Patents by Inventor Lin Huang

Lin Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088564
    Abstract: A transmission device with a phase-adjustment function includes a first dielectric layer, a signal line, a ground plane, and a first parasitic element. The first dielectric layer has a first surface and a second surface which are opposite to each other. The signal line is disposed on the first surface of the first dielectric layer. The ground plane is disposed on the second surface of the first dielectric layer. The first parasitic element is coupled to a first connection point on the signal line. The first parasitic element is configured to provide a first delay phase.
    Type: Application
    Filed: August 11, 2023
    Publication date: March 14, 2024
    Inventor: Chun-Lin HUANG
  • Publication number: 20240087989
    Abstract: A semiconductor arrangement includes a first dielectric feature passing through a semiconductive layer and a first dielectric layer over a substrate. The semiconductor arrangement includes a conductive feature passing through the semiconductive layer and the first dielectric layer and electrically coupled to the substrate. The conductive feature is adjacent the first dielectric feature and electrically isolated from the semiconductive layer by the first dielectric feature.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: Josh LIN, Chung-Jen HUANG, Yun-Chi WU, Tsung-Yu YANG
  • Patent number: 11925789
    Abstract: An elastic physiological patch includes a patch assembly and an implant assembly. The patch assembly includes an electronic device, and a soft patch body defining a chamber for receiving the electronic device. The implant assembly is mountable to the electronic device and includes an implant which is capable of being driven to partially pass through the patch body and which is adapted to be implanted in the skin of a subject. The implant and the patch body cooperatively seal the chamber.
    Type: Grant
    Filed: January 14, 2022
    Date of Patent: March 12, 2024
    Assignee: Bionime Corporation
    Inventors: Chun-Mu Huang, Chieh-Hsing Chen, Jia-Nan Shen, Kuan-Lin Chang
  • Patent number: 11928261
    Abstract: The disclosure provides a display device. The display device includes a display panel and a vibration generating module. The vibration generating module is attached to the display panel and includes a substrate, a circuit layer, and a plurality of vibrators. The circuit layer and the plurality of vibrators are disposed on the substrate, and the plurality of vibrators are electrically connected to the circuit layer.
    Type: Grant
    Filed: October 11, 2022
    Date of Patent: March 12, 2024
    Assignee: Innolux Corporation
    Inventors: Yu-Chia Huang, Yuan-Lin Wu, Hsiao-Lang Lin, Tsung-Han Tsai, Kuan-Feng Lee
  • Publication number: 20240080658
    Abstract: Sidelink based relay communications include communications through a relay user equipment (“UE”) between a basestation and a remote UE. Relay communications can be improved by addressing incompatibilities between different devices, which support different features/operations, such as the layers of communication. Access control and an establishment cause value can also be addressed by the relay communications. Paging identification and system information can be communicated by relay communications, such as through the relay UE to improve communications.
    Type: Application
    Filed: November 9, 2023
    Publication date: March 7, 2024
    Applicant: ZTE Corporation
    Inventors: Lin Chen, Wei Luo, Ying Huang, Weiqiang Du, Mengzhen Wang
  • Publication number: 20240079450
    Abstract: A heterojunction bipolar transistor structure is provided, including a substrate and a multi-layer structure formed on the substrate. The multi-layer structure includes a current clamping layer, and the current clamping layer can be disposed in a collector layer, disposed in a sub-collector layer, or interposed between a collector layer and a sub-collector layer. An electron affinity of the current clamping layer is less than an electron affinity of an epitaxial layer formed on the current clamping layer.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 7, 2024
    Inventors: Yu-Chung CHIN, Zong-Lin LI, Chao-Hsing HUANG
  • Publication number: 20240079434
    Abstract: Various embodiments of the present disclosure are directed towards an image sensor including first chip and a second chip. The first chip includes a first substrate, a plurality of photodetectors disposed in the first substrate, a first interconnect structure disposed on a front side of the first substrate, and a first bond structure disposed on the first interconnect structure. The second chip underlies the first chip. The second chip includes a second substrate, a plurality of semiconductor devices disposed on the second substrate, a second interconnect structure disposed on a front side of the second substrate, and a second bond structure disposed on the second interconnect structure. A first bonding interface is disposed between the second bond structure and the first bond structure. The second interconnect structure is electrically coupled to the first interconnect structure by way of the first and second bond structures.
