Patents by Inventor Lung Huang

Lung Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
    Publication number: 20210287962
    Abstract: An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure. The intermediary structure has a flow guide portion and a permanent fluid combined with the flow guide portion so as to be in contact with the electronic element, thereby achieving a preferred heat dissipation effect and preventing excessive warping of the electronic element or the heat dissipation element due to stress concentration.
    Type: Application
    Filed: May 12, 2020
    Publication date: September 16, 2021
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
  • Semiconductor package devices having conductive layer, semiconductor wall, conductive wall, and insulation layer
    Patent number: 11107881
    Abstract: The subject application relates to a semiconductor package device, which includes a first conductive layer; a semiconductor wall disposed on the first conductive layer; a first conductive wall disposed on the first conductive layer; and an insulation layer disposed on the first conductive layer and between the semiconductor wall and the first conductive wall.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: August 31, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Shao Hsuan Chuang, Huang-Hsien Chang, Min Lung Huang, Yu Cheng Chen, Syu-Tang Liu
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210265311
    Abstract: A semiconductor device package includes a first substrate and a second substrate arranged above the first substrate. A first connector is disposed on the first substrate, and a first conductor passes through the second substrate and connects to the first connector.
    Type: Application
    Filed: February 20, 2020
    Publication date: August 26, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen-Long LU, Min Lung HUANG
  • SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210265459
    Abstract: A semiconductor package device includes a first conductive wall, a second conductive wall, a first insulation wall, a dielectric layer, a first electrode, and a second electrode. The first insulation wall is disposed between the first and second conductive walls. The dielectric layer has a first portion covering a bottom surface of the first conductive wall, a bottom surface of the second conductive wall and a bottom surface of the first insulation wall. The first electrode is electrically connected to the first conductive wall. The second electrode is electrically connected to the second conductive wall.
    Type: Application
    Filed: February 26, 2020
    Publication date: August 26, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shao Hsuan CHUANG, Huang-Hsien CHANG, Min Lung HUANG
  • SLIDE RAIL ASSEMBLY
    Publication number: 20210251385
    Abstract: A slide rail assembly includes a first rail, a second rail displaceable with respect to the first rail, a third rail displaceable with respect to the second rail, a working member movably mounted on the second rail and switchable between two states, and a contact feature on the third rail. The third rail can be displaced from a retracted position to an extended position in a first direction, and when the third rail is displaced from the extended position to the retracted position in a second direction, the contact feature is brought into contact with the working member in one of the two states so as to drive and thereby retract the second rail with respect to the first rail in the second direction.
    Type: Application
    Filed: June 4, 2020
    Publication date: August 19, 2021
    Inventors: KEN-CHING CHEN, SHIH-LUNG HUANG, CHIEN-HUNG KUO, CHUN-CHIANG WANG
  • Contra-rotating fan structure
    Patent number: 11078915
    Abstract: A contra-rotating fan structure includes a first base, a first fan, a second base, and a second fan. The first fan is rotatably disposed on the first base and includes a first hub. The first hub has a first largest width. The second fan is rotatably disposed on the second base and includes a second hub. The second hub has a second largest width. The first base and the second base are located between the first fan and the second fan. The second largest width is greater than the first largest width.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: August 3, 2021
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Chien-Hung Chen, Chao-Fu Yang, Chien-Chih Huang, Yueh-Lung Huang, Shun-Chen Chang
  • Electrical receptacle connector with elastic contacts
    Patent number: 11075490
    Abstract: An electrical receptacle connector includes an insulated housing, receptacle terminals, and a metallic shell. The insulated housing includes a base portion and a tongue portion outwardly extending from the base portion. Two metal sheets are arranged at two sides of the tongue portion. Each of the metal sheets includes a hook structure protruding from a side portion of the tongue portion and a through hole adjacent to the hook structure. The receptacle terminals are held in the base portion and disposed at the surface of the tongue portion. The metallic shell includes a receptacle cavity. The insulated housing is held in the receiving cavity. The contact arms are formed by the through holes of the metal sheets in an elastic manner, to avoid the hooks on both sides of the electrical plug connector in contact with the metal sheets in a poor interference manner.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: July 27, 2021
    Assignee: Advanced-Connectek Inc.
