Patents by Inventor Lin Wei

Lin Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • APPARATUS FOR SEPARATING WAFER FROM CARRIER
    Publication number: 20140360671
    Abstract: An apparatus for separating a wafer from a carrier includes a platform having an upper surface, a tape feeding unit, a first robot arm, and a controller coupled to the platform. The controller is configured to mount a wafer frame, by using the tape feeding unit, on a wafer of a wafer assembly on the upper surface of the platform. The wafer assembly includes the wafer, a carrier, and a layer of wax between the wafer and the carrier. The controller is also configured to heat the upper surface of the platform to a predetermined temperature and separate, by the first robot arm, the wafer and the wafer frame mounted thereon from the carrier.
    Type: Application
    Filed: August 21, 2014
    Publication date: December 11, 2014
    Inventors: Chien Ling HWANG, Lin-Wei WANG, Chung-Shi LIU
  • Apparatus and method of separating wafer from carrier
    Patent number: 8834662
    Abstract: A method of separating a wafer from a carrier includes placing a wafer assembly on a platform. The wafer assembly includes the wafer, the carrier, and a layer of wax between the wafer and the carrier. A wafer frame is mounted on the wafer of the wafer assembly. The layer of wax is softened. The wafer and the wafer frame mounted thereon are separated, by a first robot arm, from the carrier.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: September 16, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien Ling Hwang, Lin-Wei Wang, Chung-Shi Liu
  • Method for Identifying the Optical Network Unit Power Off Reason
    Publication number: 20140233941
    Abstract: A passive optical network (PON) component comprising a power switch, a detector configured to monitor the power switch, and a processor configured to receive an interrupt from the detector and transmit a message comprising a first indicator that the PON component has powered down, and a second indicator giving a reason for the power down. A passive optical network (PON) component comprising a processor configured to implement a method comprising receiving an interrupt message from a detector, determining a reason for the interrupt, and transmitting a dying gasp message comprising an indicator of the reason for the interrupt. A method comprising transmitting an alarm message comprising an optical network terminal (ONT) manual power off indicator that indicates the ONT is shutting down because a subscriber has turned off its power switch.
    Type: Application
    Filed: April 29, 2014
    Publication date: August 21, 2014
    Applicant: Futurewei Technologies, Inc.
    Inventors: Michael Shaffer, Yin Jinrong, Lin Wei, Yang Sulin
  • Transistors, methods of manufacture thereof, and image sensor circuits
    Patent number: 8796748
    Abstract: Transistors, methods of manufacturing thereof, and image sensor circuits are disclosed. In one embodiment, a transistor includes a buried channel disposed in a workpiece, a gate dielectric disposed over the buried channel, and a gate layer disposed over the gate dielectric. The gate layer comprises an I shape in a top view of the transistor.
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: August 5, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Fredrik Ramberg, Tse-Hua Lu, Tsun-Lai Hsu, Victor Chiang Liang, Chi-Feng Huang, Yu-Lin Wei, Shu Fang Fu
  • Method for identifying the optical network unit power off reason
    Patent number: 8787751
    Abstract: A passive optical network (PON) component comprising a power switch, a detector configured to monitor the power switch, and a processor configured to receive an interrupt from the detector and transmit a message comprising a first indicator that the PON component has powered down, and a second indicator giving a reason for the power down. A passive optical network (PON) component comprising a processor configured to implement a method comprising receiving an interrupt message from a detector, determining a reason for the interrupt, and transmitting a dying gasp message comprising an indicator of the reason for the interrupt. A method comprising transmitting an alarm message comprising an optical network terminal (ONT) manual power off indicator that indicates the ONT is shutting down because a subscriber has turned off its power switch.
    Type: Grant
    Filed: April 8, 2010
    Date of Patent: July 22, 2014
    Assignee: Futurewei Technologies, Inc.
    Inventors: Michael Shaffer, Yin Jinrong, Lin Wei, Yang Sulin
  • Liquid crystal display and frame set with easy fixing structure thereof
    Patent number: 8773610
    Abstract: The present invention discloses a liquid crystal display that includes a plastic frame, a printed circuit board, a pin, a slot, a first constraining part and a liquid crystal panel. The printed circuit board has at least one hole therein. The pin is disposed on the plastic frame. The slot is formed on the pin and extends along the major axis of the pin. The first constraining part is disposed on the side surface of the pin for constraining the printed circuit board between the first constraining part and the plastic frame. The liquid crystal panel is held by the plastic frame and electrically connected to the printed circuit board.
