Abstract: In a method of manufacturing a semiconductor device, a fin structure having a bottom portion, an intermediate portion disposed over the bottom portion and an upper portion disposed over the intermediate portion is formed. The intermediate portion is removed at a source/drain region of the fin structure, thereby forming a space between the bottom portion and the upper portion. An insulating layer is formed in the space. A source/drain contact layer is formed over the upper portion. The source/drain contact layer is separated by the insulating layer from the bottom portion of the fin structure.

Abstract: A semiconductor device includes a substrate, a gate structure, at least one nanowire, at least one epitaxy structure, and at least one source/drain spacer. The gate structure is disposed on the substrate. The nanowire extends through the gate structure. The epitaxy structure is disposed on the substrate and is in contact with the nanowire. The source/drain spacer is disposed between the epitaxy structure and the gate structure and is embedded in the epitaxy structure.

Abstract: In a method of forming a gate-all-around field effect transistor (GAA FET), a bottom support layer is formed over a substrate and a first group of carbon nanotubes (CNTs) are disposed over the bottom support layer. A first support layer is formed over the first group of CNTs and the bottom support layer such that the first group of CNTs are embedded in the first support layer. A second group of carbon nanotubes (CNTs) are disposed over the first support layer. A second support layer is formed over the second group of CNTs and the first support layer such that the second group of CNTs are embedded in the second support layer. A fin structure is formed by patterning at least the first support layer and the second support layer.

Abstract: Semiconductor structures and methods for forming the same are provided. The method includes forming a fin structure over a substrate, and the fin structure includes alternately stacked semiconductor material layers and sacrificial layers. The method further includes forming a dummy gate structure, recessing the fin structure to form an opening, forming first source/drain spacers on sidewalls of the sacrificial layers by performing a first atomic layer deposition (ALD) process, and forming source/drain structure in the opening. The method further includes removing the dummy gate structure and the sacrificial layers to expose the semiconductor material layers and forming a gate structure wrapping around the semiconductor material layers.

Abstract: A method includes performing an epitaxy to grow a semiconductor layer, which includes a top portion over a semiconductor region. The semiconductor region is between two insulation regions that are in a substrate. The method further includes recessing the insulation regions to expose portions of sidewalls of the semiconductor region, and etching a portion of the semiconductor region, wherein the etched portion of the semiconductor region is under and contacting a bottom surface of the semiconductor layer, wherein the semiconductor layer is spaced apart from an underlying region by an air gap. A gate dielectric and a gate electrode are formed over the semiconductor layer.

Abstract: A gate-all-around field effect transistor (GAA FET) includes an InAs nano-wire as a channel layer, a gate dielectric layer wrapping the InAs nano-wire, and a gate electrode metal layer formed on the gate dielectric layer. The InAs nano-wire has first to fourth major surfaces three convex-rounded corner surfaces and one concave-rounded corner surface.

Abstract: In a method of manufacturing a semiconductor device, a fin structure protruding from a first isolation insulating layer is formed. A second isolation insulating layer made of different material than the first isolation insulating layer is formed so that a first upper portion of the fin structure is exposed. A dummy gate structure is formed over the exposed first upper portion of the first fin structure. The second isolation insulating layer is etched by using the dummy gate structure as an etching mask. The dummy gate structure is removed so that a gate space is formed. The second isolation insulating layer is etched in the gate space so that a second upper portion of the fin structure is exposed from the first isolation insulating layer. A gate dielectric layer and a gate electrode layer are formed over the exposed second portion of the fin structure.

Abstract: A semiconductor device includes first and second nanowire structures disposed on semiconductor substrate extending in first direction on substrate. First nanowire structure includes plurality of first nanowires including first nanowire material extending along first direction and arranged in second direction, second direction substantially perpendicular to first direction. Second nanowire structure includes plurality of second nanowires including second nanowire material extending along first direction arranged in second direction. Second nanowire material is not same as first nanowire material. Each nanowire is spaced-apart from immediately adjacent nanowire. First and second gate structures wrap around first and second nanowires at first region of respective first and second nanowire structures. First and second gate structures include gate electrodes.

Abstract: A semiconductor device and methods of formation are provided. The semiconductor device includes a gate over a channel portion of a fin. The fin includes a first active area of the fin having a first active area top surface coplanar with a first shallow trench isolation (STI) top surface of a first STI portion of STI, and a second active area of the fin having a second active area top surface coplanar with a second STI top surface of a second STI portion of the STI. The method herein negates a need to recess at least one of the fin, the first STI portion or the second STI portion during device formation. Negating a need to recess at least one of the fin, the first STI portion or the second STI portion enhances the semiconductor device formation and is more efficient than a semiconductor device formation that requires the recessing of at least one of a fin, a first STI portion or a second STI portion.

Abstract: In a method of forming a gate-all-around field effect transistor (GAA FET), a bottom support layer is formed over a substrate and a first group of carbon nanotubes (CNTs) are disposed over the bottom support layer. A first support layer is formed over the first group of CNTs and the bottom support layer such that the first group of CNTs are embedded in the first support layer. A second group of carbon nanotubes (CNTs) are disposed over the first support layer. A second support layer is formed over the second group of CNTs and the first support layer such that the second group of CNTs are embedded in the second support layer. A fin structure is formed by patterning at least the first support layer and the second support layer.

