Abstract: An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.

Abstract: Provided herein are devices and systems comprising an illumination module configured to provide a source light to an optical interference module, which converts the source light to a line of light and processes light signal; an interference objective module, which handles light from the optical interference module and processes light signal generated from a sample; a two-dimensional camera configured to receive a backscattered interference signal from the sample, and a data processing module which processes the interference signal into an image.

Abstract: A slide rail assembly includes a first rail, a second rail, a returning device and a connecting device. The returning device is arranged on the first rail and includes an elastic member and a movable member. The connecting device is arranged on the second rail and includes a first connecting member and a second connecting member. During a process of the second rail being moved relative to the first rail from an extended position along a retracting direction, the second connecting member is configured to contact the movable member, in order to drive the movable member to switch from a second state to a first state. Accordingly, the second rail is configured to be driven to move to a retracted position by an elastic force of the elastic member.

Abstract: A slide rail assembly includes a first rail, a second rail, a working member and a contact feature. The second rail and the first rail are movable relative to each other. The working member is mounted to a connecting part arranged on one of the first rail and the second rail. The contact feature is arranged on the other one of the first rail and the second rail. At least one space is defined between the working member and the connecting part. When the slide rail assembly is in a retracted state, the working member is configured to block the contact feature, in order to prevent the second rail from being moved from a predetermined position along one direction.

Abstract: A wiring structure and a method for manufacturing the same are provided. The wiring structure includes a conductive structure and at least one conductive through via. The conductive structure includes a plurality of dielectric layers, a plurality of circuit layers in contact with the dielectric layers, and a plurality of dam portions in contact with the dielectric layers. The dam portions are substantially arranged in a row and spaced apart from one another. The conductive through via extends through the dam portions.

Abstract: A lamp clamp used to fix a light source on an object is disclosed. The lamp clamp includes a first clamping member and a second clamping member. The first clamping member includes a lamp fixing portion, a connecting portion and a stopping portion. The lamp fixing portion is used to fix the light source. The connecting portion is connected to the lamp fixing portion. The stopping portion is movably connected to the connecting portion and has a stopping surface selectively disposed at one of plural positions on the connecting portion. The second clamping member is connected to the connecting portion to clamp the object between the stopping surface and the second clamping member.

Abstract: A semiconductor device package includes a first substrate and a second substrate arranged above the first substrate. A first connector is disposed on the first substrate, and a first conductor passes through the second substrate and connects to the first connector.

Abstract: A semiconductor package may include a first substrate and a second substrate, a redistribution layer (RDL), a first conductive via and a second conductive via. The first substrate has a first surface and a second surface opposite to the first surface. The second substrate has a first surface and a second surface opposite to the first surface. The RDL is disposed on the first surface of the first substrate and the first surface of the second substrate. The first conductive via passes through the RDL and is electrically connected to the first substrate. The second conductive via passes through the RDL and is electrically connected to the second substrate.

Abstract: A semiconductor device package includes a conductive layer, a first conductive pillar, a circuit layer and a second conductive pillar. The conductive layer has a first surface. The first conductive pillar is disposed on the first surface of the conductive layer. The circuit layer is disposed over the conductive layer. The circuit layer has a first surface facing the conductive layer. The second conductive pillar is disposed on the first surface of the circuit layer. The first conductive pillar is physically spaced apart from the second conductive pillar and electrically connected to the second conductive pillar.

Abstract: A detection apparatus for unbalanced DC link capacitor voltage, the DC link provides a DC voltage and includes a plurality of capacitors coupled in series to two ends of the DC link and a plurality of balanced resistors coupled in series to two ends of the DC link and corresponding to the capacitors. The detection apparatus includes a plurality of sense resistors and a current sensor. One end of each sense resistor is coupled to a common-connected node of two capacitors, and the other end thereof is coupled to a common-connected node of two balanced resistors. The current sensor is coupled to one of the sense resistors and measures a current value of a current flowing through the sense resistor coupled to the current sensor.

Abstract: A wireless sound output device includes a wireless earbud and a charging base. The wireless earbud is placed in the charging base. If a true wireless stereo Bluetooth controller of the wireless earbud detects that a mode switching circuit of the charging base is switched to a wireless Bluetooth receiver mode, an analog signal is transmitted to an audio source output hole of the charging base through an audio source analog signal output switching unit of the wireless earbud.

Abstract: An auto orientating antenna device includes a base, a body and a processing chip. The base includes a motor comprising a rotating shaft. The body is connected to the rotating shaft and comprises at least one 5G antenna. The processing chip generates an auto orientating instruction according to at least one signal receiving status of the antenna unit. The motor drives the rotating shaft according to the auto orientating instruction, so as to let the antenna unit face a receiving direction.

