Abstract: The present invention relates to methods for forming through-wafer interconnects in semiconductor substrates and the resulting structures. In one embodiment, a method for forming a through-wafer interconnect includes providing a substrate having a pad on a surface thereof, depositing a passivation layer over the pad and the surface of the substrate, and forming an aperture through the passivation layer and the pad using a substantially continuous process. An insulative layer is deposited in the aperture followed by a conductive layer and a conductive fill. In another embodiment of the invention, a semiconductor device is formed including a first interconnect structure that extends through a conductive pad and is electrically coupled with the conductive pad while a second interconnect structure is formed through another conductive pad while being electrically isolated therefrom. Semiconductor devices and assemblies produced with the methods are also disclosed.

Abstract: Microelectronic workpieces that have bump sites over bond-pads and methods of fabricating such bump sites. One embodiment of such a workpiece, for example, includes a substrate having a plurality of microelectronic dies comprising integrated circuitry and bond-pads, such as copper bond-pads, electrically coupled to the integrated circuitry. The workpiece further includes (a) a dielectric structure having a plurality of openings with sidewalls projecting from corresponding bond-pads, and (b) a plurality of caps over corresponding bond-pads. The individual caps can include a discrete portion of a barrier layer attached to the bond-pads and the sidewalls of the openings, and a discrete portion of a cap layer on the barrier layer. The caps are electrically isolated from each other and self-aligned with corresponding bond-pads without forming a mask layer over the cap layer.

Abstract: Microfeature workpieces having interconnects and conductive backplanes and associated systems and methods are disclosed herein. One such device includes a semiconductor substrate having integrated circuitry and terminals electrically coupled to the integrated circuitry. The device also includes electrically conductive interconnects extending through at least a portion of the semiconductor substrate and electrically coupled to corresponding terminals. The device further includes a conductive backplane assembly having a conductive layer at a back side of the semiconductor substrate. One or more of the interconnects are electrically coupled to the conductive layer at the back side of the semiconductor substrate.

Abstract: The present invention relates to methods for forming through-wafer interconnects in semiconductor substrates and the resulting structures. In one embodiment, a method for forming a through-wafer interconnect includes providing a substrate having a pad on a surface thereof, depositing a passivation layer over the pad and the surface of the substrate, and forming an aperture through the passivation layer and the pad using a substantially continuous process. An insulative layer is deposited in the aperture followed by a conductive layer and a conductive fill. In another embodiment of the invention, a semiconductor device is formed including a first interconnect structure that extends through a conductive pad and is electrically coupled with the conductive pad while a second interconnect structure is formed through another conductive pad while being electrically isolated therefrom. Semiconductor devices and assemblies produced with the methods are also disclosed.

Abstract: An adjustable radio frequency data communications device has a monolithic semiconductor integrated circuit with integrated circuitry, interrogation receiving circuitry provided on the monolithic integrated circuit forming at least part of the integrated circuitry and configured to receive an interrogation signal from the interrogator unit, an antenna electrically coupled to the interrogation receiving circuitry and configured to communicate with the remote interrogator unit, a power source electrically coupled to the integrated circuitry and configured to generate operating power for the communications device, and at least one of the antenna and the interrogation receiving circuitry having reconfigurable electrical characteristics, the electrical characteristics being reconfigurable to selectively tune the at least one of the antenna and the interrogation receiving circuitry within a range of tuned and detuned states to realize a desired receiver sensitivity of the communications device.

Abstract: The present invention provides electronic communication devices, methods of forming electrical communication devices, and communications methods. An electronic communication device adapted to receive electronic signals includes: a housing comprising a substrate and an encapsulant; an integrated circuit provided within the housing and comprising transponder circuitry operable to communicate an identification signal responsive to receiving a polling signal; an antenna provided within the housing and being coupled with the transponder circuitry; and a ground plane provided within the housing and being spaced from the antenna and configured to shield some of the electronic signals from the antenna and reflect others of the electronic signals towards the antenna.

Abstract: A radio frequency identification device includes an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.

Abstract: Identification information is wirelessly communicated between radio frequency devices. In one embodiment, a first wireless device transmits a signal to request identification information. Other wireless devices are each affixed a respective item, and each of the other wireless devices determines if a reply signal is to be transmitted, and if so, communicates the reply signal to the first wireless device.

Abstract: In one embodiment, a method includes transmitting a signal from a wireless transmitter to a radio frequency (RF) device of a plurality of RF devices within a communication range of the transmitter. The signal is to select a group of the RF devices. A reply signal is received from each RF device if the respective RF device determines that it is a member of the group.

