Patents by Inventor Lin Wei

Lin Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11747547
    Abstract: A backlight module includes a light guide plate and a plurality of light-emitting elements. The light guide plate includes a light-incident surface, an effective light-exiting region, a transition region located between the light-incident surface and the effective light-exiting region, and a light-blocking opening disposed in the transition region. The light-emitting elements are disposed at the light-incident surface and emit light toward the effective light-exiting region. The light-blocking opening is located between a plurality of light-emitting regions formed in the transition region by the plurality of light-emitting elements respectively.
    Type: Grant
    Filed: October 12, 2022
    Date of Patent: September 5, 2023
    Assignee: ASUSTeK COMPUTER INC.
    Inventor: Lin-Wei Chiu
  • Publication number: 20230236222
    Abstract: This disclosure provides a test kit for testing a device under test (DUT) including a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having a nest and an interposer substrate installed under the nest.
    Type: Application
    Filed: March 30, 2023
    Publication date: July 27, 2023
    Applicant: MEDIATEK INC.
    Inventors: Jing-Hui Zhuang, Ying-Chou Shih, Sheng-Wei Lei, Chang-Lin Wei, Che-Hsien Huang, Shih-Chia Chiu, Yi-Chieh Lin, Wun-Jian Lin
  • Patent number: 11705332
    Abstract: A method of forming a pattern in a photoresist layer includes forming a photoresist layer over a substrate, and reducing moisture or oxygen absorption characteristics of the photoresist layer. The photoresist layer is selectively exposed to actinic radiation to form a latent pattern, and the latent pattern is developed by applying a developer to the selectively exposed photoresist layer to form a pattern.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: July 18, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Chen Kuo, Chih-Cheng Liu, Ming-Hui Weng, Jia-Lin Wei, Yen-Yu Chen, Jr-Hung Li, Yahru Cheng, Chi-Ming Yang, Tze-Liang Lee, Ching-Yu Chang
  • Publication number: 20230204847
    Abstract: A backlight module includes a light guide plate and a plurality of light-emitting elements. The light guide plate includes a light-incident surface, an effective light-exiting region, a transition region located between the light-incident surface and the effective light-exiting region, and a light-blocking opening disposed in the transition region. The light-emitting elements are disposed at the light-incident surface and emit light toward the effective light-exiting region. The light-blocking opening is located between a plurality of light-emitting regions formed in the transition region by the plurality of light-emitting elements respectively.
    Type: Application
    Filed: October 12, 2022
    Publication date: June 29, 2023
    Applicant: ASUSTeK COMPUTER INC.
    Inventor: Lin-Wei Chiu
  • Publication number: 20230200820
    Abstract: A release apparatus (100), a release system, a release method, and a treatment apparatus are disclosed. The release apparatus (100) uses two indicators, electric current and power comsuption, to determine whether the release process performed by the release system is successful. This reduces misjudgments, improves the accuracy of the determination of the release state. The release system also uses a self-loop structure, such that it is unnecessary to insert a conductive needle or electrode into the body of a patient, reducing the suffering of the patient.
    Type: Application
    Filed: July 23, 2021
    Publication date: June 29, 2023
    Inventors: Xingzhao WANG, Tao JIANG, Lin WEI, Yiqun Bruce WANG
  • Patent number: 11624758
    Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT. The DUT includes an antenna and radiates a RF signal. The test kit further includes a reflector having a lower surface. The RF signal emitted from the antenna of the DUT is reflected by the reflector and a reflected RF signal is received by the antenna of the DUT.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: April 11, 2023
    Assignee: MEDIATEK INC.
    Inventors: Sheng-Wei Lei, Chang-Lin Wei, Ying-Chou Shih, Yeh-Chun Kao, Yen-Ju Lu, Po-Sen Tseng
  • Publication number: 20230100105
    Abstract: The invention, in part, relates to assessing interactions between gene transcription enhancers and gene transcription repressor, identifying agents that modulate transcription, and use of methods and identified agents to prevent and treat diseases and conditions, such as cancers.
    Type: Application
    Filed: February 23, 2021
    Publication date: March 30, 2023
    Applicant: The Jackson Laboratory
    Inventors: Chia-Lin Wei, Chew Yee Ngan
  • Publication number: 20220397600
    Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having at least an interposer substrate sandwiched by a top socket and a nest.
    Type: Application
    Filed: May 3, 2022
    Publication date: December 15, 2022
    Applicant: MEDIATEK INC.
