Patents by Inventor Lin Yu

Lin Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8134163
    Abstract: A semiconductor device having light-emitting diodes (LEDs) formed on a concave textured substrate is provided. A substrate is patterned and etched to form recesses. A separation layer is formed along the bottom of the recesses. An LED structure is formed along the sidewalls and, optionally, along the surface of the substrate between adjacent recesses. In these embodiments, the surface area of the LED structure is increased as compared to a planar surface. In another embodiment, the LED structure is formed within the recesses such that the bottom contact layer is non-conformal to the topology of the recesses. In these embodiments, the recesses in a silicon substrate result in a cubic structure in the bottom contact layer, such as an n-GaN layer, which has a non-polar characteristic and exhibits higher external quantum efficiency.
    Type: Grant
    Filed: October 8, 2008
    Date of Patent: March 13, 2012
    Assignee: Taiwan Semiconductor Manfacturing Co., Ltd.
    Inventors: Chen-Hua Yu, Hung-Ta Lin, Wen-Chih Chiou, Ding-Yuan Chen, Chia-Lin Yu
  • Publication number: 20120044648
    Abstract: A fixing mechanism for fixing a thermal module on a base includes a U-shaped buckling component disposed on a side of the base for buckling a thermal fin and a heat conducting block of the thermal module, and a fixing component disposed on the other side of the base and connected to the U-shaped buckling component for clipping the base with the U-shaped buckling component.
    Type: Application
    Filed: October 24, 2010
    Publication date: February 23, 2012
    Inventors: Lin-Yu Lee, Shang-Chih Yang
  • Publication number: 20120036174
    Abstract: A system and method for providing memory bandwidth efficient correlation acceleration. A correlation accelerator or correlator (e.g., an X*Y correlator) can be configured in association with a processor of a wireless communication system for correlating an input signal data sequence (X) and its shifted versions with a reference data sequence. Shifted versions (including the 0-shifted or the original) with respect to the input signal data sequence can be generated for each column (Y columns) of a sliding window in the correlator in order to reduce an input bandwidth requirement. Each input signal data and the shifted versions can be concurrently multiplied with the reference signal data and the results can be summed together in order to generate an output signal data profile. The output signal data profile can be stored into an accumulator register in order to reduce an output bandwidth requirement.
    Type: Application
    Filed: August 3, 2010
    Publication date: February 9, 2012
    Inventor: Meng-Lin Yu
  • Publication number: 20120025234
    Abstract: A light-emitting diode (LED) device is provided. The LED device has raised semiconductor regions formed on a substrate. LED structures are formed over the raised semiconductor regions such that bottom contact layers and active layers of the LED device are conformal layers. The top contact layer has a planar surface. In an embodiment, the top contact layers are continuous over a plurality of the raised semiconductor regions while the bottom contact layers and the active layers are discontinuous between adjacent raised semiconductor regions.
    Type: Application
    Filed: October 6, 2011
    Publication date: February 2, 2012
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Wen-Chih Chiou, Ding-Yuan Chen, Chia-Lin Yu, Hung-Ta Lin
  • Publication number: 20120030450
    Abstract: A method and system for parallel computation of a linear sequential circuit (LSC) based on a state transition matrix is disclosed herein. A multistep state transition matrix and a multistep output generation matrix can be pre-computed and stored in association with the linear sequential circuit. The multiple state transitions and the multiple output bits can be computed by multiplying the current input-state vector with a multistep next state transition matrix and a multistep output generation matrix, respectively. Multiple state transitions and multiple output bits can be generated in parallel in a single clock cycle based on the pre-computed state transition matrix and the output generation matrix utilizing a dot product in order to improve computational speed. Such a simple augmentation provides a flexible and inexpensive solution for high speedup linear sequential circuit computation with respect to a processor.
    Type: Application
    Filed: July 28, 2010
    Publication date: February 2, 2012
    Inventor: Meng-Lin Yu
  • Publication number: 20120014631
    Abstract: A linear motion guide device includes a movable member attached onto an elongated member for forming an endless multiple-turn, helical raceway between the elongated member and the movable member and for receiving ball bearing members, and a detecting device includes a magnetic member and an integrated circuit disposed in the movable member and arranged close to the endless multiple-turn, helical raceway for detecting a moving frequency or a movement of the ball bearing members through the endless multiple-turn, helical raceway of the linear motion guide device and for detecting a wear or failure of the ball bearing members and for generating a warning signal.
    Type: Application
    Filed: July 13, 2010
    Publication date: January 19, 2012
    Inventors: Fu-Chun HUANG, Yih-Chyun HWANG, Chun-Lin YU
  • Publication number: 20120007048
    Abstract: A semiconductor structure includes a substrate and a conductive carrier-tunneling layer over and contacting the substrate. The conductive carrier-tunneling layer includes first group-III nitride (III-nitride) layers having a first bandgap, wherein the first III-nitride layers have a thickness less than about 5 nm; and second III-nitride layers having a second bandgap lower than the first bandgap, wherein the first III-nitride layers and the second III-nitride layers are stacked in an alternating pattern. The semiconductor structure is free from a III-nitride layer between the substrate and the conductive carrier-tunneling layer. The semiconductor structure further includes an active layer over the conductive carrier-tunneling layer.
