Abstract: A valve drive device is provided, with a fluid-actuated valve drive (25) which includes a drive unit (23) which has a drive housing (27) which defines a housing interior (26) and in which a drive piston (28) of the drive member (24) is movably received and divides the housing interior (26) into two working chambers (29a, 29b), of which at least one can be subjected to fluid, with a force monitoring device (37) for monitoring the actuation force which is generated by fluid pressure and acts upon the drive piston (28), with a position monitoring device (60) for monitoring the position of the drive piston (28) and with an electronic control device (41) for controlling the valve drive (25) on the basis of the force and position data which is provided by the force monitoring device (37) and the position monitoring device (60).

Abstract: The invention relates to a device for positioning a semiconductor die in a wafer prober, the device comprising a carrier plate and a clamp on a front surface of the carrier plate, the dimensions of the carrier plate matching a standard geometry required by the wafer prober for receiving a semiconductor wafer to be probed by the wafer prober, the clamp being reversibly movable against a force of an elastic element between an open position and a closed position, the clamp being adapted for fixing the die on the carrier plate in the closed position and for releasing the die in the open position.

Abstract: The invention relates to an integrated circuit with an active transistor area and a plurality of wiring layers arranged above the active transistor area. At least one optical device is integrated in the active transistor area. The optical device is electrically connected with at least one of the wiring layers. At least one optical tunnel extends from the at least one optical device through the plurality of wiring layers to a surface of an uppermost wiring layer of the plurality of wiring layers facing away from the active transistor area.

Abstract: Various aspects of the present invention disclose a test device that includes a retaining element retaining one or more nuclear radiation sources for performing a nuclear radiation stress test of data storage structures of integrated circuits on a wafer in a wafer prober. The retaining element includes one or more apertures for applying nuclear radiation from the one or more nuclear radiation sources to the data storage structures. The retaining element is configured for controlling the nuclear radiation applied via the one or more apertures. The controlling includes a varying of relative positions of the one or more nuclear radiation sources and the one or more apertures. Additional aspects of the present invention disclose a testing method, computer program product, and computer system for performing the nuclear radiation stress test. In an example aspect, embodiments of the present invention disclose a test device for a wafer prober.

Abstract: The invention relates to a device for positioning a semiconductor die in a wafer prober, the device comprising a carrier plate and a clamp on a front surface of the carrier plate, the dimensions of the carrier plate matching a standard geometry required by the wafer prober for receiving a semiconductor wafer to be probed by the wafer prober, the clamp being reversibly movable against a force of an elastic element between an open position and a closed position, the clamp being adapted for fixing the die on the carrier plate in the closed position and for releasing the die in the open position.

Abstract: Various aspects of the present invention disclose a test device that includes a retaining element retaining one or more nuclear radiation sources for performing a nuclear radiation stress test of data storage structures of integrated circuits on a wafer in a wafer prober. The retaining element includes one or more apertures for applying nuclear radiation from the one or more nuclear radiation sources to the data storage structures. The retaining element is configured for controlling the nuclear radiation applied via the one or more apertures. The controlling includes a varying of relative positions of the one or more nuclear radiation sources and the one or more apertures. Additional aspects of the present invention disclose a testing method, computer program product, and computer system for performing the nuclear radiation stress test. In an example aspect, embodiments of the present invention disclose a test device for a wafer prober.

Abstract: An adjustable load transmitter for adjusting an alignment between a probe card and a bridge beam of a wafer prober, where the probe card is separated from the bridge beam by a gap. The adjustable load transmitter located in the gap, the adjustable load transmitter comprising two rotatable plates adapted for transmitting a load via a load transmission path between the bridge beam and the wafer prober and each comprising two flat, non-parallel contact faces. The adjustable load transmitter removes an angular misalignment between the bridge beam and the set of plates by rotating each of the rotatable plates about a pre-determined adjustment angle such that two angles of inclination are adjusted to zero. The adjustable load transmitter establishes the load transmission path by closing a clearance between the bridge beam and the contact face.

Abstract: The invention relates to an integrated circuit with an active transistor area and a plurality of wiring layers arranged above the active transistor area. At least one optical device is integrated in the active transistor area. The optical device is electrically connected with at least one of the wiring layers. At least one optical tunnel extends from the at least one optical device through the plurality of wiring layers to a surface of an uppermost wiring layer of the plurality of wiring layers facing away from the active transistor area.

Abstract: A functional testing high-speed serial link system includes a testing controller that generates a functional testing program, and a device under test (DUT) that receives the functional testing program. The DUT includes a first logic circuit array that generates first results in response to executing the functional test program. The system also includes a supporting chip that receives the functional testing program. The supporting chip includes a second logic circuit array that generates second results in response to executing the functional test program. A physical data link establishes signal communication between the DUT and the supporting chip. The testing controller diagnoses the physical link based on a comparison between expected diagnostic results associated with the functional testing program, and at least one of the first results and the second results.

Abstract: A logic circuit is provided including at least two input cells and a sense circuit. The input cells are connected to a common result line. Further, the input cells are operable for influencing an electrical quantity at the result line. The sense circuit is connected to the result line, and is adapted to output a discrete value out of more than two possible values based on the electrical quantity.

