Abstract: A pixel driving device for drive control of pixels, has a image data conversion circuit for generating an original gradation signal by converting an image data, based on a preset conversion property, a signal correction circuit for outputting a corrected gradation signal by adding a correction value acquired based on an electric property parameter of a pixel to the original gradation signal, and a drive signal impressing circuit for impressing a voltage signal corresponding to the corrected gradation signal on one end of a signal line. The original gradation signal has a value that corresponds to a gradation value of the image data and the maximum value of the original gradation signal is set to a value equal to or smaller than a value acquired by subtracting a value corresponding to the correction value from a maximum value in an input range of the drive signal impressing circuit.

Abstract: A pixel driving device has a voltage impressing circuit that outputs a reference voltage that exceeds a threshold voltage of a drive transistor, a voltage measurement circuit, and a property parameter acquisition circuit that acquires a property parameter related to an electronic property of a pixel. The pixel driving device impresses the reference voltage on the pixel that has a light emitting element and the drive transistor. The voltage measurement circuit acquires voltage of a signal line, as measured voltages, after each of a plurality of the settling times elapsing from the time when the reference voltage is cut. The property parameter acquisition circuit acquires, as property parameters, the threshold voltage and a current amplification factor of drive transistor based on values of a plurality of measured voltages acquired by the voltage measurement circuit.

Abstract: A pixel driving device in which, after a reference voltage exceeds a threshold voltage of a drive transistor is impressed through the signal lines on each pixel equipping a light emitting element and the drive transistor, set the signal lines in a state of high impedance, and acquires a voltage value of one end of the signal lines subsequent to a predetermined settling time elapsing, and acquires the threshold voltage of the drive transistor for each pixel and the current amplification factor of the pixel drive circuit as a first property parameter based on acquired voltage values at the time a plurality of first settling times longer than a predetermined value and acquires an irregularity parameter indicating the irregularity in the current amplification factor based on the value of the first property parameter and the measured voltage value acquired at the time shorter than the predetermined value.

Abstract: A light emitting device has a plurality of pixels, each of which includes a drive transistor, a light emitting element and signal lines, a property parameter acquisition circuit which acquires property parameter, a signal correction circuit that generates a corrected gradation signal by correcting the image data based on the property parameter, and a drive signal impressing circuit that impresses a drive signal, generated based on the corrected gradation signal, on the pixel to drive it. The property parameter is constituted of a threshold voltage, a current amplification factor and its irregularity of the drive transistor, and is acquired based on measured voltages of the signal lines after each of a plurality of predetermined settling times elapses from the time when the light emitting device cuts off a voltage subsequent to impressing the voltage on each pixel for a predetermined length of time.

Abstract: On the top surface of a thin semiconductor wafer, top surface structures forming a semiconductor chip are formed. The top surface of the wafer is affixed to a supporting substrate with a double-sided adhesive tape. Then, from the bottom surface of the thin semiconductor wafer, a trench, which becomes a scribing line, is formed by wet anisotropic etching so that side walls of the trench are exposed. On the side walls of the trench with the crystal face exposed, an isolation layer with a conductivity type different from that of the semiconductor wafer for holding a reverse breakdown voltage is formed simultaneously with a collector region of the bottom surface diffused layer by ion implantation, followed by annealing with laser irradiation. The side walls form a substantially V-shaped or trapezoidal-shaped cross section, with an angle of the side wall relative to the supporting substrate being 30-70°. The double-sided adhesive tape is then removed from the top surface to produce semiconductor chips.

Abstract: A pixel drive device that drives a pixel array including pixels connected to input/output terminals includes: a connection unit including connection terminals whose number is fewer than a number of the input/output terminals; and a connection switching unit that switches connection between the connection terminals and the input/output terminals. The input/output terminals of the pixel array are divided into a plurality of blocks each including a predetermined number of input/output terminals that is equal to/smaller than the number of connection terminals. The connection switching unit sequentially connects the connection terminals and the input/output terminals of each of the blocks, and sets the connection order of connecting the input/output terminals of each block to the connection terminals, such that adjoining two of the input/output terminals belonging to adjoining two of the blocks are connected to the same one of the connection terminals.