    Type: Grant
    Filed: February 16, 2009
    Date of Patent: July 8, 2014
    Assignee: AU Optronics Corporation
    Inventors: Chia-Hsin Chang, Lin-Wei Chiu, Po-Chun Hsu
  • Package assembly cleaning process using vaporized solvent
    Patent number: 8702871
    Abstract: A method includes generating a solvent-containing vapor that contains a solvent. The solvent-containing vapor is conducted to a package assembly to clean the package assembly. The solvent-containing vapor condenses to form a liquid on a surface of the package assembly, and flows off from the surface of the package assembly.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: April 22, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Li Hsiao, Bor-Ping Jang, Kuei-Wei Huang, Lin-Wei Wang, Chien Ling Hwang, Chung-Shi Liu
  • Rotating Fluidized Bed Catalytic Pyrolysis Reactor
    Publication number: 20140073822
    Abstract: Reactors for the pyrolysis of pyrolyzable matter, pyrolysis systems incorporating the reactors and methods of using the reactors are provided. Also provided are systems and methods for integrating the pyrolysis and hydrodeoxygenation of pyrolyzable matter. The pyrolysis reactors create a horizontally rotating, fluidized-bed to which pyrolyzable matter, such as biomass, may be converted via pyrolysis into liquid fuels and/or value-added chemicals.
    Type: Application
    Filed: July 7, 2013
    Publication date: March 13, 2014
    Applicant: South Dakota State University
    Inventors: Lin Wei, James Julson
  • OBJECT GRIPPING DEVICE USING SOLENOID VALVE
    Publication number: 20140053617
    Abstract: An object gripping device using a solenoid valve includes a base having two opposite ends thereof, a fastening portion pivoted at one end of the base and having an object-gripping trench and a through opening having a stopping surface therein at two opposite ends of the fastening portion, a transmission portion pivoted at the other end of the base, a stopping shaft extending through both the transmission portion and the through opening, a first spring connected both the base and the fastening portion, a second spring connected both the base and the transmission portion, and a solenoid valve connected the base and the transmission portion.
    Type: Application
    Filed: April 29, 2013
    Publication date: February 27, 2014
    Applicant: Quanta Computer Inc.
    Inventors: Lin-Wei HUANG, Sheng-Feng CHEN, Jung-Wen CHANG
  • Innovative Multi-Purpose Dipping Plate
    Publication number: 20140048586
    Abstract: The present disclosure is directed to an apparatus for the application of soldering flux to a semiconductor workpiece. In some embodiments the apparatus comprises a dipping plate having a reservoir which is adapted to containing different depths of flux material. In some embodiments, the reservoir comprises at least two landing regions having sidewalls which form first and second dipping zones. The disclosed apparatus can allow dipping of the semiconductor workpiece in different depths of soldering flux without the necessity for changing dipping plates.
    Type: Application
    Filed: August 15, 2012
    Publication date: February 20, 2014
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Bor-Ping Jang, Lin-Wei Wang, Ying-Jui Huang, Yi-Li Hsiao, Chien Ling Hwang, Chung-Shi Liu
  • Transistors, Methods of Manufacture Thereof, and Image Sensor Circuits
    Publication number: 20140042506
    Abstract: Transistors, methods of manufacturing thereof, and image sensor circuits are disclosed. In one embodiment, a transistor includes a buried channel disposed in a workpiece, a gate dielectric disposed over the buried channel, and a gate layer disposed over the gate dielectric. The gate layer comprises an I shape in a top view of the transistor.
    Type: Application
    Filed: August 8, 2012
    Publication date: February 13, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Fredrik Ramberg, Tse-Hua Lu, Tsun-Lai Hsu, Victor Chiang Liang, Chi-Feng Huang, Yu-Lin Wei, Shu Fang Fu
  • Protection cover mechanism with enhanced space utilization
    Patent number: 8649502
    Abstract: A protection cover mechanism is disclosed. A hollow hinge tube is connected to a protective cover. A first hinge cover body is connected to the hollow hinge tube and includes a positioning rib. A spring is disposed in the first hinge cover body and abuts the hollow hinge tube. A hollow driven member is movably disposed in the first hinge cover body and abuts the spring. The spring is abutted between the hollow hinge tube and the hollow driven member. The hollow driven member includes a protrusion. The positioning rib is positioned on the hollow driven member, forcing the hollow driven member to move linearly with respect to the first hinge cover body. A fixing base includes a hollow tube fit on the hollow driven member and having an annular inner guide track with an undulated profile. The protrusion abuts the annular inner guide track.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: February 11, 2014
    Assignee: Quanta Computer Inc.
    Inventors: Jung-Wen Chang, Ming-Yuan Lan, Ching-Chung Wang, Lin-Wei Huang
  • Protection structure
    Patent number: 8643818
    Abstract: A flat panel display device includes a display panel, a backlight module, a printed circuit board and a protection structure. The backlight module is disposed on a non-display side of the display panel. The printed circuit board with a signal connector is connected with the display panel and disposed between the display panel and the printed circuit board. The protection structure is used to protect the backlight module from the deformation caused by the external force, especially the optically films in it, like conductive film etc. The protection structure includes a protective film, a movable piece and an elastic element. The protective film is covered on the printed circuit board and having an opening to expose the signal connector. The movable piece is connected with the protective film, and the opening is disposed between the movable piece and the protective film.
    Type: Grant
    Filed: January 20, 2011
    Date of Patent: February 4, 2014
    Assignee: Au Optronics Corporation
    Inventors: Lin-Wei Chiu, Cheng-Min Tsai
  • PORTABLE ELECTRONIC DEVICE
    Publication number: 20140029189
    Abstract: A portable electronic device comprises an upper member, a lower member having two guiding grooves, two supports and two connecting members. One end of each support is pivoted to the upper member with a first pivot portion. The other end of each support is pivoted to the lower member with a second pivot portion. One end of each connecting member is pivoted at one side of the upper member, and the other end thereof is restricted in the guiding groove and capable of reciprocally sliding in the guiding groove.