Abstract: The disclosure relates to an adjustable load transmitter for adjusting an alignment between planar members separated from each other by a gap. The load transmitter comprises a set of plates to be received inside the gap, the set comprising two rotatable plates and being adapted for transmitting a load via a load transmission path between the planar members. The load transmission path comprises the rotatable plates. Each of the plates comprises two flat, non-parallel contact faces, and one of the contact faces of the first rotatable plate is in permanent surface contact with one of the contact faces of the second rotatable plate. The rotatable plates are adapted for being rotated relative to each other around one of their respective normal axes.

Abstract: An adjustable load transmitter for adjusting an alignment between a probe card and a bridge beam of a wafer prober, where the probe card is separated from the bridge beam by a gap. The adjustable load transmitter located in the gap, the adjustable load transmitter comprising two rotatable plates adapted for transmitting a load via a load transmission path between the bridge beam and the wafer prober and each comprising two flat, non-parallel contact faces. The adjustable load transmitter removes an angular misalignment between the bridge beam and the set of plates by rotating each of the rotatable plates about a pre-determined adjustment angle such that two angles of inclination are adjusted to zero. The adjustable load transmitter establishes the load transmission path by closing a clearance between the bridge beam and the contact face.

Abstract: An adjustable load transmitter for adjusting an alignment between a probe card and a bridge beam of a wafer prober, where the probe card is separated from the bridge beam by a gap. The adjustable load transmitter located in the gap, the adjustable load transmitter comprising two rotatable plates adapted for transmitting a load via a load transmission path between the bridge beam and the wafer prober and each comprising two flat, non-parallel contact faces. The adjustable load transmitter removes an angular misalignment between the bridge beam and the set of plates by rotating each of the rotatable plates about a pre-determined adjustment angle such that two angles of inclination are adjusted to zero. The adjustable load transmitter establishes the load transmission path by closing a clearance between the bridge beam and the contact face.

Abstract: An adjustable load transmitter for adjusting an alignment between a probe card and a bridge beam of a wafer prober, where the probe card is separated from the bridge beam by a gap. The adjustable load transmitter located in the gap, the adjustable load transmitter comprising two rotatable plates adapted for transmitting a load via a load transmission path between the bridge beam and the wafer prober and each comprising two flat, non-parallel contact faces. The adjustable load transmitter removes an angular misalignment between the bridge beam and the set of plates by rotating each of the rotatable plates about a pre-determined adjustment angle such that two angles of inclination are adjusted to zero. The adjustable load transmitter establishes the load transmission path by closing a clearance between the bridge beam and the contact face.

Abstract: A logic circuit is provided including at least two input cells and a sense circuit. The input cells are connected to a common result line. Further, the input cells are operable for influencing an electrical quantity at the result line. The sense circuit is connected to the result line, and is adapted to output a discrete value out of more than two possible values based on the electrical quantity.

Abstract: The disclosure relates to an adjustable load transmitter for adjusting an alignment between planar members separated from each other by a gap. The load transmitter comprises a set of plates to be received inside the gap, the set comprising two rotatable plates and being adapted for transmitting a load via a load transmission path between the planar members. The load transmission path comprises the rotatable plates. Each of the plates comprises two flat, non-parallel contact faces, and one of the contact faces of the first rotatable plate is in permanent surface contact with one of the contact faces of the second rotatable plate. The rotatable plates are adapted for being rotated relative to each other around one of their respective normal axes.

Abstract: A logic circuit is provided including at least two input cells and a sense circuit. The input cells are connected to a common result line. Further, the input cells are operable for influencing an electrical quantity at the result line. The sense circuit is connected to the result line, and is adapted to output a discrete value out of more than two possible values based on the electrical quantity.

Abstract: The disclosure relates to an adjustable load transmitter for adjusting an alignment between planar members separated from each other by a gap. The load transmitter comprises a set of plates to be received inside the gap, the set comprising two rotatable plates and being adapted for transmitting a load via a load transmission path between the planar members. The load transmission path comprises the rotatable plates. Each of the plates comprises two flat, non-parallel contact faces, and one of the contact faces of the first rotatable plate is in permanent surface contact with one of the contact faces of the second rotatable plate. The rotatable plates are adapted for being rotated relative to each other around one of their respective normal axes.

Abstract: A functional testing high-speed serial link system includes a testing controller that generates a functional testing program, and a device under test (DUT) that receives the functional testing program. The DUT includes a first logic circuit array that generates first results in response to executing the functional test program. The system also includes a supporting chip that receives the functional testing program. The supporting chip includes a second logic circuit array that generates second results in response to executing the functional test program. A physical data link establishes signal communication between the DUT and the supporting chip. The testing controller diagnoses the physical link based on a comparison between expected diagnostic results associated with the functional testing program, and at least one of the first results and the second results.

Abstract: An adjustable load transmitter for adjusting an alignment between a probe card and a bridge beam of a wafer prober, where the probe card is separated from the bridge beam by a gap. The adjustable load transmitter located in the gap, the adjustable load transmitter comprising two rotatable plates adapted for transmitting a load via a load transmission path between the bridge beam and the wafer prober and each comprising two flat, non-parallel contact faces. The adjustable load transmitter removes an angular misalignment between the bridge beam and the set of plates by rotating each of the rotatable plates about a pre-determined adjustment angle such that two angles of inclination are adjusted to zero. The adjustable load transmitter establishes the load transmission path by closing a clearance between the bridge beam and the contact face.