Abstract: A traffic control method, adapted to a server, includes detecting a packet sent by user equipment and transmitted through a base station to obtain packet information of the packet, wherein the packet information comprises an Internet protocol address, determining whether the packet information is abnormal, tagging identification information corresponding to the Internet protocol address when the packet information is abnormal, and blocking a connection between the user equipment and a network based on the identification information.

Abstract: A back plate unit includes a back plate having opposite first and second sides, an optical member mounted to the back plate, and a buffer assembly disposed between the optical member and the back plate and including at least one first buffer member disposed on the first side and made of a thermoplastic material, and at least one second buffer member disposed on the second side and made of a thermoset material. The at least one first buffer member and the optical member are deformed when heated, and the at least one first buffer member is squeezed and compressed by expansion of the optical member. A backlight module of a display device is also disclosed.

Abstract: A flip-chip process is to provide a pressing jig with a channel, so that the pressing jig grips a chip module by vacuum suction through the channel, and the chip module can be bonded onto a circuit board via a plurality of solder bumps through the pressing jig, and then a heating device is provided to heat the plurality of solder bumps and reflow the plurality of solder bumps. Therefore, the chip module can be vacuum-gripped by the pressing jig to suppress deformation of the chip module, so that the solder bumps can effectively connect to corresponding contacts of the circuit board.

Abstract: An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.

Abstract: A pre-charge control circuit includes a control unit, a conversion unit, and a pre-charge switch. The control unit provides a control signal according to a PWM signal, and the conversion unit provides a control voltage according to the control signal. The pre-charge switch adjusts a magnitude of the current flowing through the input path of the electronic circuit according to the control voltage.

Abstract: A connector for a system circuit board or a power module is provided. The connector includes a main body and an optical connection mechanism. The main body includes a first connecting terminal and a second connecting terminal. The first connecting terminal and the second connecting terminal are power contacts or signal contacts. The optical fiber connection mechanism is embedded within the main body. The optical fiber connection mechanism is disposed between the first connecting terminal and the second connecting terminal. Since the optical fiber connection mechanism is embedded within the main body, it is not necessary to specifically remove the optical fiber cable when the power module is detached from the cabinet. Moreover, the appearance of the product is more aesthetically-pleasing, and the maintaining speed and the product reliability are increased.

Abstract: A power apparatus applied in a solid state transformer structure includes an AC-to-DC conversion unit, a first DC bus, and a plurality of bi-directional DC conversion units. First sides of the bi-directional DC conversion units are coupled to the first DC bus. Second sides of the bi-directional DC conversion units are configured to form at least one second DC bus, and the number of the at least one second DC bus is a bus number. The bi-directional DC conversion units receive a bus voltage of the first DC bus and convert the bus voltage into at least one DC voltage, or the bi-directional DC conversion units receive at least one external DC voltage and convert the at least one external DC voltage into the bus voltage.

Abstract: A III-V semiconductor die for die crack detection is provided. The III-V semiconductor die includes a device area. The III-V semiconductor die further includes a doped semiconductor ring region. The doped semiconductor ring region surrounds the device area. At least one active device or at least one passive device is formed in the device area of the III-V semiconductor die.

Abstract: A fixing frame for a lamp is provided. The fixing frame is arranged on the lamp, and the lamp for being arranged on a display, and the display has a display surface. The fixing frame includes a first part and a second part. The first part matches the shape of lamp. The second part is connected with the first part to stand upright on the lamp, the second part has a first height in a longitudinal direction of the lamp, and a first surface of the second part is parallel to the display surface.

Abstract: An electronic package, in which a heat dissipation structure is disposed on a carrier structure to form a packaging space for electronic components to be accommodated in the packaging space, and the electronic components are completely encapsulated by a heat dissipation material to prevent the electronic components exposing from the heat dissipation material so as to improve the heat dissipation effect.

Abstract: A flip-chip process is to provide a pressing jig with a channel, so that the pressing jig grips a chip module by vacuum suction through the channel, and the chip module can be bonded onto a circuit board via a plurality of solder bumps through the pressing jig, and then a heating device is provided to heat the plurality of solder bumps and reflow the plurality of solder bumps. Therefore, the chip module can be vacuum-gripped by the pressing jig to suppress deformation of the chip module, so that the solder bumps can effectively connect to corresponding contacts of the circuit board.