Abstract: An auto orientating antenna device includes a base, a body and a processing chip. The base includes a motor comprising a rotating shaft. The body is connected to the rotating shaft and comprises at least one 5G antenna. The processing chip generates an auto orientating instruction according to at least one signal receiving status of the antenna unit. The motor drives the rotating shaft according to the auto orientating instruction, so as to let the antenna unit face a receiving direction.

Abstract: An externally-connected shop floor control (SFC) system comprising M shop floor control (SFC) devices is disclosed. By letting each of the M SFC devices be electrically connected between one test machine and one information read-out device, the SFC system is successfully implemented into a production line. Therefore, each of the M SFC devices is adopted to achieve a re-verification of pass record for a test object that is transferred from a previous-stage test machine, and is also adopted for collecting related test data of the test object transferred from a current-stage test machine. As such, the SFC system can be easily implemented into any one type of production line, so as to assist the manager of the production line in data collection, station passing control, manufacturing reports, and control of production efficiency and yield, without spending much cost of human resources and software/firmware developing.

Abstract: A lighting fixture includes a light emitting module, a first brightness enhancement component and a second brightness enhancement component. The light emitting module includes a light emitting surface. The first brightness enhancement component is disposed on the light emitting surface and corresponds to a first light emitting area of the light emitting module. The first brightness enhancement component concentrates light emitted from the first light emitting area with respect to a first plane, wherein the first plane is defined by a first axis and a first direction perpendicular to the first brightness enhancement component. The second brightness enhancement component concentrates light emitted from the second light emitting area with respect to a second plane, wherein the second plane is defined by a second axis and a second direction perpendicular to the second brightness enhancement component, and the first axis is not parallel to the second axis.

Abstract: A slide rail assembly includes a first rail, a second rail, a third rail, a synchronization device and a contact feature. The second rail is displaceable relative to the first rail. The third rail is displaceable relative to the second rail. The synchronization device is arranged on one of the second rail and the third rail. The contact feature is arranged on the other of the second rail and the third rail. The third rail and the second rail can synchronously displace relative to the first rail through the collaboration between the synchronization device and the contact feature.

Abstract: Provided is an electronic package, including a first substrate of a first conductive structure and a second substrate of a second conductive structure, where a first conductive layer, a bump body and a metal auxiliary layer of the first conductive structure are sequentially formed on the first substrate, and a metal pillar, a second conductive layer, a metal layer and a solder layer of the second conductive structure are sequentially formed on the second substrate, such that the solder layer is combined with the bump body and the metal auxiliary layer to stack the first substrate and the second substrate. Therefore, the arrangement of the bump body and the metal auxiliary layer allows complete reaction of the IMCs after reflowing the solder layer, and the volume of the conductive structures will not continue to shrink. As such, the problem of cracking of the conductive structures can be effectively averted.

Abstract: A slide rail assembly includes a first rail, a second rail displaceable with respect to the first rail, a third rail displaceable with respect to the second rail, a working member movably mounted on the second rail and switchable between two states, and a contact feature on the third rail. The third rail can be displaced from a retracted position to an extended position in a first direction, and when the third rail is displaced from the extended position to the retracted position in a second direction, the contact feature is brought into contact with the working member in one of the two states so as to drive and thereby retract the second rail with respect to the first rail in the second direction.

Abstract: A MEMS transducing apparatus includes a substrate, a conductive pad, a stacked structure of a transducing device, a first polymer layer, a second polymer layer and a third polymer layer. An upper cavity is formed through the substrate. The conductive pad is formed on a first surface of the substrate to cover a first opening of the upper cavity. The stacked structure of the transducing device is formed on the conductive pad. The first polymer layer is formed on the first surface of the substrate. A lower cavity is formed through the first polymer layer. The stacked structure of the transducing device is exposed within the lower cavity. The third polymer layer is formed on a second surface of the substrate to cover a second opening of the upper cavity. The second polymer layer is formed on the first polymer layer to cover a third opening of the lower cavity.

Abstract: A tool assembly apparatus may comprise a sleeve, a locating ball, an elastic locating piece, and a connecting rod. The sleeve has a first end and a second end, and the first end and the second end of the sleeve respectively have an axial first engaging hole and an axial second engaging hole which are communicated to axially penetrate through the sleeve. The inner diameter of the second engaging hole is smaller than the first engaging hole, and the sleeve has a radial through hole penetrating through an outer periphery thereof to communicate with the second engaging hole. The elastic locating piece has a ring body which comprises a locating hole and a cutting portion thereon. The connecting rod comprises a bearing section and a driving section, and a middle section is connected therebetween. The driving section has a locating recess formed thereon.