Abstract: The present invention provides a control method of an electronic device is disclosed, wherein the electronic device includes a first antenna and a second antenna. The control method includes the steps of: setting one of the first antenna and the second antenna as a default antenna; receiving a plurality of packets within an interval; for each of the plurality of packets, comparing a signal strength corresponding to the first antenna and a signal strength of the second antenna to generate a first comparison result; updating a first value or a second value according to the first comparison result; wcomparing the first value and the second value to generate a second comparison result when running out the interval; and selecting one of the first antenna and the second antenna to be the default antenna according to the second comparison result.

Abstract: A carrier assembly for mounting equipment into a carrier slot includes an electro-magnetic interference (EMI) shield and an EMI finger. The EMI shield protects the mounted equipment from EMI. The EMI shield is formed in a first plane of the carrier assembly. The EMI finger protrudes from the EMI shield and is coupled to the EMI shield. The EMI finger is formed in a second plane perpendicular to the first plane. The EMI finger operates, when the carrier assembly is installed into the carrier slot, to couple the EMI shield to the carrier slot. The EMI finger, when viewed from a first direction that is perpendicular to both the first plane and the second plane, is formed in a tear-drop shape.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.

Abstract: A Lamb wave resonator includes a piezoelectric material layer, a first finger electrode, a second finger electrode, at least two floating electrodes, and at least two gaps. The first finger electrode is disposed on one side of the piezoelectric material layer and includes a first main portion and first fingers. The second finger electrode is disposed on the side of the piezoelectric material layer and includes a second main portion and second fingers. The first fingers are parallel to and alternately arranged with the second fingers. The floating electrodes are disposed between each first finger and each second finger, and the gaps are disposed at two ends of each floating electrode, respectively.

Abstract: A method, device and system for calculating a microcirculation indicator are provided. A method includes: injecting a vasodilator and subjecting a blood vessel to be measured to coronary angiography; selecting at least one angiographic image of a first body position when the blood vessel to be measured is in a resting state and an angiographic image of a second body position when the blood vessel to be measured is in a dilated state; obtaining a three-dimensional coronary artery vascular model by three-dimensional modeling; injecting a contrast agent, and obtaining time T1 taken for the contrast agent flowing from an inlet to an outlet of the segment of blood vessel and time T2 taken for the contrast agent flowing from an inlet to an outlet of the segment of blood vessel; obtaining the microcirculation indicator.

Abstract: A foldable electronic device includes a central base, a hinge module, a plurality of wings, a plurality of driving element, a plurality of panel bodies, an elastic module and a flexible screen. The hinge module penetrates through the central base and capable of rotating synchronously and reversely. The driving elements are sleeved on and synchronously rotate with the hinge module. The panel bodies are pivotally connected to the wings and can linearly slide relative to the driving element. The flexible screen is disposed on panel bodies and the wings, and has a bendable area. When the panel bodies are in the unfolded status, the flexible screen is flattened, and the wings and the central base support the bendable area. When the panel bodies are in the folded status, the bendable area is bent, and the wings and the central base define an accommodating space for accommodating the bendable area.

Abstract: A device includes: a first vertical stack of nanostructures over a substrate; a second vertical stack of nanostructures over the substrate; a first source/drain region abutting the first vertical stack of nanostructures; a second source/drain region abutting the second vertical stack of nanostructures; a first gate structure wrapping around the nanostructures of the first vertical stack; a second gate structure wrapping around the nanostructures of the second vertical stack; a dielectric layer over the first and second source/drain regions; and an isolation structure that extends from an upper surface of the dielectric layer to a level below upper surfaces of the first and second source/drain regions, the isolation structure being between the first source/drain region and the second source/drain region.

Abstract: A backlight driving method includes steps of: (A) receiving a piece of image data that includes a number (K) of segments, where K?2; (B) generating a piece of adjustment data that includes a number (K) of segments; each segment of the adjustment data being generated based on a respective segment of the image data and upon receipt of the respective segment of the image data; (C) generating, based on a piece of delay data and on an original synchronization control (SC) signal that has a pulse, an internal SC signal that has a number (K) of pulses; and (D) generating a backlight driving output based on the adjustment data and the internal SC signal, so as to drive a backlight source of a scan-type display to emit light.

Abstract: A stereoscopic display device and a display method thereof are provided. The stereoscopic display device includes a display panel, a lens array, an image sensor, and a processing circuit. The display panel displays a three-dimensional image. The lens array is disposed on a transmission path of the three-dimensional image. The image sensor acquires a sensed image of a viewing field of the display panel. The processing circuit is coupled to the lens array and the image sensor. The processing circuit calculates an actual eye position of a user in the viewing field according to reference coordinates of a reference position in the sensed image and eye coordinates of the user in the sensed image. The processing circuit adjusts a liquid crystal rotation angle of the lens array according to the actual eye position, so that a viewing position of the three-dimensional image matches the actual eye position.

Abstract: A congestion processing method is applied to a first node, and includes receiving congestion information, wherein the congestion information is used for congestion processing of the first node; and performing the congestion processing based on the congestion information.

Abstract: A backlight module and a display device are provided, and the backlight module includes a light guide plate, a plurality of light-emitting components, and a frame. The light guide plate includes a first side, a second side, and two third sides. The light-emitting components are disposed on the first side, and light generated from the light-emitting components enters the light guide plate from the first side. The frame covers the second side and the third sides and includes an opening and at least one buffer portion. The light-emitting components are disposed in the opening, and the buffer portion is disposed on a side of the opening and contacts the light guide plate.

