Abstract: We identified 17 transcription factor genes that regulate lipid production and activity in an organism. We subsequently detailed characterization of one of them (psr1). Constructs, methods and systems for enhancing or increasing lipid production in an organism are described.

Abstract: A method of determining the presence of a novel structural variation in a genome using long-read genome sequence fragments includes a process of aligning, filtering ranking and linking long-read sequence fragments against a reference genome. Presence of a novel structural variation is present in said genome can be determined when said linked alignment contains multiple linked fragments that are mapped to a single locus, referred to as a split-read.

Abstract: Methods of forming an EDNMOS with polysilicon fingers between a gate and a nitride spacer and the resulting devices are provided. Embodiments include forming a polysilicon layer upon a GOX layer over a substrate; forming a gate and plurality of fingers and a gate and plurality of fingers through the polysilicon layer down the GOX layer; forming an oxide layer over the GOX layer and sidewalls of the gates and fingers; forming a nitride layer over the oxide layer; removing portions of the nitride and oxide layers down to the polysilicon and GOX layers to form nitride spacers; and forming S/D regions laterally separated in the substrate, each S/D region adjacent to a nitride spacer.

Abstract: We identified 17 transcription factor genes that regulate lipid production and activity in an organism. We subsequently detailed characterization of one of them (psr1). Constructs, methods and systems for enhancing or increasing lipid production in an organism are described.

Abstract: Methods, computer program products, and systems are presented. The method computer program products, and systems can include, for instance: receiving, by a Network Virtualization Edge (NVE) of a first virtual network (VN), a multicast packet from a virtual machine (VM) of the first virtual network (VN); determining, by the NVE, whether the NVE currently supports forwarding the multicast packet to a second NVE of a second virtual network (VN), the second virtual network (VN) being logically separated from the first virtual network (VN); responsively to determining that the NVE currently supports forwarding the multicast packet to a second NVE of a second virtual network (VN) forwarding, by the NVE, the multicast packet to the second NVE.

Abstract: A semiconductor device includes a substrate, wherein the substrate includes a channel region. The semiconductor device further includes an isolation feature in the substrate. The isolation feature includes a first portion in the substrate, and a second portion extending along a top surface of the substrate. The second portion partially covers the channel region. The semiconductor device further includes a gate structure over the substrate, wherein the gate structure partially covers the second portion of the isolation feature.

Abstract: A low noise device includes an isolation feature in a substrate. The low noise device further includes a gate stack over a channel in the substrate. The gate stack includes a gate dielectric layer extending over a portion of the isolation feature, and a gate electrode over the gate dielectric layer. The low noise device further includes a charge trapping reducing structure adjacent to the isolation feature. The charge trapping reducing structure is configured to reduce a number of charge carriers adjacent an interface between the isolation feature and the channel.

Abstract: A method for pull testing a wire bond. The method including the steps of: (i) with a wire bonding tool, bonding an end of a wire to make a bond at a first location on a bonding surface having a conductive material, such that the bond completes an electrical circuit; (ii) clamping the wire with a wire clamp; (iii) pulling the wire with the wire clamp to apply a predetermined pulling force; (iv) detecting whether the electrical circuit is open; and (v) if the electrical circuit is open, determining that there has been a bond failure, and automatically incrementing a bond failure count.

Abstract: Obtaining mobile terminal security information based on a cloud service includes synchronizing mobile terminal information with a cloud, receiving security information sent by the cloud, and performing corresponding security processing according to the security information. The security information is generated when the cloud determines that a security risk exists in a mobile terminal. The generated security information is sent by the cloud to the mobile terminal. Whether the security risk exists in the mobile terminal is obtained by the cloud through determining with reference to the mobile terminal information and latest security data of the cloud, and the determining step is triggered by updating of security data of the cloud.

Abstract: A low noise device includes an isolation feature in a substrate. The low noise device further includes a gate stack over a channel in the substrate. The gate stack includes a gate dielectric layer extending over a portion of the isolation feature, and a gate electrode over the gate dielectric layer. The low noise device further includes a charge trapping reducing structure adjacent to the isolation feature. The charge trapping reducing structure is configured to reduce a number of charge carriers adjacent an interface between the isolation feature and the channel.

