Abstract: A semiconductor package structure includes a conductive structure, at least one semiconductor element, an encapsulant, a redistribution structure and a plurality of bonding wires. The semiconductor element is disposed on and electrically connected to the conductive structure. The encapsulant is disposed on the conductive structure to cover the semiconductor element. The redistribution structure is disposed on the encapsulant, and includes a redistribution layer. The bonding wires electrically connect the redistribution structure and the conductive structure.

Abstract: A semiconductor package device includes a first conductive wall, a second conductive wall, a first insulation wall, a dielectric layer, a first electrode, and a second electrode. The first insulation wall is disposed between the first and second conductive walls. The dielectric layer has a first portion covering a bottom surface of the first conductive wall, a bottom surface of the second conductive wall and a bottom surface of the first insulation wall. The first electrode is electrically connected to the first conductive wall. The second electrode is electrically connected to the second conductive wall.

Abstract: Provided is an electronic package, including a first substrate of a first conductive structure and a second substrate of a second conductive structure, where a first conductive layer, a bump body and a metal auxiliary layer of the first conductive structure are sequentially formed on the first substrate, and a metal pillar, a second conductive layer, a metal layer and a solder layer of the second conductive structure are sequentially formed on the second substrate, such that the solder layer is combined with the bump body and the metal auxiliary layer to stack the first substrate and the second substrate.

Abstract: An oyster paper and a manufacturing method thereof are provided. The oyster paper is made of 60%-70% oyster shell powder, 10%-20% polymer, 15%-17% natural biodegradation inducing agent, and 3%-5% natural biodegradation assisting additive agent, by volume ratio, which are subjected to mixing and pre-melting processing, followed by compounding and pelletizing to prepare oyster paper pellets, which are then subjected to film blowing processing to be film-blown into an oyster paper product having a thickness of 0.05-0.5 millimeters. The oyster paper possesses the quality of wood pulp paper and shows bettered stiffness and wider applications. The oyster paper also provides, after being disposed and buried, an effect of being 100% natural degradation into compost for fertilizing the soil. As such, a kind of oyster paper featuring recycling and reuse of oceanic creature waste shell and natural microorganism induced degradation for composting and recycling and a manufacturing method thereof are provided.

Abstract: A MEMS transducing apparatus includes a substrate, a conductive pad, a stacked structure of a transducing device, a first polymer layer, a second polymer layer and a third polymer layer. An upper cavity is formed through the substrate. The conductive pad is formed on a first surface of the substrate to cover a first opening of the upper cavity. The stacked structure of the transducing device is formed on the conductive pad. The first polymer layer is formed on the first surface of the substrate. A lower cavity is formed through the first polymer layer. The stacked structure of the transducing device is exposed within the lower cavity. The third polymer layer is formed on a second surface of the substrate to cover a second opening of the upper cavity. The second polymer layer is formed on the first polymer layer to cover a third opening of the lower cavity.

Abstract: An LCoS panel and a method of preparation includes wafer level packaging, manufacturing vias through a silicon substrate in each die area of a wafer substrate, and manufacturing conductive interfaces on a back surface of the wafer substrate. Each conductive interface corresponds to one via and so connected to an active circuit of the die area where the conductive interface is located. Liquid crystal packaging is applied, a seal coated to surround the pixel circuit area of the active circuit on a front surface of the wafer substrate, injecting liquid crystal into a space defined by the seal, the seal coupling glass substrate comprising a transparent conductive layer and the wafer substrate, and then cutting. Wafer level chip scale packaging of the LCoS panels is thus achieved, the cost is reduced, the obtained LCoS panels are small in total area and of greater thinness.

Abstract: The present disclosure provides phenyl biphenylpyrimidine compounds of formula (I) and an organic electroluminescent device using the same: wherein X1 and A1 each independently represents substituted or unsubstituted C6-30 aryl or substituted or unsubstituted C5-30 heteroaryl having at least one heteroatom selected from the group consisting of N, O, and S, and n represents an integer of 1 or 2.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first semiconductor device, a first conductive layer and a second conductive layer. The first semiconductor device has a first conductive pad. The first conductive layer is disposed in direct contact with the first conductive pad. The first conductive layer extends along a direction substantially parallel to a surface of the first conductive pad. The second conductive layer is disposed in direct contact with the first conductive pad and spaced apart from the first conductive layer.

Abstract: A clamping lamp for clamping a monitor comprises a first light source and a clamping body including a second light source, a first clamping component including a first clamping portion and a lamp connection portion, and a second clamping component including a second clamping portion. The lamp connection portion connects with the first clamping portion and the first light source. The first clamping portion leans against a front surface of the monitor and the second clamping portion leans against a back surface of the monitor when the clamping lamp clamps the monitor so the first light source is located above a top surface of the monitor. The first light source emits light toward a first zone that the front surface faces toward. The second light source emits light toward a second zone that the back surface faces toward.

Abstract: A method for electrolysis of water and a method for preparing a catalyst for electrolysis of water are provided. The method for electrolysis of water includes using a high entropy alloy as a catalyst. Further, the method for preparing a catalyst for electrolysis of water includes the steps of placing a substrate in an aqueous electrolyte containing a high entropy alloy precursor and performing an electroplating process on the substrate to form a high entropy alloy catalyst on the substrate.

