Patents by Inventor LIANG YI

LIANG YI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Support for portable computing device
    Patent number: 9151439
    Abstract: A foldable support for supporting a portable computing device includes a main frame, a back plate, and a hinge assembly connecting the back plate to the main frame, the hinge assembly being able to position and lock the back plate in a desired position with respect to the main frame. A base member is rotatably connected to a bottom of the main frame. When the portable computing device is supported by the foldable support, a back of the portable computing device rests against the main frame, and a bottom of the portable computing device rests on the base member.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: October 6, 2015
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yong Liang, Lin-Lin Pan, Chia-Te Yu, Liang-Yi Lu
  • Devices and systems for remote control
    Patent number: 9123344
    Abstract: Remote controllers and systems thereof are disclosed. The remote controller remotely operates a receiving host, in which the receiving host provides voice input and speech recognition functions. The remote controller comprises a first input unit and a second input unit for generating a voice input request and a speech recognition request. The generated voice input and speech recognition requests are then sent to the receiving host, thereby forcing the receiving host to perform the voice input and speech recognition functions.
    Type: Grant
    Filed: February 9, 2009
    Date of Patent: September 1, 2015
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Chia-Chen Liu, Yun-Jung Wu, Liang-Yi Huang, Yi-Hsiu Lee
  • HIGH VOLTAGE TRENCH TRANSISTOR
    Publication number: 20150236085
    Abstract: A method of forming a device is disclosed. A substrate defined with a device region is provided. A gate having a gate electrode, first and second gate dielectric layers is formed in a trench. The trench has an upper trench portion and a lower trench portion. A field plate is formed in the trench. First and second diffusion regions are formed. The gate is displaced from the second diffusion region.
    Type: Application
    Filed: April 22, 2015
    Publication date: August 20, 2015
    Inventors: Yemin DONG, Liang YI, Zhanfeng LIU, Purakh Raj VERMA, Ramadas NAMBATYATHU
  • Fabrication method of semiconductor package
    Patent number: 9112063
    Abstract: A fabrication method of a semiconductor package is provided, which includes the steps of: forming a packaging substrate on a first carrier; bonding a second carrier to the packaging substrate; removing the first carrier; disposing a chip on the packaging substrate; forming an encapsulant on the packaging substrate for encapsulating the chip; and removing the second carrier. The first and second carriers provide the thin-type packaging substrate with sufficient rigidity for undergoing the fabrication processes without cracking or warpage, thereby meeting the miniaturization requirement and improving the product yield.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: August 18, 2015
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Wei Chung Hsiao, Chun Hsien Lin, Yu Cheng Pai, Liang Yi Hung, Ming Chen Sun, Shao Tzu Tang, Ying Chou Tsai, Chang Yi Lan
  • TOUCH PANEL
    Publication number: 20150199050
    Abstract: A touch panel includes a plurality of first axial electrodes, a plurality of second axial electrodes and trace region. The first axial electrodes extend along a first axial direction. The second axial electrodes extend along the first axial direction and disposed to insulatively correspond to the first axial electrodes. Each of the second axial electrodes includes a central electrode, and a plurality of first branch electrodes which are electrically coupled to the central electrode, and have areas different from one another. Each of the first branch electrodes overlaps a corresponding one of the first axial electrodes. The trace region is disposed at one side of the first and second axial electrodes along the first axial direction.
    Type: Application
    Filed: January 14, 2015
    Publication date: July 16, 2015
    Inventors: Meifang Lan, Pudi Hong, Yiyun Lai, Liang-Yi Chang
  • FLIP-CHIP PACKAGING STRUCTURE
    Publication number: 20150179598
    Abstract: A flip-chip packaging structure is provided, which includes: a packaging substrate having a substrate body and a circuit layer formed on the substrate body, wherein the circuit layer has a plurality of conductive pads embedded in the substrate body and exposed from a surface of the substrate body; and a chip disposed on and electrically connected to the packaging substrate through a plurality of conductive elements, wherein the conductive elements and the exposed portions of the conductive pads have a width ratio in a range of 0.7 to 1.3, thereby improving the product yield and reliability.
    Type: Application
    Filed: February 19, 2014
    Publication date: June 25, 2015
    Applicant: Siliconware Precision Industries Co., Ltd
    Inventors: Shih-Chao Chiu, Liang-yi Hung
  • Adjustable stand mechanism for electronic device
    Patent number: 9062823
    Abstract: An exemplary adjustable stand mechanism for supporting an electronic device includes a holding member for holding the electronic device and a support member for supporting the holding member at a selected one of different inclined angles. The support member includes a first stand rotatably engaged with the holding member, and a second stand also rotatably engaged with the holding member. The first stand selectably supports the holding member and provides a first inclined angle for the holding member. The second stand selectably supports the holding member and provides a second inclined angle for the holding member which is different from the first inclined angle.