Abstract: An apparatus for separating a wafer from a carrier includes a platform having an upper surface, a tape feeding unit, a first robot arm, and a controller coupled to the platform. The controller is configured to mount a wafer frame, by using the tape feeding unit, on a wafer of a wafer assembly on the upper surface of the platform. The wafer assembly includes the wafer, a carrier, and a layer of wax between the wafer and the carrier. The controller is also configured to heat the upper surface of the platform to a predetermined temperature and separate, by the first robot arm, the wafer and the wafer frame mounted thereon from the carrier.

Abstract: The present disclosure is directed to an apparatus for the application of soldering flux to a semiconductor workpiece. In some embodiments the apparatus comprises a dipping plate having a reservoir which is adapted to containing different depths of flux material. In some embodiments, the reservoir comprises at least two landing regions having sidewalls which form first and second dipping zones. The disclosed apparatus can allow dipping of the semiconductor workpiece in different depths of soldering flux without the necessity for changing dipping plates.

Abstract: We identified 17 transcription factor genes that regulate lipid production and activity in an organism. We subsequently detailed characterization of one of them (psr1). Constructs, methods and systems for enhancing or increasing lipid production in an organism are described.

Abstract: A method for pull testing a wire bond. The method including the steps of: (i) with a wire bonding tool, bonding an end of a wire to make a bond at a first location on a bonding surface having a conductive material, such that the bond completes an electrical circuit; (ii) clamping the wire with a wire clamp; (iii) pulling the wire with the wire clamp to apply a predetermined pulling force; (iv) detecting whether the electrical circuit is open; and (v) if the electrical circuit is open, determining that there has been a bond failure, and automatically incrementing a bond failure count.

Abstract: An object gripping device using a electromagnetic assembly includes a base having two opposite ends thereof, a fastening portion pivoted at one end of the base and having an object-gripping trench and a through opening having a stopping surface therein at two opposite ends of the fastening portion, a transmission portion pivoted at the other end of the base, a stopping shaft extending through both the transmission portion and the through opening, a first spring connected both the base and the fastening portion, a second spring connected both the base and the transmission portion, and a electromagnetic assembly connected the base and the transmission portion.

Abstract: A hanging structure includes a main body, two first hooks and a second hook. The main body has an outer surface, and the outer surface has a first end. The two first hooks are disposed on the first end. The second hook is disposed on the first end. The second hook is located between the two first hooks, and the length of the part of each of the two first hooks above the outer surface is longer than the length of the part of the second hook above the outer surface.

Abstract: A portable electronic device comprises an upper member, a lower member having two guiding grooves, two supports and two connecting members. One end of each support is pivoted to the upper member with a first pivot portion. The other end of each support is pivoted to the lower member with a second pivot portion. One end of each connecting member is pivoted at one side of the upper member, and the other end thereof is restricted in the guiding groove and capable of reciprocally sliding in the guiding groove.

Abstract: A hanging structure includes a main body, two first hooks and a second hook. The main body has an outer surface, and the outer surface has a first end. The two first hooks are disposed on the first end. The second hook is disposed on the first end. The second hook is located between the two first hooks, and the length of the part of each of the two first hooks above the outer surface is longer than the length of the part of the second hook above the outer surface.

Abstract: A method for cutting a semiconductor wafer into semiconductor chips that reduces defects at the semiconductor chip corners. The method includes a pre-cutting processing step of trimming the semiconductor chip corners so that mechanical stress is reduced at the corners. The method includes dicing channels on a semiconductor wafer thereby defining the geometrical shape of one of the semiconductor chips, modifying the corners of the one of the semiconductor chips, and cutting the semiconductor wafer to separate the one of the semiconductor chips from other semiconductor chips.

Abstract: An apparatus comprising a data framer configured to frame a Media Access Control (MAC) control message for transmission, the MAC control message comprising an organization specific identifier (OUI) and at least one type-length-value (TLV) comprising a type field, a length field, and a value field, wherein a format of the TLV is specified by the OUI, and wherein the value field comprises information related to operation, administration, and maintenance (OAM) features of a network. Also included is an apparatus comprising at least one component configured to implement a method comprising compiling an OAM message comprising a plurality of organization-specific TLVs and an organization unique identifier (OUI) that indicates an organization responsible for the format of the TLV, and transmitting the OAM message.