Abstract: A wiring structure and a method for manufacturing the same are provided. The wiring structure includes a conductive structure and at least one conductive through via. The conductive structure includes a plurality of dielectric layers, a plurality of circuit layers in contact with the dielectric layers, and a plurality of dam portions in contact with the dielectric layers. The dam portions are substantially arranged in a row and spaced apart from one another. The conductive through via extends through the dam portions.

Abstract: The invention provides a universal serial bus connector, including an insulating body and a plurality of terminals. The insulating body has a tongue portion and at least one recess located on the tongue portion. The terminals pass through the insulating body, and the terminals expose the insulating body from the tongue portion. The recess corresponds to at least one terminal and is located in an extending direction of the corresponding terminal on the tongue portion.

Abstract: A three-phase power apparatus with bidirectional power conversion applied to charge a battery of an electric vehicle. The three-phase charging apparatus includes an AC-to-DC conversion unit, a first DC bus, a first DC-to-DC conversion unit, a second DC bus, and a second DC-to-DC conversion unit. The first DC bus is coupled to the AC-to-DC conversion unit. The first DC-to-DC conversion unit includes an isolated transformer, a resonant tank, a first bridge arm assembly, and a second bridge arm assembly. The first bridge arm assembly is coupled to the first DC bus and a primary side of the isolated transformer. The second bridge arm assembly is coupled a secondary side of the isolated transformer. The second DC bus is coupled to the second bridge arm assembly. The second DC-to-DC conversion unit is coupled to the second DC bus and the battery.

Abstract: A power conversion system with abnormal energy protection includes a plurality of DC input power sources, a plurality of DC power converters, two output capacitors, and a protection circuit. An input side of each DC power converter is correspondingly coupled to one of the DC input power sources, and output sides of the DC power converters are coupled in parallel to each other to form a DC output bus. Two output capacitors are coupled in series between a positive voltage end and a negative voltage end of the DC output bus. The protection circuit is coupled between the DC input power sources and the two output capacitors. When one of the two output capacitors is abnormal, the protection circuit decouples the DC input power sources from the two output capacitors in a shorted-circuit manner.

Abstract: A dynamic network feature processing device includes a storage device and a processor. The storage device is configured to store a plurality of malicious feature groups. Each of the malicious feature groups corresponds to a malicious feature, and each of the malicious feature groups includes a plurality of malicious network addresses. The processor is coupled to the storage device. The processor is configured to: acquire an unknown network address of an unknown packet; compare the unknown network address with the malicious feature of each of the malicious feature groups; and filter the unknown packet when determining that the unknown network address matches at least one of the malicious feature of the plurality of malicious feature groups.

Abstract: A power conversion system applied to a solid state transformer includes a DC link, a plurality of capacitors, and a plurality of power conversion module assemblies. The plurality of capacitors is coupled in series between a positive bus and a negative bus of the DC link. Each of the power conversion module assemblies has a plurality of DC conversion modules. In any of the power conversion module assemblies, input sides of the DC conversion modules are connected in series to form two input ends of the power conversion module assembly, and output sides of the DC conversion modules are connected in parallel to form two output ends of the power conversion module assembly. Each of the plurality of power conversion module assemblies is correspondingly connected to each of the plurality of capacitors.

Abstract: A semiconductor package structure, an electronic device, and method for manufacturing the same are provided. The semiconductor package structure includes a wiring structure, a first electronic device, a second electronic device, and a protection material. The first electronic device is disposed on the wiring structure. The second electronic device is disposed on the wiring structure. The second electronic device defines a plurality of recesses on a first lateral side surface thereof. The protection material is disposed on the wiring structure and encapsulates the recesses of the second electronic device.

Abstract: A three-phase power apparatus with bidirectional power conversion applied to charge a battery of an electric vehicle. The three-phase charging apparatus includes an AC-to-DC conversion unit, a first DC bus, a first DC-to-DC conversion unit, a second DC bus, and a second DC-to-DC conversion unit. The first DC bus is coupled to the AC-to-DC conversion unit. The first DC-to-DC conversion unit includes an isolated transformer, a resonant tank, a first bridge arm assembly, and a second bridge arm assembly. The first bridge arm assembly is coupled to the first DC bus and a primary side of the isolated transformer. The second bridge arm assembly is coupled a secondary side of the isolated transformer. The second DC bus is coupled to the second bridge arm assembly. The second DC-to-DC conversion unit is coupled to the second DC bus and the battery.

Abstract: A fan management system includes a fan and a server. The fan includes a driving circuit, and the driving circuit is configured for driving the fan. The fan operates in an operation mode. The server is connected to the fan and is configured for controlling the operation of the fan. The driving circuit outputs a digital label signal when the fan operates abnormally, and the server obtains a production history, an operation information and a warning message of the fan through the digital label signal. The server adjusts the operation mode of the fan according to the warning message simultaneously.

Abstract: A slide rail assembly includes a first rail, a second rail, a working member and a contact feature. The second rail and the first rail are movable relative to each other. The working member is mounted to a connecting part arranged on one of the first rail and the second rail. The contact feature is arranged on the other one of the first rail and the second rail. At least one space is defined between the working member and the connecting part. When the slide rail assembly is in a retracted state, the working member is configured to block the contact feature, in order to prevent the second rail from being moved from a predetermined position along one direction.