    Type: Application
    Filed: December 19, 2012
    Publication date: January 30, 2014
    Applicant: QUANTA COMPUTER INC.
    Inventors: Jung-Wen CHANG, Ming-Yuan LAN, Ching-Cheng WANG, Lin-Wei HUANG
  • Forming low stress joints using thermal compress bonding
    Patent number: 8616433
    Abstract: A method of forming a bump structure includes providing a first work piece including a dielectric layer having a top surface; placing a second work piece facing the first work piece; placing a heating tool contacting the second work piece; and heating the second work piece using the heating tool to perform a reflow process. A first solder bump between the first and the second work pieces is melted to form a second solder bump. Before the second solder bump solidifies, pulling the second work piece away from the first work piece, until an angle formed between a tangent line of the second solder bump and the top surface of the dielectric layer is greater than about 50 degrees, wherein the tangent line is drawn at a point where the second solder bump joins the dielectric layer.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: December 31, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuei-Wei Huang, Wei-Hung Lin, Lin-Wei Wang, Bor-Ping Jang, Ming-Da Cheng, Chung-Shi Liu
  • Backlight module
    Patent number: 8608331
    Abstract: A backlight module includes a first optical film with high light reflection characteristics, a second optical film with polarization light selection transmission characteristics and light reflection characteristics, a plurality of lampshades, and a plurality of line light sources. Each lampshade has high light reflection characteristics and is disposed between optical films so that any two spaced-apart adjacent lampshades define a light mixing chamber between optical films. Each line light source is disposed in a corresponding light mixing chamber and is mounted to a corresponding lampshade for emitting light.
    Type: Grant
    Filed: March 6, 2012
    Date of Patent: December 17, 2013
    Assignee: TPV Display Technology (Xiamen) Co., Ltd.
    Inventors: Lin Wei, Tu Cheng Yu
  • Apparatus and Method for the Singulation of a Semiconductor Wafer
    Publication number: 20130273717
    Abstract: The present disclosure is directed to an apparatus for the singulation of a semiconductor substrate or wafer. In some embodiments the singulation apparatus comprises a plurality of cutting devices. The cutting devices are configured to form multiple concurrent cutting lines in parallel on a surface of the semiconductor wafer. In some embodiments, the singulation apparatus comprises at least two dicing saws or laser modules. The disclosed singulation apparatus can dice the semiconductor wafer into individual chips by dicing in a direction across a complete circumferential edge of the wafer, thereby decreasing process time and increasing throughput.
    Type: Application
    Filed: April 17, 2012
    Publication date: October 17, 2013
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien Ling Hwang, Yi-Li Hsiao, Bor-Ping Jang, Hsin-Hung Liao, Lin-Wei Wang, Chung-Shi Liu
  • ELECTRIC FIREPLACE
    Publication number: 20130258640
    Abstract: Disclosed herein are electric fireplaces comprising (a) a shade comprising a plurality of openings; (b) a reflector comprising a shaft and a plurality of flame-shaped reflecting elements; (c) a simulated fuel bed; (d) a light source; and (e) a flame display screen, wherein the flame display screen is located between the reflector and simulated fuel bed, and wherein the shade is located between the light source and the reflector so that light from the light source passes through the plurality of openings of the shade.
    Type: Application
    Filed: March 29, 2012
    Publication date: October 3, 2013
    Applicant: DONGGUAN SONG WEI ELECTRIC TECHNOLOGY CO., LTD.
    Inventor: LIN WEI LU
  • APPARATUS AND METHOD OF SEPARATING WAFER FROM CARRIER
    Publication number: 20130248119
    Abstract: A method of separating a wafer from a carrier includes placing a wafer assembly on a platform. The wafer assembly includes the wafer, the carrier, and a layer of wax between the wafer and the carrier. A wafer frame is mounted on the wafer of the wafer assembly. The layer of wax is softened. The wafer and the wafer frame mounted thereon are separated, by a first robot arm, from the carrier.
    Type: Application
    Filed: March 22, 2012
    Publication date: September 26, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chien Ling HWANG, Lin-Wei WANG, Chung-Shi LIU
  • METHOD AND DEVICE FOR CUTTING SEMICONDUCTOR WAFERS
    Publication number: 20130244403
    Abstract: A method for cutting a semiconductor wafer into semiconductor chips that reduces defects at the semiconductor chip corners. The method includes a pre-cutting processing step of trimming the semiconductor chip corners so that mechanical stress is reduced at the corners. The method includes dicing channels on a semiconductor wafer thereby defining the geometrical shape of one of the semiconductor chips, modifying the corners of the one of the semiconductor chips, and cutting the semiconductor wafer to separate the one of the semiconductor chips from other semiconductor chips.
    Type: Application
    Filed: March 13, 2012
    Publication date: September 19, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chien Ling HWANG, Lin-Wei WANG, Chung-Shi LIU