    Inventors: Yu-Lun Tsai, Pin-Yuan Hou, Dong-Fang Zeng, Shien-Lung Huang
  • Electronic package
    Patent number: 11069661
    Abstract: An electronic package is formed by arranging two encapsulating portions of different materials between a plurality of electronic components stacked to each other to adjust a stress distribution of the electronic package, so that the degree of warpage of the electronic package can be optimally controlled.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: July 20, 2021
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Wei-Jhen Chen, Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
  • Cabinet and slide rail kit thereof
    Patent number: 11067290
    Abstract: A cabinet and a slide rail kit thereof are disclosed. The cabinet includes an equipment body and a slide rail mechanism. The equipment body includes a first wall and a second wall. One of the first wall and the second wall is provided with a guiding path. The guiding path includes a blocking feature. The slide rail mechanism includes a supporting rail and a stop. The stop can be moved with respect to the supporting rail. When at a particular position, the stop can be blocked by the blocking feature of the guiding path to prevent the supporting rail from being displaced with respect to the equipment body from a predetermined position in a certain direction.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: July 20, 2021
    Assignees: King Slide Works Co., Ltd., King Slide Technology Co., Ltd.
    Inventors: Ken-Ching Chen, Shih-Lung Huang, Cheng-I Hsu, Chun-Chiang Wang
  • Method of manufacturing semiconductor structure
    Patent number: 11069652
    Abstract: A method of manufacturing a semiconductor structure is provided. The method includes providing a first substrate including a plurality of conductive bumps disposed over the first substrate; providing a second substrate; disposing a patterned adhesive over the first substrate, wherein at least a portion of the plurality of conductive bumps is exposed through the patterned adhesive; bonding the first substrate with the second substrate; and singulating a chip from the first substrate.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: July 20, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu, Chin-Yu Ku, De-Dui Liao, Kuo-Chio Liu, Kai-Di Wu, Kuo-Pin Chang, Sheng-Pin Yang, Isaac Huang
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210217701
    Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first semiconductor device, a first conductive layer and a second conductive layer. The first semiconductor device has a first conductive pad. The first conductive layer is disposed in direct contact with the first conductive pad. The first conductive layer extends along a direction substantially parallel to a surface of the first conductive pad. The second conductive layer is disposed in direct contact with the first conductive pad and spaced apart from the first conductive layer.
    Type: Application
    Filed: January 14, 2020
    Publication date: July 15, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Min Lung HUANG, Hung-Jung TU, Hsin Hsiang WANG, Chih-Wei HUANG, Shiuan-Yu LIN
  • METHOD FOR ELECTROLYSIS OF WATER AND METHOD FOR PREPARING CATALYSTS FOR ELECTROLYSIS OF WATER
    Publication number: 20210214852
    Abstract: A method for electrolysis of water and a method for preparing a catalyst for electrolysis of water are provided. The method for electrolysis of water includes using a high entropy alloy as a catalyst. Further, the method for preparing a catalyst for electrolysis of water includes the steps of placing a substrate in an aqueous electrolyte containing a high entropy alloy precursor and performing an electroplating process on the substrate to form a high entropy alloy catalyst on the substrate.
    Type: Application
    Filed: March 15, 2020
    Publication date: July 15, 2021
    Applicants: National Tsing Hua University, Chang Chun Plastics Co., Ltd., Chang Chun Petrochemical Co., Ltd., DAIREN CHEMICAL CORP.
    Inventors: Chun-Lung Huang, Shih-Yuan Lu
  • PRE-CHARGE CONTROL CIRCUIT AND METHOD OF CONTROLLING THE SAME
    Publication number: 20210203317
    Abstract: A pre-charge control circuit includes a control unit, a conversion unit, and a pre-charge switch. The control unit provides a control signal according to a PWM signal, and the conversion unit provides a control voltage according to the control signal. The pre-charge switch adjusts a magnitude of the current flowing through the input path of the electronic circuit according to the control voltage.
    Type: Application
    Filed: September 3, 2020
    Publication date: July 1, 2021
    Inventors: Li-Ching YANG, Wen-Lung HUANG, Sheng-Hua LI
  • Electrical receptacle connector
    Patent number: 11031725
    Abstract: An electrical receptacle connector includes an insulated housing, receptacle terminals, and a metallic shell. The insulated housing includes a base portion and a tongue portion outwardly extending from the base portion. A coverage region adjacent to the base portion is held on a surface of the tongue portion. The receptacle terminals are held in the base portion and disposed at the surface of the tongue portion. The receptacle terminals include a body portion and a contact portion, the body portion is held in the base portion and the tongue portion, and the contact portion is outwardly extending from one end of the body portion. Each of the receptacle terminals includes an avoidance portion between the contact portion and the body portion. The avoidance portion of each of the receptacle terminals is covered by the coverage region of the tongue portion.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: June 8, 2021
    Assignee: Advanced-Connectek Inc.