    Inventors: Jing-Hui Zhuang, Ying-Chou Shih, Sheng-Wei Lei, Chang-Lin Wei, Chih-Yang Liu, Che-Hsien Huang, Yi-Chieh Lin
  • Patent number: 11520730
    Abstract: Disclosed is a data transfer system capable of accelerating data transmission between two chips. The data transfer system includes: a master system-on-a-chip (SoC) including a master transmission circular buffer and a master reception circular buffer; and a slave SoC including a slave reception circular buffer and a slave transmission circular buffer. The slave/master reception circular buffer is a duplicate of the master/slave transmission circular buffer; accordingly, the write pointers of the two corresponding buffers are substantially synchronous and the read pointers of the two corresponding buffers are substantially synchronous as well. In light of the above, the read and write operations of the master/slave transmission circular buffer can be treated as the read and write operations of the slave/master reception circular buffer; therefore some conventional data reproducing procedure(s) for the data transmission can be omitted and the data transmission is accelerated.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: December 6, 2022
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Po-Lin Wei, Pi-Ming Lee, Chih-Chiang Yang
  • Publication number: 20220363727
    Abstract: The present invention relates to an antibacterial peptide derived from Erythroculter ilishaeformis and use thereof. The amino acid sequence of the antibacterial peptide of the present invention includes an amino acid sequence as shown in SEQ ID NO: 1. The present invention further discloses use of the antibacterial peptide in the preparation of an anti-aquatic-bacterium drug for aquaculture animals. The present invention provides a novel antibacterial peptide, discloses a function of the novel antibacterial peptide for resisting aquatic bacteria, and provides candidate molecules for preventing and treating bacterial diseases in the culture process of Erythroculter ilishaeformis.
    Type: Application
    Filed: November 26, 2020
    Publication date: November 17, 2022
    Inventors: Lin WEI, Yue CHEN, Honglan CHENG
  • Publication number: 20220283981
    Abstract: A host circuit includes a first clock generator, a first input output interface, a first communication interface, and a first processor. The first clock generator generates a first clock signal. The first processor outputs a trigger signal through the first input output interface, records a first clock count of the first clock generator at the same time, and outputs the first clock count through the first communication interface. A slave circuit includes a second clock generator, a second input output interface, a second communication interface, and a second processor. The second clock generator generates a second clock signal. When receiving the trigger signal, the second processor records a second clock count of the second clock generator, and calculates a time difference between the first clock signal and the second clock signal according to the first clock count and the second clock count.
    Type: Application
    Filed: March 2, 2022
    Publication date: September 8, 2022
    Applicant: Realtek Semiconductor Corp.
    Inventors: Po-Lin Wei, Ching-Lung Chen
  • Publication number: 20220220566
    Abstract: The invention, in part, encompasses methods to identify extrachromosomal circular DNA (ecDNA) and methods to identify and assess interactions between ecDNA and oncogene transcription.
    Type: Application
    Filed: April 29, 2020
    Publication date: July 14, 2022
    Applicant: The Jackson Laboratory
    Inventors: Chia-Lin WEI, Chee Hong WONG, Harianto TJONG, Roel VERHAAK
  • Patent number: 11283649
    Abstract: Methods, computer program products, and systems are presented. The method computer program products, and systems can include, for instance: receiving, by a Network Virtualization Edge (NVE) of a first virtual network (VN), a multicast packet from a virtual machine (VM) of the first virtual network (VN); determining, by the NVE, whether the NVE currently supports forwarding the multicast packet to a second NVE of a second virtual network (VN), the second virtual network (VN) being logically separated from the first virtual network (VN); responsively to determining that the NVE currently supports forwarding the multicast packet to a second NVE of a second virtual network (VN) forwarding, by the NVE, the multicast packet to the second NVE.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: March 22, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kai Hong Du, Heng Guo Ge, Shashi Pratap Singh, Lin Wei Wu, Le Od Zhang
  • Publication number: 20220047857
    Abstract: A manufacturing method for a micro-needle device includes following steps: a target tissue basic information obtaining step, a micro-needle template obtaining step, a micro-needle material adding step, a micro-needle semi-product obtaining step, and a micro-needle device obtaining step. The inner tissue distribution information is obtained by the application of optical coherence tomography. The micro-needle template is obtained according to the skin surface curvature information and the inner tissue distribution information. The micro-needle template has a plurality of areas and a plurality of mold holes. One or both of the diameter and the depth of the mold hole is determined by the inner tissue distribution information, and the curvature radius of the areas is determined by the skin surface curvature information. The manufacturing method for a micro-needle device is applicable to micro-needles with mixed configurations as well as micro-needles with syringe configurations.