    Type: Application
    Filed: January 5, 2023
    Publication date: March 7, 2024
    Inventors: Hao-Lin Yang, Kuan-Chieh Huang, Wei-Cheng Hsu, Tzu-Jui Wang, Chen-Jong Wang, Dun-Nian Yaung, Yu-Chun Chen
  • Patent number: 11924737
    Abstract: Provided is a method for performing relay forwarding on integrated access and backhaul (IAB) links. The method includes receiving, by a first IAB node, a data packet; and transmitting, by the first IAB node, the data packet to an IAB donor. Further provided are an information acquisition method, an IAB node, an IAB donor node and a storage medium.
    Type: Grant
    Filed: February 27, 2023
    Date of Patent: March 5, 2024
    Assignee: ZTE CORPORATION
    Inventors: Ying Huang, Lin Chen
  • Patent number: 11920778
    Abstract: A ventilation fan includes a housing having an opening, a grille structure positioned to cover the opening, a fan module provided in the housing and a function module. The grille structure includes a base defining an outlet, and a grille support spaced apart from the base and connected by the connecting columns A radial inlet is formed between the base and the grille support is in communication with the outlet. The base includes a holder having a holding opening axially downward and faced away from the housing. The function module is disposed within the holder through the holding opening.
    Type: Grant
    Filed: September 30, 2022
    Date of Patent: March 5, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Yu-Hsiang Huang, Yen-Lin Chen, Chih-Hua Lin
  • Patent number: 11923243
    Abstract: A method for manufacturing a semiconductor structure includes preparing a dielectric structure formed with trenches respectively defined by lateral surfaces of the dielectric structure, forming spacer layers on the lateral surfaces, filling an electrically conductive material into the trenches to form electrically conductive features, selectively depositing a blocking layer on the dielectric structure, selectively depositing a dielectric material on the electrically conductive features to form a capping layer, removing the blocking layer and the dielectric structure to form recesses, forming sacrificial features in the recesses, forming a sustaining layer to cover the sacrificial features; and removing the sacrificial features to obtain the semiconductor structure formed with air gaps confined by the sustaining layer and the spacer layers.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee, Shau-Lin Shue, Hsiao-Kang Chang
  • Patent number: 11917831
    Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes a first conductive structure arranged over a substrate. A memory layer is arranged over the first conductive structure, below a second conductive structure, and includes a ferroelectric material. An annealed seed layer is arranged between the first and second conductive structures and directly on a first side of the memory layer. An amount of the crystal structure that includes an orthorhombic phase is greater than about 35 percent.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Song-Fu Liao, Rainer Yen-Chieh Huang, Hai-Ching Chen, Chung-Te Lin
  • Patent number: 11917144
    Abstract: Various schemes for realizing efficient in-loop filtering are described, manifested in low latency and reduced hardware cost for an in-loop filter comprising at least two filtering stages. An apparatus receives pixel data of a current block of a picture and one or more neighboring blocks thereof, based on which the apparatus performs a filtering operation and generates a filtered block that includes completely filtered sub-blocks and partially filtered sub-blocks. The apparatus further outputs an output block that includes the completely filtered sub-blocks as well as a respective portion of each of the partially filtered sub-blocks, wherein the respective portion is adjacent to one of the completely filtered sub-blocks.
    Type: Grant
    Filed: June 19, 2022
    Date of Patent: February 27, 2024
    Assignee: MediaTek Inc.
    Inventors: Yueh-Lin Wu, Min-Hao Chiu, Yen-Chieh Huang
  • Patent number: 11917923
    Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: February 27, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Ching-Hua Hsu, Si-Han Tsai, Shun-Yu Huang, Chen-Yi Weng, Ju-Chun Fan, Che-Wei Chang, Yi-Yu Lin, Po-Kai Hsu, Jing-Yin Jhang, Ya-Jyuan Hung
  • Patent number: 11914110
    Abstract: The disclosure discloses a photographic optical system, sequentially includes from an object side to an image side along an optical axis: a first lens, a second lens, a third lens, a fourth lens, a fifth lens and a sixth lens. Wherein the first lens has a positive refractive power, an object-side surface thereof is a convex surface, an image-side surface is a concave surface. The second lens has a negative refractive power, an object-side surface thereof is a convex surface, an image-side surface is a concave surface. The sixth lens has a negative refractive power. TTL is a distance from the object-side surface of the first lens to an imaging surface of the photographic optical system on the optical axis and ImgH is a half the diagonal length of an effective pixel area on the imaging surface of the photographic optical system, and TTL and ImgH satisfy TTL/ImgH<1.5.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: February 27, 2024
    Assignee: ZHEJIANG SUNNY OPTICS CO., LTD.