Abstract: A semiconductor device includes a substrate, an N-type bottom vertical gate-all-around (VGAA) transistor, a P-type bottom VGAA transistor, and a top VGAA transistor. The N-type bottom vertical gate-all-around (VGAA) transistor is over the semiconductor substrate and comprising a first nanowire made of InAs. The P-type bottom VGAA transistor is over the semiconductor substrate and comprising a second nanowire made of Ge. The top VGAA transistor is over the N-type bottom VGAA transistor, in which the top VGAA transistor includes a third nanowire in contact with the N-type bottom VGAA transistor, a fourth nanowire on and in contact with the third nanowire, and a bit line wrapping the fourth nanowire.

Abstract: A method includes forming a semiconductor fin over a substrate. A nanowire foundation layer is formed on the semiconductor fin. A nanowire template is formed over the nanowire foundation layer, in which the nanowire template has a through hole exposing a portion of the nanowire foundation layer. A first nanowire is grown from the exposed portion of the nanowire foundation layer, such that the nanowire protrudes out of the through hole. A gate structure is formed over the nanowire foundation layer and wrapping around the first nanowire.

Abstract: In a method of forming a Group III-V semiconductor layer on a Si substrate, a first source gas containing a Group V element is supplied to a surface of the Si substrate while heating the substrate at a first temperature, thereby terminating the Si surface with the Group V element. Then, a second source gas containing a Group III element is supplied to the surface while heating the substrate at a second temperature, thereby forming a nucleation layer directly on the surface of the Si substrate. After the nucleation layer is formed, the supply of the second source gas is stopped and the substrate is annealed at a third temperature while the first source gas being supplied, thereby forming a seed layer. After the annealing, the second source gas is supplied while heating the substrate at a fourth temperature, thereby forming a body III-V layer semiconductor on the seed layer.

Abstract: In a method of manufacturing a semiconductor device, a fin structure protruding from a first isolation insulating layer is formed. A second isolation insulating layer made of different material than the first isolation insulating layer is formed so that a first upper portion of the fin structure is exposed. A dummy gate structure is formed over the exposed first upper portion of the first fin structure. The second isolation insulating layer is etched by using the dummy gate structure as an etching mask. The dummy gate structure is removed so that a gate space is formed. The second isolation insulating layer is etched in the gate space so that a second upper portion of the fin structure is exposed from the first isolation insulating layer. A gate dielectric layer and a gate electrode layer are formed over the exposed second portion of the fin structure.

Abstract: In a method of manufacturing a semiconductor device, a fin structure having a bottom portion, an intermediate portion disposed over the bottom portion and an upper portion disposed over the intermediate portion is formed. The intermediate portion is removed at a source/drain region of the fin structure, thereby forming a space between the bottom portion and the upper portion. An insulating layer is formed in the space. A source/drain contact layer is formed over the upper portion. The source/drain contact layer is separated by the insulating layer from the bottom portion of the fin structure.

Abstract: Semiconductor devices and methods of forming the same are provided. A semiconductor device includes a substrate having a fin. A first nanowire is disposed on the fin and a second nanowire is disposed on the fin, the second nanowire being laterally separated from the first nanowire. A gate structure extends around the first nanowire and the second nanowire. The gate structure also extends over a top surface of the fin. The first nanowire, the second nanowire, and the fin form a channel of a transistor.

Abstract: A multi-stack nanowire device includes a plurality of fins. Each of the fins has a multi-layer stack comprising a first nanowire and a second nanowire. A first portion of the first nanowire and second nanowire are doped to form source and drain regions. A second portion of the first nanowire and second nanowire is channel regions between the source and drain regions. An epitaxial layer wraps around the second portion of first nanowire and second nanowire. A gate is disposed over the second portion of the first nanowire and second nanowire. The epitaxial layer is interposed in between the first nanowire and the second nanowire over the channel region.

Abstract: A fin structure for a fin field effect transistor (FinFET) device is provided. The device includes a substrate, a first semiconductor material disposed on the substrate, a shallow trench isolation (STI) region disposed over the substrate and formed on opposing sides of the first semiconductor material, and a second semiconductor material forming a first fin and a second fin disposed on the STI region, the first fin spaced apart from the second fin by a width of the first semiconductor material. The fin structure may be used to generate the FinFET device by forming a gate layer formed over the first fin, a top surface of the first semiconductor material disposed between the first and second fins, and the second fin.

Abstract: A semiconductor device and methods of formation are provided. The semiconductor device includes a gate over a channel portion of a fin. The fin includes a first active area of the fin having a first active area top surface coplanar with a first shallow trench isolation (STI) top surface of a first STI portion of STI, and a second active area of the fin having a second active area top surface coplanar with a second STI top surface of a second STI portion of the STI. The method herein negates a need to recess at least one of the fin, the first STI portion or the second STI portion during device formation. Negating a need to recess at least one of the fin, the first STI portion or the second STI portion enhances the semiconductor device formation and is more efficient than a semiconductor device formation that requires the recessing of at least one of a fin, a first STI portion or a second STI portion.

Abstract: A method of manufacturing a semiconductor device includes forming a nanowire foundation layer on a semiconductor substrate. A first nanowire is formed on the nanowire foundation layer. A gate structure is formed over the nanowire foundation layer and wrapping the first nanowire. A second nanowire is formed on and in contact with the first nanowire in a bottom-up manner. A source/drain region is formed on the gate structure and wrapping the second nanowire.