    Type: Application
    Filed: September 20, 2011
    Publication date: January 12, 2012
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Lin Yu, Ding-Yuan Chen, Chen-Hua Yu, Wen-Chih Chiou
  • Publication number: 20120010139
    Abstract: Thermal responsive compositions for treating bone diseases are provided. The thermal responsive composition for treating bone diseases includes a bone growth factor and a biodegradable copolymer. The biodegradable copolymer has a structure of Formula (I) or Formula (II): A-B-BOX-B-A??(Formula I) and B-A-B-(BOX-B-A-B)n-BOX-B-A-B??Formula (II), wherein, A includes a hydrophilic polyethylene glycol polymer, B includes a hydrophobic polyester polymer, BOX is a bifunctional group monomer of 2,2?-Bis(2-oxazoline) and used for coupling the blocks A-B or B-A-B, and n is an integer and the same or more than 0.
    Type: Application
    Filed: June 29, 2011
    Publication date: January 12, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shen-Hua Peng, Hsin-Hsin Shen, Liang-Yo Yang, Meng-Yow Hsieh, Pei-Shan Li, Wei-Lin Yu, Tsai-Yu Lin, Po-Liang Lai, Jui-Sheng Sun, Chih-Hung Chang, Yi-Hung Lin
  • Publication number: 20120008896
    Abstract: The present invention relates to an integrate optics for multiplexer transceiver module, comprising: a substrate, a multiplexer, a first waveguide coupling device, a second waveguide coupling device and a third waveguide coupling device. In the present invention, the semiconductor materials and the semiconductor process are used to integrate variety of optical devices on a single semiconductor substrate (chip) by way of modular design and miniaturization, so as to carry out an integrated optics communication framework with high efficiency and low cost. Moreover, in the present invention, a plurality of optical receivers are integrated on the substrate by means of flip-chip bonding, so that, not only the objective of integrating the optical devices is accomplished but also the intensity of laser optical signal is increased.
    Type: Application
    Filed: June 10, 2011
    Publication date: January 12, 2012
    Applicant: NATIONAL TSING-HUA UNIVERSITY
    Inventors: Ming-Chang Lee, Kai-Ning Ku, Chung-Yung Wang, Kuo-Chung Huang, Tsung-Chi Hsu, Chung-Hsin Fu, Lin-Yu Tai
  • Publication number: 20110310944
    Abstract: A method and system for canonical channel estimation in the Long Term Evolution uplink where a multi-frequency signal is generated and then converted to frequency spectrum which is then convolved in the frequency domain with a truncated window function to obtain a time domain channel impulse response. The time domain channel impulse response can be then transformed to a frequency domain to produce a down sampled user channel response, which can be then linearly interpolated to provide a channel estimate for a plurality of subcarriers. Such an approach achieves channel estimation within Long Term Evolution at only canonical locations to reduce complexity without loss in channel entropy.
    Type: Application
    Filed: October 19, 2010
    Publication date: December 22, 2011
    Inventors: SAMER HIJAZI, KAMERAN AZADET, MENG-LIN YU, JOSEPH OTHMER, RAMON SANCHEZ PEREZ
  • Publication number: 20110314073
    Abstract: A method for efficient state transition matrix based LFSR computations are disclosed. A polynomial associated with a linear feedback shift register is defined. This polynomial is used to generate a single step state transition matrix. The single step state transition matrix is then modified into a more general k-step state transition matrix. The resultant combined matrix is reduced in size and can be multiplied by a state input vector, ultimately producing a plurality of next state-input vectors thereby providing improved efficiency in computing a LFSR.
    Type: Application
    Filed: October 22, 2010
    Publication date: December 22, 2011
    Inventor: Meng-Lin Yu
  • Patent number: 8058082
    Abstract: A light-emitting diode (LED) device is provided. The LED device has raised semiconductor regions formed on a substrate. LED structures are formed over the raised semiconductor regions such that bottom contact layers and active layers of the LED device are conformal layers. The top contact layer has a planar surface. In an embodiment, the top contact layers are continuous over a plurality of the raised semiconductor regions while the bottom contact layers and the active layers are discontinuous between adjacent raised semiconductor regions.
    Type: Grant
    Filed: August 11, 2008
    Date of Patent: November 15, 2011
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Wen-Chih Chiou, Ding-Yuan Chen, Chia-Lin Yu, Hung-Ta Lin
  • Publication number: 20110261280
    Abstract: A liquid crystal display (LCD) system is provided. The LCD system includes a light-passable plate, an LCD panel and a controller. The light-passable plate is configured to allow natural light to pass through the light-passable plate; and the LCD panel is coupled to the light-passable plate and is configured to receive the natural light passing through the light-passable plate. Further, the controller is coupled to the LCD panel to control the LCD panel such that the natural light passing through the light-passable plate is used as backlight for operation of the LCD panel. The light-passable plate structurally supports the LCD panel in addition to providing the natural light to the LCD panel.