    Inventors: Kaiyuan Zhang, Biao Xu, Lin Huang
  • Patent number: 11917452
    Abstract: Provided are an information transmission method and device. The method includes that: an Integrated Access and Backhaul Links (IAB) node transmits link information to a second IAB node, wherein the second IAB node is an IAB child node or an IAB parent node or an IAB donor. Also provided are an electronic device and a storage medium.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: February 27, 2024
    Assignee: ZTE CORPORATION
    Inventors: Ying Huang, Lin Chen
  • Patent number: 11915954
    Abstract: A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.
    Type: Grant
    Filed: January 30, 2023
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hung Huang, Cheng-Lung Wu, Zheng-Lin He, Yang-Ann Chu, Jiun-Rong Pai, Hsuan Lee
  • Patent number: 11917678
    Abstract: The present disclosure relates to computer-implemented systems and methods for facilitating simultaneous poll responses. A method may include assigning respective subsets of subcarrier frequencies to a plurality of user devices for communication over a wireless channel. The method may also include transmitting, simultaneously, a channel status request poll to the user devices. Additionally, the method may include determining, based at least in part on a first channel status response received via a first subset of subcarrier frequencies over the wireless channel, that the first channel status response is received from the first user device. Similarly, the method may also include determining a second channel status response is received from a second user device. Furthermore, the method may include determining, based at least in part on the first channel status response and the second channel status response, to schedule simultaneous data communication for the first device and the second device.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: February 27, 2024
    Assignee: Intel Corporation
    Inventors: Qinghua Li, Po-Kai Huang, Hujun Yin, Xiaogang Chen, Yuan Zhu, Xintian Lin
  • Patent number: 11915818
    Abstract: A system for assessing extubation includes a respiratory assistance device, an artificial intelligence platform, and a hospital information system. The respiratory assistance device is adapted to communicate with a trachea of a patient. The artificial intelligence platform includes a prediction module. A method for assessing extubation includes the following steps. Measured values of respiratory parameters of the patient are recorded by the respiratory assistance device. The recorded times and the measured values of the respiratory parameters corresponding to each of the recording times are transmitted to the artificial intelligence platform. The prediction module analyzes the measured values of respiratory parameters within a predetermined time period according to a prediction model to generate a prediction result. The prediction result is transmitted to the hospital information system and is recorded into a medical record of the patient.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: February 27, 2024
    Assignee: Changhua Christian Medical Foundation Changhua Christian Hospital
    Inventors: Kuo-Yang Huang, Ying-Lin Hsu, Yin-Tzer Shih
  • Patent number: 11917422
    Abstract: An information handling system executing an intelligent throughput performance analysis and issue detection system may comprise a network interface device to establish a wireless link with a wireless network and a processor to execute a neural network trained to predict wireless link throughput values based on controlled connectivity testing metrics gathered in a controlled laboratory from tested information handling systems. The processor may gather measured throughput of the wireless link and operational connectivity metrics for the information handling system that describe antenna positional information, antenna adaptation controller parameters, signal strength measurements, and wireless link performance metrics. The neural network may output, based on the gathered operational connectivity metrics a predicted throughput value that differs from the measured throughput by a maximum tolerance.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: February 27, 2024
    Assignee: Dell Products, LP
    Inventors: Wei-Chia Huang, Chuang-Yueh Chen, YungShun Lin, Alan Eric Sicher, Lars Fredrik Proejts
  • Patent number: 11915217
    Abstract: Disclosed herein relates to a self-checkout anti-theft vehicle system, comprising: a self-checkout vehicle having a plurality of sensors and components implemented thereon, the self-checkout vehicle being used by shoppers for storing selected merchandises in a retail environment; and a centralized computing device. The centralized computing device is configured to: obtain information related to each merchandise selected and placed into the self-checkout vehicle by a shopper by exchanging data with the plurality of sensors and components via a first communication network, identify each merchandise via a second, different communication network based at least upon the information obtained from the plurality of sensors and components, and process payment information of each merchandise.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: February 27, 2024
    Assignee: Maplebear Inc.
    Inventors: Lin Gao, Yilin Huang, Shiyuan Yang, Ahmed Beshry