Abstract: A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

Abstract: A fuel nozzle for a gas turbine engine includes an engine mount end and a discharge end that discharges an air/fuel mixture into a combustion chamber. The fuel nozzle includes a centerbody and a heat shield. The heat shield is fixed to the centerbody at a mid-mount position that is centrally located between first and second ends of the heat shield to allow the heat shield to remain thermally isolated from radially adjacent components to reduce the adverse effects of thermal stresses.

Abstract: A method of forming a magnetic tunnel junction memory element and the resulting structure are disclosed. A magnetic tunnel junction memory element comprising a thick nonmagnetic layer between two ferromagnetic layers. The thick nonmagnetic layer has an opening in which a thinner tunnel barrier layer is disposed. The resistance of a magnetic tunnel junction memory element may be controlled by adjusting the surface area and/or thickness of the tunnel barrier layer without regard to the surface area of the ferromagnetic layers.

Abstract: A radio frequency identification (RFID) tag includes a base supporting an integrated circuit and a first antenna orthogonal to a second antenna, the first antenna and the second antenna coupled to the integrated circuit, and a first fold in the base that when creased, defines two lobes lying in two planes, a first lobe including a first portion of the first antenna positioned in an x-axis relative to the second antenna oriented along a y-axis, and a second lobe including a second portion of the first antenna positioned in a z-axis relative to the first portion of the first antenna and second antenna.

Abstract: Methods and apparatus, including computer program products, for item identification using RFID. A system includes a radio frequency identification (RFID) interrogator, and a computer coupled to the RFID interrogator, the computer including a database comprising RFID identification codes and items associated with the RFID identification codes, two or more the RFID identification codes associated with a single item.

Abstract: A radio frequency identification (RFID) interrogator housed in a portable platform that includes at least one antenna, a transceiver for transmitting and receiving a radio frequency (RF) signal through the antenna, and a controller in communication with the transceiver for adjusting power and direction of the transmitted RF signal. The controller can be configured to adjust the antenna orientation, and can also selectively activate and deactivate one or more antennas.

Abstract: Methods and apparatus, including computer program products, for a computer with a radio frequency identification (RFID) reader. A system includes a processor, a store of codes representing goods and services cross-referenced to supplemental information, a radio frequency identification (RFID) interrogator, an input/output tag (IO), and a memory including a process that matches a received code from the RFID interrogator to a code in the store of codes and to display supplemental information of a good or service on the IO tag.

Abstract: Methods and apparatus, including computer program products, for a power conserving active RFID label. A system for performing radio frequency (RF) communications includes a radio frequency identification (RFID) tag attached to one or more items to be tracked, the RFID tag configured to receive a request and a time interval indicating a time for determining a temperature and a battery voltage, and to adjust the time interval at a time of determining the temperature and the battery voltage if the detected voltage is less than a predetermined voltage, and an interrogator communicatively coupled to one or more antennas to transmit one or more requests to the RFID tag and to receive one or more responses, at least one response including a time, temperature and battery voltage.

Abstract: A microelectronic imager having an imaging unit and an optics unit attached to the imaging unit, and methods for packaging microelectronic imagers. In one embodiment, the imaging unit can include a microelectronic die with an image sensor and a plurality of external contacts electrically coupled to the image sensor and a first referencing element fixed to the imaging unit. The optics unit can include an optic member and a second referencing element fixed to the optics unit. The second referencing element is seated with the first referencing element at a fixed, preset position in which the optic member is situated at a desired location relative to the image sensor.

Abstract: In one aspect, the invention encompasses a method for electronic tracking of units originating from a common source which comprises a plurality of units physically joined with one another. A first transponder is physically associated with the common source, and the source is split to separate it into three or more of the units. A second transponder is physically associated with one of the three or more units, and the second transponder sends a code. The code of the second transponder is electrically associated with an identifier of the common source. In a particular aspect, the common source is an animal carcass. A batch comprises separate units of objects that are physically joined together. RFID tags are attached to each of the units and to the batch. The codes stored in the RFID tags are electrically associated with one another in a database.

Abstract: In one aspect, the invention encompasses a method for electronic tracking of units originating from a common source which comprises a plurality of units physically joined with one another. A first transponder is physically associated with the common source, and the source is split to separate it into three or more of the units. A second transponder is physically associated with one of the three or more units, and the second transponder sends a code. The code of the second transponder is electrically associated with an identifier of the common source. In a particular aspect, the common source is an animal carcass. A batch comprises separate units of objects that are physically joined together. RFID tags are attached to each of the units and to the batch. The codes stored in the RFID tags are electrically associated with one another in a database.