Abstract: The light array of this invention includes a number of columns and rows of LED's connected in a series/parallel combination. The series parallel combinations effectively optimize the impedance, accommodate failure rate, facilitate light mixing, provide a means of imbedding redundancy, and common cathodes or anodes. This arrangement provides a superior light source for consumer, industrial and specialty markets in respect to mean time between failure, process control, radiant intensity, wavelength mixing, power requirements and other characteristics of the light source. Each column includes a number of rows of plural LED's. The LED's in each row are wired in series and each column is wired in parallel so that if one LED fails only the LED's connected in series with the failed LED will also fail. There is redundancy in the circuit as well as the arrays so that if there are failures different current carrying elements or different series LEDS will automatically by powered on.

Abstract: A golf putter wherein the putter is equipped with a removable laser. The head of the putter includes a mounting plate which has a mounting plate cover. When the laser is not in use, the mounting plate cover is placed on the mounting plate. When the laser is in use, the laser which includes a mounting bracket is attached to the mounting plate. The shaft of the putter includes a battery located inside of the shaft and the electrical connection to the at least one battery. The electrical connection to the laser is located in the center of the mounting plate and is covered by a cap when not in use. An on/off switch and a height adjustment switch are located on the shaft. The on/off switch controls the electricity to the laser and the height adjustment switch allows a user to pivot the laser as necessary.

Abstract: A data processor includes execution clusters, an instruction cache, an instruction issue unit, and alignment and dispersal circuitry. Each execution cluster includes an instruction execution pipeline having a number of processing stages, and each execution pipeline is a number of lanes wide. The processing stages execute instruction bundles, where each instruction bundle has one or more syllables. Each lane is capable of receiving one of the syllables of an instruction bundle. The instruction cache includes a number of cache lines. The instruction issue unit receives fetched cache lines and issues complete instruction bundles toward the execution clusters. The alignment and dispersal circuitry receives the complete instruction bundles from the instruction issue unit and routes each received complete instruction bundle to a correct one of the execution clusters. The complete instruction bundles are routed as a function of at least one address bit associated with each complete instruction bundle.

Abstract: A method, apparatus and computer program product are provided for implementing automated detection of excess aggressor shape capacitance coupling in printed circuit board layouts. A PCB design file containing an electronic representation of a printed circuit board design is received. A list of candidate shapes is identified. The candidate shapes are disposed on layers adjacent to aggressor planes. A capacitance coupling the candidate shapes to adjacent aggressor planes is calculated. A ratio of the calculated capacitance and a decoupling capacitance connecting the candidate shapes to a reference plane is determined.

Abstract: A thermal management system is provided for semiconductor devices such as an LED array, wherein coolant directly cools the LED array. Preferably, the coolant may be selected, among other bases, based on its index of refraction relative to the index associated with the semiconductor device.

Abstract: A method and structure are provided to control common mode impedance in fan-out regions for printed circuit board applications. A differential pair transmission line includes a narrow signal trace portion in the fan-out region and a wider signal trace portion outside of the fan-out region. A dielectric material separates the differential pair transmission line from a reference power plane. A thickness of the narrow signal trace is increased and a thickness of the dielectric material is correspondingly decreased in the fan-out region.

Abstract: A method and stiffener-embedded waveguide structure are provided for implementing enhanced data transfer for printed circuit board applications. At least one microwave channel is defined within a stiffener. The microwave channel provides a high frequency path for data transfers. Use of the waveguide channel in the stiffener for data transfers can replace or supplement otherwise required transmission paths in an associated printed circuit board.

Abstract: A socket assembly with incorporated memory structure is provided. A chip carrier socket assembly includes dual stage clamping actuation. A first clamping actuation stage provides clamping force for ball grid array (BGA) contact pads and a second clamping actuation stage provides clamping force for a thermal interface. The first clamping actuation stage provides clamping force proximate to a perimeter of a carrier where a plurality of BGA contact pads are located. The second clamping actuation stage provides clamping force generally centrally of the chip carrier socket assembly for thermal interface actuation.