    Type: Grant
    Filed: July 5, 2012
    Date of Patent: June 23, 2015
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Lin-Lin Pan, Chia-Te Yu, Liang-Yi Lu
  • High voltage trench transistor
    Patent number: 9054133
    Abstract: A method of forming a device is disclosed. A substrate defined with a device region is provided. A gate having a gate electrode, first and second gate dielectric layers is formed in a trench. The trench has an upper trench portion and a lower trench portion. A field plate is formed in the trench. First and second diffusion regions are formed. The gate is displaced from the second diffusion region.
    Type: Grant
    Filed: July 23, 2013
    Date of Patent: June 9, 2015
    Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Yemin Dong, Liang Yi, Zhanfeng Liu, Purakh Raj Verma, Ramadas Nambatyathu
  • PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
    Publication number: 20150102484
    Abstract: A package structure is disclosed, which includes: a first substrate; a build-up layer formed on and electrically connected to the first substrate and having a cavity; at least an electronic element disposed in the cavity and electrically connected to the first substrate; a stack member disposed on the build-up layer so as to be stacked on the first substrate; and an encapsulant formed between the build-up layer and the stack member. The build-up layer facilitates to achieve a stand-off effect and prevent solder bridging.
    Type: Application
    Filed: December 20, 2013
    Publication date: April 16, 2015
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD
    Inventors: Chia-Cheng Chen, Ming-Chen Sun, Tzu-Chieh Shen, Liang-yi Hung, Wei-chung Hsiao, Yu-cheng Pai, Shih-Chao Chiu, Don-Son Jiang, Yi-Feng Chang, Lung-Yuan Wang
  • Integration of high voltage trench transistor with low voltage CMOS transistor
    Patent number: 8999769
    Abstract: A method of forming a device is disclosed. A substrate defined with a device region is provided. A gate having an upper and a lower portion is formed in a trench in the substrate in the device region. The upper portion forms a gate electrode and the lower portion forms a gate field plate. First and second surface doped regions are formed adjacent to the gate. The gate field plate introduces vertical reduced surface (RESURF) effect in a drift region of the device.
    Type: Grant
    Filed: July 18, 2012
    Date of Patent: April 7, 2015
    Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventors: Purakh Raj Verma, Liang Yi, Yemin Dong
  • SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE HAVING THE SAME
    Publication number: 20150028485
    Abstract: A substrate structure is provided. The substrate structure includes a substrate body; a metal layer formed on a surface of the substrate body; an insulating layer formed on the surface of the substrate body and having at least an opening for exposing the metal layer; and at least a die attach area defined on the surface of the substrate body corresponding in position to the opening for a semiconductor chip to be disposed thereon. The die attach area covers the entire opening or the metal layer is formed within the die attach area, thereby effectively preventing package delamination and improving the product yield.
    Type: Application
    Filed: July 25, 2013
    Publication date: January 29, 2015
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Liang-Yi Hung, Shih-Chao Chih, Yu-Cheng Pai, Wei-Chung Hsiao
  • Support structure
    Patent number: 8899543
    Abstract: A support structure includes a base, a pair of stands, a top hinge, and a pair of holding arms. The stands are rotatably connected to one end of the base to support the base. The top hinge is rotatably connected to the other end of the base opposite to the stands. The rotation plane of the top hinge is perpendicular to the rotation plane of the stands. The holding arms are rotatably connected to the top hinge for holding an object at any desired angle.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: December 2, 2014
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Yong Liang, Lin-Lin Pan, Chia-Te Yu, Liang-Yi Lu
  • FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
    Publication number: 20140308780
    Abstract: A fabrication method of a semiconductor package is provided, which includes the steps of: forming a packaging substrate on a first carrier; bonding a second carrier to the packaging substrate; removing the first carrier; disposing a chip on the packaging substrate; forming an encapsulant on the packaging substrate for encapsulating the chip; and removing the second carrier. The first and second carriers provide the thin-type packaging substrate with sufficient rigidity for undergoing the fabrication processes without cracking or warpage, thereby meeting the miniaturization requirement and improving the product yield.