    Inventors: Yu-Lun Tsai, Pin-Yuan Hou, Dong-Fang Zeng, Shien-Lung Huang
  • POWER APPARATUS APPLIED IN SST STRUCTURE AND THREE-PHASE POWER SOURCE SYSTEM HAVING THE SAME
    Publication number: 20210159812
    Abstract: A power apparatus applied in an SST structure includes a first AC-to-DC conversion unit, a first DC bus, an isolated transformer, a DC-to-AC conversion unit, a second AC-to-DC conversion unit, and a second DC bus. The first AC-to-DC conversion unit has a first bridge arm and a second bridge arm. The first DC bus provides a first DC voltage. The isolated transformer has a primary side and a secondary side. The DC-to-AC conversion unit has a third bridge arm and a fourth bridge arm. The second AC-to-DC conversion unit has a fifth bridge arm and a sixth bridge arm. The second DC bus provides a second DC voltage.
    Type: Application
    Filed: February 5, 2021
    Publication date: May 27, 2021
    Inventors: Wen-Lung HUANG, Sheng-Hua LI
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210159168
    Abstract: A semiconductor package may include a first substrate and a second substrate, a redistribution layer (RDL), a first conductive via and a second conductive via. The first substrate has a first surface and a second surface opposite to the first surface. The second substrate has a first surface and a second surface opposite to the first surface. The RDL is disposed on the first surface of the first substrate and the first surface of the second substrate. The first conductive via passes through the RDL and is electrically connected to the first substrate. The second conductive via passes through the RDL and is electrically connected to the second substrate.
    Type: Application
    Filed: November 26, 2019
    Publication date: May 27, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen Hung HUANG, Yan Wen CHUNG, Min Lung HUANG
  • Slide Rail Assembly and Returning Device Thereof
    Publication number: 20210153650
    Abstract: A slide rail assembly includes a first rail, a second rail, a returning device and a connecting device. The returning device is arranged on the first rail and includes an elastic member and a movable member. The connecting device is arranged on the second rail and includes a first connecting member and a second connecting member. During a process of the second rail being moved relative to the first rail from an extended position along a retracting direction, the second connecting member is configured to contact the movable member, in order to drive the movable member to switch from a second state to a first state. Accordingly, the second rail is configured to be driven to move to a retracted position by an elastic force of the elastic member.
    Type: Application
    Filed: March 5, 2020
    Publication date: May 27, 2021
    Inventors: Ken-Ching Chen, Shih-Lung Huang, Yi-Syuan Jhao, Chun-Chiang Wang
  • UNIVERSAL SERIAL BUS CONNECTOR
    Publication number: 20210151924
    Abstract: The invention provides a universal serial bus connector, including an insulating body and a plurality of terminals. The insulating body has a tongue portion and at least one recess located on the tongue portion. The terminals pass through the insulating body, and the terminals expose the insulating body from the tongue portion. The recess corresponds to at least one terminal and is located in an extending direction of the corresponding terminal on the tongue portion.
    Type: Application
    Filed: November 17, 2020
    Publication date: May 20, 2021
    Applicant: Advanced Connectek Inc.
    Inventors: Er Li Huang, Pin-Yuan Hou, Yao Mei Wang, Hsien-Lung Huang
  • PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210151407
    Abstract: A package structure includes a wiring structure and a first electronic device. The wiring structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The first electronic device is electrically connected to the wiring structure, and has a first surface, a second surface and at least one lateral side surface extending between the first surface and the second surface. The first electronic device includes a first active circuit region and a first protrusion portion. The first protrusion portion protrudes from the at least one lateral side surface of the first electronic device. A portion of the first active circuit region is disposed in the first protrusion portion.
    Type: Application
    Filed: November 15, 2019
    Publication date: May 20, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Syu-Tang LIU, Min Lung HUANG, Huang-Hsien CHANG, Tsung-Tang TSAI, Ching-Ju CHEN
  • Semiconductor device packages and methods of manufacturing the same
    Patent number: 11011491
    Abstract: A semiconductor device package includes a connection structure having a first portion and a second portion extending from the first portion, the second portion having a width less than the first portion; and a dielectric layer surrounding the connection structure, wherein the dielectric layer and the second portion of the connection structure defines a space.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: May 18, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Shun-Tsat Tu, Pei-Jen Lo, Fong Ren Sie, Cheng-En Weng, Min Lung Huang