Abstract: A slide rail assembly includes a first rail, a second rail, a third rail, a synchronization device and a contact feature. The second rail is displaceable relative to the first rail. The third rail is displaceable relative to the second rail. The synchronization device is arranged on one of the second rail and the third rail. The contact feature is arranged on the other of the second rail and the third rail. The third rail and the second rail can synchronously displace relative to the first rail through the collaboration between the synchronization device and the contact feature.

Abstract: Provided is an electronic package, including a first substrate of a first conductive structure and a second substrate of a second conductive structure, where a first conductive layer, a bump body and a metal auxiliary layer of the first conductive structure are sequentially formed on the first substrate, and a metal pillar, a second conductive layer, a metal layer and a solder layer of the second conductive structure are sequentially formed on the second substrate, such that the solder layer is combined with the bump body and the metal auxiliary layer to stack the first substrate and the second substrate. Therefore, the arrangement of the bump body and the metal auxiliary layer allows complete reaction of the IMCs after reflowing the solder layer, and the volume of the conductive structures will not continue to shrink. As such, the problem of cracking of the conductive structures can be effectively averted.

Abstract: A slide rail assembly includes a first rail, a second rail displaceable with respect to the first rail, a third rail displaceable with respect to the second rail, a working member movably mounted on the second rail and switchable between two states, and a contact feature on the third rail. The third rail can be displaced from a retracted position to an extended position in a first direction, and when the third rail is displaced from the extended position to the retracted position in a second direction, the contact feature is brought into contact with the working member in one of the two states so as to drive and thereby retract the second rail with respect to the first rail in the second direction.

Abstract: A MEMS transducing apparatus includes a substrate, a conductive pad, a stacked structure of a transducing device, a first polymer layer, a second polymer layer and a third polymer layer. An upper cavity is formed through the substrate. The conductive pad is formed on a first surface of the substrate to cover a first opening of the upper cavity. The stacked structure of the transducing device is formed on the conductive pad. The first polymer layer is formed on the first surface of the substrate. A lower cavity is formed through the first polymer layer. The stacked structure of the transducing device is exposed within the lower cavity. The third polymer layer is formed on a second surface of the substrate to cover a second opening of the upper cavity. The second polymer layer is formed on the first polymer layer to cover a third opening of the lower cavity.

Abstract: A tool assembly apparatus may comprise a sleeve, a locating ball, an elastic locating piece, and a connecting rod. The sleeve has a first end and a second end, and the first end and the second end of the sleeve respectively have an axial first engaging hole and an axial second engaging hole which are communicated to axially penetrate through the sleeve. The inner diameter of the second engaging hole is smaller than the first engaging hole, and the sleeve has a radial through hole penetrating through an outer periphery thereof to communicate with the second engaging hole. The elastic locating piece has a ring body which comprises a locating hole and a cutting portion thereon. The connecting rod comprises a bearing section and a driving section, and a middle section is connected therebetween. The driving section has a locating recess formed thereon.

Abstract: An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure. The intermediary structure has a flow guide portion and a permanent fluid combined with the flow guide portion so as to be in contact with the electronic element, thereby achieving a preferred heat dissipation effect and preventing excessive warping of the electronic element or the heat dissipation element due to stress concentration.

Abstract: The subject application relates to a semiconductor package device, which includes a first conductive layer; a semiconductor wall disposed on the first conductive layer; a first conductive wall disposed on the first conductive layer; and an insulation layer disposed on the first conductive layer and between the semiconductor wall and the first conductive wall.

Abstract: A semiconductor device package includes a first substrate and a second substrate arranged above the first substrate. A first connector is disposed on the first substrate, and a first conductor passes through the second substrate and connects to the first connector.

Abstract: A semiconductor package device includes a first conductive wall, a second conductive wall, a first insulation wall, a dielectric layer, a first electrode, and a second electrode. The first insulation wall is disposed between the first and second conductive walls. The dielectric layer has a first portion covering a bottom surface of the first conductive wall, a bottom surface of the second conductive wall and a bottom surface of the first insulation wall. The first electrode is electrically connected to the first conductive wall. The second electrode is electrically connected to the second conductive wall.

Abstract: A slide rail assembly includes a first rail, a second rail displaceable with respect to the first rail, a third rail displaceable with respect to the second rail, a working member movably mounted on the second rail and switchable between two states, and a contact feature on the third rail. The third rail can be displaced from a retracted position to an extended position in a first direction, and when the third rail is displaced from the extended position to the retracted position in a second direction, the contact feature is brought into contact with the working member in one of the two states so as to drive and thereby retract the second rail with respect to the first rail in the second direction.