Abstract: A data acquisition circuit sets one of the potential value at one end of a signal line and the value of a current flown thereto when one end of a current path of a drive device is connected to a light emitting device with the other end thereof set to a potential value where no current flows to the light emitting device. Then the circuit causes current to flow via the current path and the signal line and acquires one of the value of the current flown to the signal line and the potential value at the one end of the signal line according to the set value. A correction operation circuit acquires a threshold voltage and a current amplification factor of the drive device based on one of the current and potential values thus acquired as well as on one of the potential and current values thus set.

Abstract: A reverse blocking semiconductor device that shows no adverse effect of an isolation region on reverse recovery peak current, that has a breakdown withstanding structure exhibiting satisfactory soft recovery, that suppresses aggravation of reverse leakage current, which essentially accompanies a conventional reverse blocking IGBT, and that retains satisfactorily low on-state voltage is disclosed. The device includes a MOS gate structure formed on a n? drift layer, the MOS gate structure including a p+ base layer formed in a front surface region of the drift layer, an n+ emitter region formed in a surface region of the base layer, a gate insulation film covering a surface area of the base layer between the emitter region and the drift layer, and a gate electrode formed on the gate insulation film. An emitter electrode is in contact with both the emitter region and the base layer of the MOS gate structure.

Abstract: A manufacturing method for manufacturing a super-junction semiconductor device forms an oxide film and a nitride film on an n-type epitaxial layer exhibiting high resistance on an n-type semiconductor substrate exhibiting low resistance. The portion of the nitride film in the scribe region is left unremoved by patterning and an alignment marker is opened through the nitride film. After opening a trench pattern in the oxide film, trenches having a high aspect ratio are formed. The portion of the oxide film outside the scribe region is removed and a p-type epitaxial layer is buried in the trenches. The overgrown p-type epitaxial layer is polished with reference to the nitride film, the polished surface is finished by etching, and the n-type epitaxial layer surface is exposed.

Abstract: A manufacturing method for a super-junction semiconductor device is disclosed. The method includes a first step of depositing, on a low-resistivity semiconductor substrate of one conductivity type, at least an epitaxial layer of the one conductivity type which is to become a drift layer; a second step of forming a base region(s) of the other conductivity type and source regions of the one conductivity type to be used for formation of MOS gate structures; a third step of forming, by anisotropic vapor-phase etching using an insulating film mask, trenches that penetrate through the base region(s) and reach the low-resistivity semiconductor substrate or its vicinity; and a fourth step of burying epitaxial layers of the other conductivity type in the respective trenches, the first to fourth steps being executed in this order.

Abstract: A semiconductor device including an n-type semiconductor substrate, a p-type channel region and a junction layer provided between the n-type semiconductor substrate and the p-type channel region is disclosed. The junction layer has n-type drift regions and p-type partition regions alternately arranged in the direction in parallel with the principal surface of the n-type semiconductor substrate. The p-type partition region forming the junction layer is made to have a higher impurity concentration than the n-type drift region. This enables the semiconductor device to have an enhanced breakdown voltage and, at the same time, have a reduced on-resistance.

Abstract: A semiconductor device is disclosed that reduces the reverse leakage current caused by reverse bias voltage application and reduces the on-voltage of the IGBT. A two-way switching device using the semiconductor devices is provided, and a method of manufacturing the semiconductor device is disclosed. The reverse blocking IGBT reduces the reverse leakage current and the on-voltage by bringing portions of an n?-type drift region 1 that extend between p-type base regions and an emitter electrode into Schottky contact to form Schottky junctions.

