that stores a plurality of predetermined face images of anticipated meeting participants. The conferencing terminal includes an image recording unit and a signal control unit. The image recording unit records face images of current participants. The signal control unit receives the face images from the image recording unit and transmits the face image to the MCU. The MCU compares the received face images with the prestored face images, and creates and communicates attendance information of the current participants according to the comparison.

Abstract: A charger includes a housing defining a receiving cavity, two through holes defined in the housing communicating with the receiving cavity, two slots defined in the housing, a fuse and a spring member received in the receiving cavity, a cap movably coupled to the housing, and an anode contact. The anode contact abuts between the spring member and the fuse engaging with the cap. A hooks engages in the through holes to prevent the cap from detaching from the housing, being disengageable from the through holes when pushed by a pin inserted into the through holes allowing the spring member to push the cap to move until the hooks engage in the slots. The cap is rotated a predetermined angel until the hooks are slidably received in a receiving grooves, thereby allowing the cap to be detachable from the housing through the opening.

Abstract: An LED lamp includes a socket and a shallow dish-shaped body detachably connected to the socket. The socket is electrically connected to an external power source. The body includes a rear cover, a transparent front cover, a lamp board, a number of LED light sources, a driving circuit board and a fixing member. The LED light sources are mounted on the lamp board facing the front cover, wherein the LED light sources are visible from an outside of the transparent front cover when they are lit. The driving circuit board is electrically connected to the socket and the lamp board, and is configured for driving the LED light sources to emit light beams. The fixing member is configured for fixing the rear cover, the driving circuit board and the lamp board together.

Abstract: A foldable support for supporting a portable computing device includes a main frame, a back plate, and a hinge assembly connecting the back plate to the main frame, the hinge assembly being able to position and lock the back plate in a desired position with respect to the main frame. A base member is rotatably connected to a bottom of the main frame. When the portable computing device is supported by the foldable support, a back of the portable computing device rests against the main frame, and a bottom of the portable computing device rests on the base member.

Abstract: An LED lamp includes a socket and a shallow dish-shaped body detachably connected to the socket. The body includes a rear cover, a front cover, a fixing member, a lamp board, a number of LED light sources and a driving circuit board. The fixing member includes a ring-shaped fixing element. The lamp board is mounted on an external circumferential surface of the fixing element, the LED light sources are mounted on the lamp board facing an inside of the rear cover. The driving circuit board is configured to drive the LED light sources to emit light beams towards the rear cover. The rear cover is configured for allowing a portion of the light beams from the LED light sources to pass therethrough and reflecting remaining portion of the light beams to the front cover, and the front cover is configured for allowing the reflected light to pass therethrough.

Abstract: A semiconductor package includes: a dielectric layer having opposing first and second surfaces and side surfaces; a copper wiring layer disposed on the first surface of the dielectric layer and having extension pads; a surface processing layer disposed on the wiring layer; a semiconductor chip disposed on the wiring layer and electrically connected to the surface processing layer; and an encapsulant disposed on the first surface of the dielectric layer for encapsulating the semiconductor chip, the wiring layer and the surface processing layer while exposing the second surface of the dielectric layer. Further, vias are disposed between the side surfaces of the dielectric layer and the encapsulant such that the extension pads are exposed from the vias so as for solder balls to be disposed thereon. Due to improved electrical connection between the copper and solder materials, the electrical connection quality of the package is improved.

Abstract: A support device includes a support element, a plurality of legs rotatably connected to the support element which can be rotated to be changed from an unfolded state and a folded state, and a main body sleeves the support element. When the legs are rotated to be in the unfolded state, the legs cooperate with the support element to support an electronic device, and when the legs are rotated to be in the folded state, the main body sleeves on the support element receiving the legs.

Abstract: A manufacturing method for a stator structure and a micromotor having the same. The method includes: providing a flexible printed circuit (FPC) on which configuration positions of coil windings and a configuration position of at least one position signal generating unit are formed, wherein the FPC is further provided with an interface part; disposing the coil windings and the position signal generating unit on the coil winding configuration positions and the position signal generating unit configuration position, respectively, wherein the interface part is further provided with a connector pattern which is electrically coupled with the coil windings and the position signal generating unit; forming a FPC assembly including the coil windings and the position signal generating unit; and winding the FPC assembly to form the stator. The stator is applied in a micromotor in which a rotor, the stator and a case are disposed outward in a radial direction.

Abstract: A semiconductor package and a method of fabricating the same. The semiconductor package includes a dielectric layer having opposite first and second surfaces; a semiconductor chip disposed on the first surface; at least two conductive pads embedded in and exposed from the first surface of the dielectric layer, and electrically connected to the semiconductor chip; a plurality of ball-implanting pads formed on the second surface of the dielectric layer; and a plurality of conductive pillars formed in the dielectric layer, each of the conductive pillars having a first end electrically connected to one of the ball-implanting pads and a second end opposing the first end and electrically connected to one of the conductive pads. Through the installation of the conductive pillars, it is not necessary for the ball-implanting pads to be associated with the conductive pads in position, and the semiconductor package thus has an adjustable ball-implanting area.

Abstract: A semiconductor package includes: a dielectric layer having opposing first and second surfaces and side surfaces; a copper wiring layer disposed on the first surface of the dielectric layer and having extension pads; a surface processing layer disposed on the wiring layer; a semiconductor chip disposed on the wiring layer and electrically connected to the surface processing layer; and an encapsulant disposed on the first surface of the dielectric layer for encapsulating the semiconductor chip, the wiring layer and the surface processing layer while exposing the second surface of the dielectric layer. Further, vias are disposed between the side surfaces of the dielectric layer and the encapsulant such that the extension pads are exposed from the vias so as for solder balls to be disposed thereon. Due to improved electrical connection between the copper and solder materials, the electrical connection quality of the package is improved.

Abstract: A support device includes a support element, a plurality of legs rotatably connected to the support element which can be rotated to be changed from an unfolded state and a folded state, and a main body sleeves the support element. When the legs are rotated to be in the unfolded state, the legs cooperate with the support element to support an electronic device, and when the legs are rotated to be in the folded state, the main body sleeves on the support element receiving the legs.