Abstract: A window blind, wherein each ladder tape thereof includes two longitudinal cords, plural bearers and plural limiting members. The longitudinal cords each have an end connected to a deflecting mechanism disposed on the upper rail. The bearers are disposed between the two longitudinal cords for respectively supporting the slats. The limiting members include a first limiting member and a second limiting member neighboring thereto. The first limiting member has an end disposed on one of the longitudinal cords and includes a first slat-through portion located between two ends thereof passing through a first through hole of a first slat. A first linking loop is formed after the first slat-through portion passes through the first through hole. The second limiting member passes through the first linking loop for keeping the first through hole threaded through by one of the first limiting member and the second limiting member.

Abstract: An integrated circuit includes a first semiconductor wafer, a second semiconductor wafer, a first interconnect structure, a first through substrate via, and an under bump metallurgy (UBM) layer. The first semiconductor wafer has a first side of the first semiconductor wafer. The second semiconductor wafer is coupled to the first semiconductor wafer, and is over the first semiconductor wafer. The second semiconductor wafer has a first device in a first side of the second semiconductor wafer. The first interconnect structure is on a second side of the first semiconductor wafer opposite from the first side of the first semiconductor wafer. The first interconnect structure includes an inductor below the first semiconductor wafer. The first through substrate via extends through the first semiconductor wafer. The first through substrate via electrically couples the inductor to at least the first device. The UBM layer is on a surface of the first interconnect structure.

Abstract: Semiconductor devices and their manufacturing methods are disclosed herein, and more particularly to semiconductor devices including a transistor having gate all around (GAA) transistor structures and manufacturing methods thereof. The methods described herein allow for complex shapes (e.g., “L-shaped”) to be etched into a multi-layered stack to form fins used in the formation of active regions of the GAA nanostructure transistor structures. In some embodiments, the active regions may be formed with a first channel width and a first source/drain region having a first width and a second channel width and a second source/drain region having a second width that is less than the first width.

Abstract: Provided are a transmission timing method and apparatus, a base station, and a computer readable storage medium. In the method, a second node issues timing control information to a first node and/or a third node to control alignment of data transmission received by the second node and sent by the first node and data transmission received by the second node and sent by the third node, or to control alignment of data transmission sent by the second node to the first node and data transmission sent by the second node to the third node.

Abstract: A wireless charging system and a method for implementing wireless charging are provided. The wireless charging system includes a bearing surface, a guide rail, a wireless charger, and a driver. On the bearing surface there are multiple regions for placing equipment to-be-charged. The guide rail is located under the bearing surface, and includes a first-direction track. The wireless charger is mounted on the first-direction track under the bearing surface. The wireless charger includes a first slider and a charging circuit. The driver is located under the bearing surface, and includes a first driving circuit connected to the first slider, adapted to changing a location of the wireless charger by driving the first slider to move along the first-direction track.

Abstract: A method for manufacturing an integrated hull by using 3D structure type fiber clothes and 3D vacuum infusion process includes: sequentially stacking at least one first fiber cloth, at least one core material and at least one second fiber cloth on a mold; deploying structural materials on the second fiber cloth; stacking the third fiber clothes to cover the structure materials and a part of the second fiber cloth, whereby the first fiber cloth, the core material, the second fiber cloth and the third fiber clothes are formed to a lamination; determining a pipe arrangement of vacuum pipes and first and second resin pipes; deploying a vacuum bag on the lamination and covering the first and second resin pipes and the vacuum pipe; executing the 3D vacuum infusion process; curing the resin; and executing a mold release process to complete an integrated hull.

Abstract: This disclosure relates to methods and devices for wireless sidelink resource allocation for a user equipment (UE) assisted by an anchor UE. Various mechanisms are disclosed for handling releasing of the anchor UE initiated by either the anchor UE or the assisted UE, and for handling sidelink resources already allocated to the UE by the anchor UE prior to the release. Additional mechanisms are disclosed for using an anchor UE to assist in allocating sidelink resources to multiple UEs configurable in a shared manner or non-shared manner.

Abstract: A novel and environmentally preferable method is provided for preparing solid electrolyte particles capable of making dense, flexible, Li+ conducting electrolyte thin films. Methods are also provided for using the solid electrolyte particles and/or thin films in manufacturing safer and more efficient lithium-based batteries. In particular, the method uses inorganic precursors instead of using organic precursors in preparing an aerosol and then convert the aerosol to solid powders to provide the solid electrolyte particles. The solid electrolyte particles prepared have a cubic polymorph and have a desired particle size range, and are capable of making a solid electrolyte film with a thickness less than 50 ?m.

Abstract: A test circuit includes a scan chain and a wrapper chain. The wrapper chain shifts in a test pattern according a first clock. The scan chain is coupled to the wrapper chain via a logic combination of a circuit under test. The wrapper chain is configured to transmit the test pattern to the scan chain via the logic combination according to a second clock in a capture phase. The wrapper chain includes a first, a second wrapper cell, and an asynchronous register. The first wrapper cell sequentially shifts in two bits of the test pattern in the shift-in phase. The second wrapper cell shifts in the first bit of the test pattern in the shift-in phase. The asynchronous register conducts the first wrapper cell to the second wrapper cell in the shift-in phase, and latches the second wrapper cell in the capture phase.