Abstract: A semiconductor device and method of manufacturing the same includes an n?-single crystal silicon substrate, with an oxide film selectively formed thereon. On the oxide film, gate polysilicon is formed. The surface of the gate polysilicon is covered with a gate oxide film whose surface is covered with a cathode film doped in an n-type with an impurity concentration higher than that of the substrate as an n?-drift layer. In the cathode film, a section in contact with the substrate becomes an n+-buffer region with a high impurity concentration, next to which a p-base region is formed. Next to the p-base region, an n+-source region is formed. On the cathode film, an interlayer insulator film is selectively formed on which an emitter electrode is formed. A semiconductor device such as an IGBT is obtained with a high rate of acceptable products, an excellent on-voltage to turn-off loss tradeoff and an excellent on-voltage to breakdown voltage tradeoff.

Abstract: A semiconductor device including an n-type semiconductor substrate, a p-type channel region and a junction layer provided between the n-type semiconductor substrate and the p-type channel region is disclosed. The junction layer has n-type drift regions and p-type partition regions alternately arranged in the direction in parallel with the principal surface of the n-type semiconductor substrate. The p-type partition region forming the junction layer is made to have a higher impurity concentration than the n-type drift region. This enables the semiconductor device to have an enhanced breakdown voltage and, at the same time, have a reduced on-resistance.

Abstract: A pixel circuit flows a current having a current value corresponding to a test voltage without intervening any display element.

Abstract: A luminescent panel includes a transparent substrate, a first transparent electrode provided on the transparent substrate, a luminescent layer provided on the first transparent electrode, and a second transparent electrode provided on the luminescent layer. A reflecting film provided on the second electrode, reflects light emitted from the luminescent layer through the second transparent electrode and causes the reflected light to outwardly emit from the transparent substrate.

Abstract: A display panel includes a transistor array substrate which has a plurality of transistors including at least a driving transistor, and a plurality of pixel electrodes electrically connected to the driving transistor of the plurality of transistors. A plurality of light-emitting layers are provided on the pixel electrodes. A counter electrode is provided on the light-emitting layers. Each of a plurality of interconnections is arranged between the pixel electrodes adjacent to each other and electrically connected to the counter electrode.

Abstract: A driver circuit for driving optical elements which is applied to a pixel driver circuit of the display device in this invention comprises a first current path with one end connected to the optical elements and the other end connected to a drive power supply; a second current path electrically connected to the first current path; a write-in control circuit which flows the write-in current having a predetermined current value in the direction of the other end side from the one end side of the first current path via the second current path; a charge storage circuit which stores the electric charge accompanying the write-in current flowing in the first current path; a drive control circuit which supplies the drive current to the optical elements via the first current path has a current value corresponding to the current value of the write-in current and drives these optical elements based on the electric charge stored in the charge storage circuit; and has a first timing operation in which the electric charge of

Abstract: A display panel (110) includes a plurality of optical elements (OEL) each having a pair of electrodes and performing an optical operation according to current passing between the pair of electrodes, a current line (DL), a switch circuit (Tr2) that passes a write current (Ia) with a predetermined current value through the current line (DL) during a selection time (Tse) and stops passing current during a non-selection time (Tnse), and a current storage circuit (Tr1, Tr3, Cs, Cp) that stores current data according to the current value of the write current (Ia) passing through the current line (DL) during the selection time (Tse) and that supplies a drive current (Ib) having a current value, which is obtained by subtracting a predetermined offset current (Ioff) from the current value of the stored write current (Ia), to the optical elements (OEL) during the non-selection time (Tnse).

Abstract: A display device includes a flat display panel in which a plurality of pixels are arrayed in a matrix at an interval and covered with an optically transparent material, and an optical sheet to impart the front directivity of the flat display panel. Light which is emitted from a predetermined one of the plurality of pixels and emerges outside from the surface of the optical sheet located on a region except the pixel to the front direction overlaps neighboring pixels arranged around the pixel in a width equal to or smaller than 20% of the pixel width of the neighboring pixels.