    Type: Application
    Filed: June 26, 2014
    Publication date: October 16, 2014
    Inventors: Wei Chung Hsiao, Chun Hsien Lin, Yu Cheng Pai, Liang Yi Hung, Ming Chen Sun, Shao Tzu Tang, Ying Chou Tsai, Chang Yi Lan
  • LED lamp
    Patent number: 8801223
    Abstract: An LED lamp includes a socket and a shallow dish-shaped body detachably connected to the socket. The socket is electrically connected to an external power source. The body includes a rear cover, a transparent front cover, a lamp board, a number of LED light sources, a driving circuit board and a fixing member. The LED light sources are mounted on the lamp board facing the front cover, wherein the LED light sources are visible from an outside of the transparent front cover when they are lit. The driving circuit board is electrically connected to the socket and the lamp board, and is configured for driving the LED light sources to emit light beams. The fixing member is configured for fixing the rear cover, the driving circuit board and the lamp board together.
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: August 12, 2014
    Assignees: Foxsemicon Integrated Technology (Shanghai) Inc., Foxsemicon Integrated Technology, Inc.
    Inventors: Kuan-Hong Hsieh, Te-Sheng Chen, Wen-Hsiang Lu, Bo-Yong Yang, Liang Yi, Yu Zhang
  • Semiconductor package and fabrication method thereof
    Patent number: 8796867
    Abstract: A fabrication method of a semiconductor package is provided, which includes the steps of: forming a packaging substrate on a first carrier; bonding a second carrier to the packaging substrate; removing the first carrier; disposing a chip on the packaging substrate; forming an encapsulant on the packaging substrate for encapsulating the chip; and removing the second carrier. The first and second carriers provide the thin-type packaging substrate with sufficient rigidity for undergoing the fabrication processes without cracking or warpage, thereby meeting the miniaturization requirement and improving the product yield.
    Type: Grant
    Filed: August 17, 2012
    Date of Patent: August 5, 2014
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Wei Chung Hsiao, Chun Hsien Lin, Yu Cheng Pai, Liang Yi Hung, Ming Chen Sun, Shao Tzu Tang, Ying Chou Tsai, Chang Yi Lan
  • Charger with removable cap
    Patent number: 8784137
    Abstract: A charger includes a housing defining a receiving cavity, two through holes defined in the housing communicating with the receiving cavity, two slots defined in the housing, a fuse and a spring member received in the receiving cavity, a cap movably coupled to the housing, and an anode contact. The anode contact abuts between the spring member and the fuse engaging with the cap. A hooks engages in the through holes to prevent the cap from detaching from the housing, being disengageable from the through holes when pushed by a pin inserted into the through holes allowing the spring member to push the cap to move until the hooks engage in the slots. The cap is rotated a predetermined angel until the hooks are slidably received in a receiving grooves, thereby allowing the cap to be detachable from the housing through the opening.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: July 22, 2014
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Chun Yang, Chien-Hung Shen, Liang-Yi Lu, Chao Li
  • SENSING DEVICE FOR MEASURING ELECTROENCEPHALOGRAM
    Publication number: 20140180158
    Abstract: An exemplary embodiment of the present disclosure provides a sensing device for measuring electroencephalogram (EEG). The sensing device includes an arm, a sensing portion, a multi-directional joint, a connecting base and a headband component. The arm has a front end and a back end opposite to the front end. The back end is coupled to the connecting base. The multi-directional joint is disposed on the front end, and coupled to the sensing portion, so that the sensing portion can rotate relative to the front end of the arm. The headband component includes a plurality of elastic arcuate bands and an anti-slip pad. Each of the elastic arcuate bands has a first side and a second side opposite to the first side. The first side is coupled to the anti-slip pad, and the second side is coupled to the connecting base.
    Type: Application
    Filed: March 18, 2013
    Publication date: June 26, 2014
    Applicants: LITE-ON TECHNOLOGY CORPORATION, LITE-ON ELECTRONICS (GUANGZHOU) LIMITED
    Inventors: CHI-HSIANG CHENG, LIANG-YI LIU
  • Wireless conference speakerphone
    Patent number: D711345
    Type: Grant
    Filed: February 2, 2013
    Date of Patent: August 19, 2014
    Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corporation
    Inventor: Liang-Yi Liu
  • Over-ear headphones
    Patent number: D729196
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: May 12, 2015
    Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corporation
    Inventor: Liang-Yi Liu
  • Wireless headset transceiver with clip
    Patent number: D737796
    Type: Grant
    Filed: February 21, 2014
    Date of Patent: September 1, 2015
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATION
    Inventor: Liang-Yi Liu