Abstract: Methods and apparatus are provided for implementing silicon wafer chip carrier passive devices including customized silicon capacitors and resistors mounted directly on a module or carrier package. A plurality of system design inputs is received for a package arrangement. A respective physical design is generated for customized passive devices, a logic chip, and a chip carrier. Silicon devices are fabricated utilizing the generated respective physical design for customized passive devices and the logic chip and a carrier package is fabricated. The fabricated silicon devices are assembled on the carrier package.

Abstract: A method and structure are provided for implementing a column attach coupled noise suppressor for a solder column structure of the type used to join a substrate to a circuit card. The electrical noise suppressor structure includes a plurality of elongated through openings that are arranged in a predefined pattern. The elongated through openings have electrically conductive sidewalls and are electrically connected together. The predefined pattern of the elongated, electrically conductive through openings corresponds to a layout of solder columns. The solder columns are attached at one end to either a substrate or a circuit card and are inserted through the elongated through openings of the electrical noise suppressor structure, spaced apart from the electrically conductive sidewalls. Then the solder columns are attached at the other end to the other one of the substrate or circuit card.

Abstract: A method and structures are provided for implementing an impedance-controlled coupled noise suppressor for a differential interface solder column array used to join a substrate to a circuit card. The impedance-controlled coupled noise suppressor structure includes a plurality of elongated through openings that are arranged in a predefined pattern with one or more of the through openings receiving a differential signal pair of solder columns. The elongated through openings have electrically conductive sidewalls and are electrically connected together. The predefined pattern of the elongated, electrically conductive through openings corresponds to a layout of solder columns. The solder columns are attached at opposite ends to a substrate and a circuit card. An electrical connection is provided between the impedance-controlled coupled noise suppressor structure and an image return current path of the circuit card.

Abstract: A method and structure are provided to control common mode impedance in fan-out regions for printed circuit board applications. A differential pair transmission line includes a narrow signal trace portion in the fan-out region and a wider signal trace portion outside of the fan-out region. A dielectric material separates the differential pair transmission line from a reference power plane. A thickness of the narrow signal trace is increased and a thickness of the dielectric material is correspondingly decreased in the fan-out region.

Abstract: There is disclosed a data processor containing an instruction issue unit that efficiently transfers instruction bundles from a cache to an instruction pipeline. The data processor comprises 1) an instruction pipeline comprising N processing stages; and 2) an instruction issue unit for fetching into the instruction pipeline instructions fetched from the instruction cache, each of the fetched instructions comprising from one to S syllables.

Abstract: A high-speed Fibre Channel switch element in a Fibre Channel network is provided. The Fibre Channel switch element includes, a rate select module that allows a port in the Fibre Channel switch element to operate at a rate equal to and/or higher than 10 gigabits per second (“G”). The port may operate at 20G, 40G or at a rate greater than 40G. Also, a cut status is provided for cut-through routing between ports operating at different speed. Plural transmit and receive lines are used for port operation at a rate equal to or higher than 10G.

Abstract: A method, apparatus, system, and signal-bearing medium that in an embodiment select a subset of transmission line models based on bounding electrical criteria. The bounding electrical criteria may include combinations of maximum and minimum values and in an embodiment may also include nominal values. Models that meet the bounding electrical criteria may be used in modeling the transmission line while models that do not meet the bounding electrical criteria are not used.

Abstract: A method and apparatus are provided for implementing direct attenuation loss measurement in an electronic package. A sinusoidal voltage source signal of a selected frequency is coupled to an embedded transmission line test structure in the electronic package. Receive circuitry is coupled to the transmission line test structure for detecting amplitude of a received sinusoidal voltage source signal to identify attenuation loss through the transmission line test structure. An identified attenuation loss of the transmission line test structure is compared with a threshold value for verifying acceptable attenuation of the electronic package transmission line test structure.

Abstract: A method and a probe structure are provided for implementing multiple signals probing of a printed circuit board. A probe structure is formed on an outside surface of the printed circuit board. A resistor is electrically connected with an associated via with a signal to be monitored. A path to a predefined probe location for monitoring the signal is defined from the resistor using the probe structure.

Abstract: A thermal management system is provided for semiconductor devices such as an LED array, wherein coolant directly cools the LED array. Preferably, the coolant may be selected, among other bases, based on its index of refraction relative to the index associated with the semiconductor device.