    Type: Application
    Filed: October 30, 2020
    Publication date: February 17, 2022
    Applicant: Tamkang University
    Inventors: Ming-Kai Chern, Man-Piu Chan, Yueh-Tzu Lo, I-Chang Liu, Shih-Ting Lin, You-Lin Wei, Wen-Chi Chou, Wen-Hua Chuang, Yin-Jun Wu, Hun-Boa Wang, Bo-Cheng Wang
  • Publication number: 20220024998
    Abstract: The present invention relates to an immunomodulating peptide comprising an amino acid sequence as shown in SEQ ID NO:1. The present invention also discloses use of the immunomodulating peptide in the preparation of a drug or skin care product for promoting skin wound healing. The present invention provides a new immunomodulating peptide and use thereof, and discloses the mechanism of action of the immunomodulating peptide in promoting wound healing. The immunomodulating peptide is useful as a wounding healing polypeptide template.
    Type: Application
    Filed: August 7, 2020
    Publication date: January 27, 2022
    Inventors: Lin WEI, Yang YANG, Wei XU
  • Publication number: 20210351210
    Abstract: A low noise device includes an isolation feature in a substrate. The low noise device further includes a gate stack over a channel in the substrate, wherein the isolation feature is adjacent to the channel. The low noise device further includes a spacer surrounding a portion of the gate stack, wherein an edge of the gate stack is spaced from an edge of the isolation feature adjacent to the spacer by a distance ranging from a minimum spacing distance to about 0.3 microns (?m).
    Type: Application
    Filed: July 23, 2021
    Publication date: November 11, 2021
    Inventors: Victor Chiang LIANG, Fu-Huan TSAI, Chi-Feng HUANG, Yu-Lin WEI, Fang-Ting KUO, Meng-Chang HO
  • Publication number: 20210318982
    Abstract: Disclosed is a data transfer system capable of accelerating data transmission between two chips. The data transfer system includes: a master system-on-a-chip (SoC) including a master transmission circular buffer and a master reception circular buffer; and a slave SoC including a slave reception circular buffer and a slave transmission circular buffer. The slave/master reception circular buffer is a duplicate of the master/slave transmission circular buffer; accordingly, the write pointers of the two corresponding buffers are substantially synchronous and the read pointers of the two corresponding buffers are substantially synchronous as well. In light of the above, the read and write operations of the master/slave transmission circular buffer can be treated as the read and write operations of the slave/master reception circular buffer; therefore some conventional data reproducing procedure(s) for the data transmission can be omitted and the data transmission is accelerated.
    Type: Application
    Filed: March 31, 2021
    Publication date: October 14, 2021
    Inventors: PO-LIN WEI, PI-MING LEE, CHIH-CHIANG YANG
  • Publication number: 20210305047
    Abstract: A method of manufacturing semiconductor device includes forming a multilayer photoresist structure including a metal-containing photoresist over a substrate. The multilayer photoresist structure includes two or more metal-containing photoresist layers having different physical parameters. The metal-containing photoresist is a reaction product of a first precursor and a second precursor, and each layer of the multilayer photoresist structure is formed using different photoresist layer formation parameters. The different photoresist layer formation parameters are one or more selected from the group consisting of the first precursor, an amount of the first precursor, the second precursor, an amount of the second precursor, a length of time each photoresist layer formation operation, and heating conditions of the photoresist layers.
    Type: Application
    Filed: January 15, 2021
    Publication date: September 30, 2021
    Inventors: Jia-Lin WEI, Ming-Hui WENG, Chih-Cheng LIU, Yi-Chen KUO, Yen-Yu CHEN, Yahru CHENG, Jr-Hung LI, Ching-Yu CHANG, Tze-Liang LEE, Chi-Ming YANG
  • Publication number: 20210302467
    Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT. The DUT includes an antenna and radiates a RF signal. The test kit further includes a reflector having a lower surface. The RF signal emitted from the antenna of the DUT is reflected by the reflector and a reflected RF signal is received by the antenna of the DUT.
    Type: Application
    Filed: March 24, 2021
    Publication date: September 30, 2021
    Inventors: Sheng-Wei Lei, Chang-Lin Wei, Ying-Chou Shih, Yeh-Chun Kao, Yen-Ju Lu, Po-Sen Tseng
  • Patent number: D965133
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: September 27, 2022
    Inventor: Lin Wei