Abstract: A contra-rotating fan structure includes a first base, a first fan, a second base, and a second fan. The first fan is rotatably disposed on the first base and includes a first hub. The first hub has a first largest width. The second fan is rotatably disposed on the second base and includes a second hub. The second hub has a second largest width. The first base and the second base are located between the first fan and the second fan. The second largest width is greater than the first largest width.

Abstract: An electrical receptacle connector includes an insulated housing, receptacle terminals, and a metallic shell. The insulated housing includes a base portion and a tongue portion outwardly extending from the base portion. Two metal sheets are arranged at two sides of the tongue portion. Each of the metal sheets includes a hook structure protruding from a side portion of the tongue portion and a through hole adjacent to the hook structure. The receptacle terminals are held in the base portion and disposed at the surface of the tongue portion. The metallic shell includes a receptacle cavity. The insulated housing is held in the receiving cavity. The contact arms are formed by the through holes of the metal sheets in an elastic manner, to avoid the hooks on both sides of the electrical plug connector in contact with the metal sheets in a poor interference manner.

Abstract: An electronic package is formed by arranging two encapsulating portions of different materials between a plurality of electronic components stacked to each other to adjust a stress distribution of the electronic package, so that the degree of warpage of the electronic package can be optimally controlled.

Abstract: A cabinet and a slide rail kit thereof are disclosed. The cabinet includes an equipment body and a slide rail mechanism. The equipment body includes a first wall and a second wall. One of the first wall and the second wall is provided with a guiding path. The guiding path includes a blocking feature. The slide rail mechanism includes a supporting rail and a stop. The stop can be moved with respect to the supporting rail. When at a particular position, the stop can be blocked by the blocking feature of the guiding path to prevent the supporting rail from being displaced with respect to the equipment body from a predetermined position in a certain direction.

Abstract: A method of manufacturing a semiconductor structure is provided. The method includes providing a first substrate including a plurality of conductive bumps disposed over the first substrate; providing a second substrate; disposing a patterned adhesive over the first substrate, wherein at least a portion of the plurality of conductive bumps is exposed through the patterned adhesive; bonding the first substrate with the second substrate; and singulating a chip from the first substrate.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first semiconductor device, a first conductive layer and a second conductive layer. The first semiconductor device has a first conductive pad. The first conductive layer is disposed in direct contact with the first conductive pad. The first conductive layer extends along a direction substantially parallel to a surface of the first conductive pad. The second conductive layer is disposed in direct contact with the first conductive pad and spaced apart from the first conductive layer.

Abstract: A method for electrolysis of water and a method for preparing a catalyst for electrolysis of water are provided. The method for electrolysis of water includes using a high entropy alloy as a catalyst. Further, the method for preparing a catalyst for electrolysis of water includes the steps of placing a substrate in an aqueous electrolyte containing a high entropy alloy precursor and performing an electroplating process on the substrate to form a high entropy alloy catalyst on the substrate.

Abstract: A pre-charge control circuit includes a control unit, a conversion unit, and a pre-charge switch. The control unit provides a control signal according to a PWM signal, and the conversion unit provides a control voltage according to the control signal. The pre-charge switch adjusts a magnitude of the current flowing through the input path of the electronic circuit according to the control voltage.

Abstract: An electrical receptacle connector includes an insulated housing, receptacle terminals, and a metallic shell. The insulated housing includes a base portion and a tongue portion outwardly extending from the base portion. A coverage region adjacent to the base portion is held on a surface of the tongue portion. The receptacle terminals are held in the base portion and disposed at the surface of the tongue portion. The receptacle terminals include a body portion and a contact portion, the body portion is held in the base portion and the tongue portion, and the contact portion is outwardly extending from one end of the body portion. Each of the receptacle terminals includes an avoidance portion between the contact portion and the body portion. The avoidance portion of each of the receptacle terminals is covered by the coverage region of the tongue portion.

Abstract: A power apparatus applied in an SST structure includes a first AC-to-DC conversion unit, a first DC bus, an isolated transformer, a DC-to-AC conversion unit, a second AC-to-DC conversion unit, and a second DC bus. The first AC-to-DC conversion unit has a first bridge arm and a second bridge arm. The first DC bus provides a first DC voltage. The isolated transformer has a primary side and a secondary side. The DC-to-AC conversion unit has a third bridge arm and a fourth bridge arm. The second AC-to-DC conversion unit has a fifth bridge arm and a sixth bridge arm. The second DC bus provides a second DC voltage.