Abstract: A semiconductor package structure includes a conductive structure, at least one semiconductor element, an encapsulant, a redistribution structure and a plurality of bonding wires. The semiconductor element is disposed on and electrically connected to the conductive structure. The encapsulant is disposed on the conductive structure to cover the semiconductor element. The redistribution structure is disposed on the encapsulant, and includes a redistribution layer. The bonding wires electrically connect the redistribution structure and the conductive structure.

Abstract: Provided is an electronic package, in which a heat dissipating body is formed on an electronic device and is combined with a heat sink so that the electronic device, the heat dissipating body and the heat sink form a receiving space, and a heat dissipating material is formed in the receiving space and in contact with the heat sink and the electronic device, where a fluid regulating space is formed between the heat dissipating material and the heat dissipating body and is used as a volume regulating space for the heat dissipating material during thermal expansion and contraction.

Abstract: A lamp clamp used to fix a light source on an object is disclosed. The lamp clamp includes a first clamping member and a second clamping member. The first clamping member includes a lamp fixing portion, a connecting portion and a stopping portion. The lamp fixing portion is used to fix the light source. The connecting portion is connected to the lamp fixing portion. The stopping portion is movably connected to the connecting portion and has a stopping surface selectively disposed at one of plural positions on the connecting portion. The second clamping member is connected to the connecting portion to clamp the object between the stopping surface and the second clamping member.

Abstract: An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.

Abstract: A power apparatus applied in a solid state transformer structure includes an AC-to-DC conversion unit, a first DC bus, and a plurality of bi-directional DC conversion units. First sides of the bi-directional DC conversion units are coupled to the first DC bus. Second sides of the bi-directional DC conversion units are configured to form at least one second DC bus, and the number of the at least one second DC bus is a bus number. The bi-directional DC conversion units receive a bus voltage of the first DC bus and convert the bus voltage into at least one DC voltage, or the bi-directional DC conversion units receive at least one external DC voltage and convert the at least one external DC voltage into the bus voltage.

Abstract: A power apparatus applied in an SST structure includes a first AC-to-DC conversion unit, a first DC bus, an isolated transformer, a DC-to-AC conversion unit, a second AC-to-DC conversion unit, and a second DC bus. The first AC-to-DC conversion unit has a first bridge arm and a second bridge arm. The first DC bus provides a first DC voltage. The isolated transformer has a primary side and a secondary side. The DC-to-AC conversion unit has a third bridge arm and a fourth bridge arm. The second AC-to-DC conversion unit has a fifth bridge arm and a sixth bridge arm. The second DC bus provides a second DC voltage.

Abstract: A heat dissipation structure is provided and includes a heat dissipation body and an adjustment channel. A carrying area and an active area adjacent to the carrying area are defined on a surface of the heat dissipation body, the carrying area is used for applying a first heat dissipation material thereonto, and the adjustment channel is formed in the active area, where one end of the adjustment channel communicates with the outside of the heat dissipation structure, and the other end communicates with the carrying area. Therefore, when the heat dissipation body is coupled to the electronic component by the first heat dissipation material, the adjustment channel can adjust a volume of the first heat dissipation material.

Abstract: A semiconductor package structure, an electronic device, and method for manufacturing the same are provided. The semiconductor package structure includes a wiring structure, a first electronic device, a second electronic device, and a protection material. The first electronic device is disposed on the wiring structure. The second electronic device is disposed on the wiring structure. The second electronic device defines a plurality of recesses on a first lateral side surface thereof. The protection material is disposed on the wiring structure and encapsulates the recesses of the second electronic device.

Abstract: A rack device having a cabinet and power modules stacked in the cabinet is provided. The power module has a frame, an insulative plate, an insulative cover and transformers. The insulative plate is arranged in the frame. The insulative cover is arranged in the frame and disposed spacedly from and parallel with the insulative plate. Each transformer arranged in the frame has a high-voltage set and a low-voltage set electrically connected with each other. The low-voltage sets are arranged on one surface of the insulative plate and do not protrude from the frame, and the high-voltage sets are arranged on another surface of the insulative plate and between the insulative plate and the insulative cover. The frame of each power module is connected with the frame of adjacent power module, and the frame of at least one of the power modules is connected to the cabinet.