    Type: Application
    Filed: April 27, 2010
    Publication date: October 27, 2011
    Inventor: Xiao Lin Yu
  • Publication number: 20110261276
    Abstract: A liquid crystal display (LCD) system is provided. The LCD system includes a light source and a self-contained display unit including at least a LCD panel and a light guide plate coupled together, wherein the light guide plate is configured to guide light from the light source to the LCD panel as backlight and to structurally support the LCD panel. Further, a plurality of pre-made hollow spaces are contained in the display unit configured to host components of the LCD system. The LCD system also includes a controller contained in the plurality of pre-made hollow spaces and coupled to the LCD panel to control the LCD panel such that the light passing through the light guide plate is used as backlight for operation of the LCD panel.
    Type: Application
    Filed: January 29, 2011
    Publication date: October 27, 2011
    Inventor: Xiao Lin Yu
  • Patent number: 8044409
    Abstract: A semiconductor structure includes a substrate and a conductive carrier-tunneling layer over and contacting the substrate. The conductive carrier-tunneling layer includes first group-III nitride (III-nitride) layers having a first bandgap, wherein the first III-nitride layers have a thickness less than about 5 nm; and second III-nitride layers having a second bandgap lower than the first bandgap, wherein the first III-nitride layers and the second III-nitride layers are stacked in an alternating pattern. The semiconductor structure is free from a III-nitride layer between the substrate and the conductive carrier-tunneling layer. The semiconductor structure further includes an active layer over the conductive carrier-tunneling layer.
    Type: Grant
    Filed: August 11, 2008
    Date of Patent: October 25, 2011
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Lin Yu, Ding-Yuan Chen, Chen-Hua Yu, Wen-Chih Chiou
  • Publication number: 20110255020
    Abstract: A method of driving pixels of a liquid crystal display, a pixel driving device, and a liquid crystal display having the same are provided. The liquid crystal display includes a liquid crystal panel and a pixel driving device, wherein the pixel driving device selectively outputs driving signals having different polarity permutations based on the structure of the display units in the liquid crystal panel.
    Type: Application
    Filed: April 15, 2011
    Publication date: October 20, 2011
    Inventors: Chun-Lin Yu, Kuan-Hung Liu, Wen-Fa Hsu
  • Publication number: 20110241061
    Abstract: The package substrates with through silicon plugs (or vias) described above provide lateral and vertical heat dissipation pathways for semiconductor chips that require thermal management. Designs of through silicon plugs (TSPs) with high duty ratios can most effectively provide heat dissipation. TSP designs with patterns of double-sided combs can provide high duty ratios, such as equal to or greater than 50%. Package substrates with high duty ratios are useful for semiconductor chips that generate large amount of heat. An example of such semiconductor chip is a light-emitting diode (LED) chip.
    Type: Application
    Filed: September 10, 2010
    Publication date: October 6, 2011
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chen-Hua YU, Hung-Pin CHANG, Yung-Chi LIN, Chia-Lin YU, Jui-Pin HUNG, Chien Ling HWANG
  • Publication number: 20110241040
    Abstract: The substrate with through silicon plugs (or vias) described above removes the need for conductive bumps. The process flow is very simple and cost efficient. The structures described combines the separate TSV, redistribution layer, and conductive bump structures into a single structure. By combining the separate structures, a low resistance electrical connection with high heat dissipation capability is created. In addition, the substrate with through silicon plugs (or vias, or trenches) also allows multiple chips to be packaged together. A through silicon trench can surround the one or more chips to provide protection against copper diffusing to neighboring devices during manufacturing. In addition, multiple chips with similar or different functions can be integrated on the TSV substrate. Through silicon plugs with different patterns can be used under a semiconductor chip(s) to improve heat dissipation and to resolve manufacturing concerns.
    Type: Application
    Filed: October 4, 2010
    Publication date: October 6, 2011
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chen-Hua YU, Hung-Pin CHANG, Yung-Chi LIN, Chia-Lin YU, Jui-Pin HUNG, Chien Ling HWANG
  • Patent number: 8015894
    Abstract: An intelligent transmission element includes a first element formed in a strip shape and disposed with a slot therein; a second element disposed with a containing space for placing the first element, wherein the inner side of the containing space is disposed with a tank corresponding to the plurality of slots, the tank and the plurality of slots forms a loading path for disposing a plurality of rolling elements and a silencing element. The silencing element is placed between the plurality of rolling elements and contains a dye container for a dye. When the silencing element is damaged due to an external force, the dye inside the dye container of the silencing element would color the transmission element to let the user notice that the silencing element is damaged.
    Type: Grant
    Filed: February 24, 2009
    Date of Patent: September 13, 2011
    Assignee: HIWIN Technologies Corp.
    Inventors: Yi-Chyun Hwang, Chun-Lin Yu, Chung-Hsueh Lin
  • Patent number: D645134
    Type: Grant
    Filed: December 21, 2010
    Date of Patent: September 13, 2011
    Assignee: Micro-Star International Corporation Limited
    Inventors: Lin Yu Lee, Shang Chih Yang