Abstract: The invention relates to a method for performing an array built-in self-test (ABIST) on an electronic circuit (100), the electronic circuit (100) comprising a memory (110) with at least two memory arrays (111-115) and at least two array built-in self-test engines (116-120), wherein each automatic built-in self-test engine (116-120) is associated with a different memory array (111-115) and wherein each array built-in self-test engine (116-120) is associated with a programmable delay unit (DU1-DU5), the method comprising the following steps: determine at least one delay value (dn), the delay value (dn) corresponding to an array built-in self-test engine (116-120) and the delay value (dn) depending on the execution time (tdn) for testing the memory array (111-115) associated with the array built-in self-test engine (116-120); provide the at least one delay value (dn) to the programmable delay unit (DU1-DU5); and delay the start of the array built-in self-test engine (116-120) depending on the respective delay v

Abstract: A computer system includes a processor, and the processor includes at least one interface for communicating with an electronic component. Each of the at least one interface has a set of interface settings. The computer system further includes a memory containing machine executable instructions. Execution of the instructions causes the processor to: monitor communications traffic on the at least one interface; store, eye distribution data acquired during the monitoring of the communications traffic in a database; compare the eye distribution data to a set of predetermined criteria; and generate a set of updated interface settings if the eye distribution does not satisfy the set of predetermined criteria.

Abstract: A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip is lowered into the socket, and the chip carrier is inclined while it supports the frame block and chip until the chip moves under force of gravity to the reference corner. Once located at the reference corner, the chip position is carefully adjusted by moving the frame block in the x- and y-directions until the pins are aligned with the pads. The frame block is spring biased against movement in the x- and y-directions, and the position of the frame block is adjusted using thumbscrews. A plunger mechanism can be used to secure the integrated circuit chip in forcible engagement with the chip carrier once the pins are aligned with the pads.

Abstract: A method is provided for determining a power noise histogram of a computer system. The computer system includes a skitter circuit with multiple skitter bins, each skitter bin of the multiple skitter bins being connected to a signal line at one or more clock cycles. The method includes: connecting each skitter bin to an individual counter circuit; and incrementing a counter when the respective skitter bin is enabled.

Abstract: A system for measuring a test voltage level (Vx) in a location within a chip is presented. The system includes an on-chip measurement device with an on-chip comparator and an on-chip storage. The on-chip comparator is configured for comparing the test voltage (Vx) to be measured to a reference voltage (Vref), while the on-chip storage is configured for storing the result of this comparison. The system also includes external (off-chip) equipment for generating the reference voltage (Vref), for generating probe signals for probing the state of the storage and for retrieving the state of said on-chip storage.

Abstract: A method for electrical testing of a 3-D integrated circuit chip stack is described. The 3-D integrated circuit chip stack comprises at least a first integrated circuit chip and a second integrated circuit chip. The first integrated circuit chip and the second integrated circuit chip are not soldered together for performing electrical testing.

Abstract: A method and system for performing a self-test of power supply quality for an integrated circuit chip within an electronic system. The electronic system is subjected to a well-defined repetitive activity, such as by using an amplitude modulated system clock tree. With the repetitive activity causing current consumption within the chip, time-domain local power supply voltage (U(t)) is measured for a location on the chip. A set of time-domain measured voltage data (U(t)) is accumulated and transformed into the frequency domain to yield a local voltage profile (U(f)). The local voltage profile (U(f)) is compared with a reference voltage profile (U0(f)) to verify whether power supply quality at the chip location under test is adequate. Alternatively, a local impedance profile Z(f) evaluated from the local voltage profile (U(f)) may be compared to a reference impedance profile Z0(f).

Abstract: Network power fault detection. At least one first network device is instructed to temporarily disconnect from a power supply path of a network, and at least one characteristic of the power supply path of the network is measured at a second network device connected to the network while the at least one first network device is temporarily disconnected from the network.

Abstract: A cleaning method is disclosed for wet cleaning of an exhaust-gas turbine. An amount of cleaning fluid injected via a nozzle into the flow duct of the turbine can be variable over a course of time about a defined mean amount of cleaning fluid.

Abstract: A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip is lowered into the socket, and the chip carrier is inclined while it supports the frame block and chip until the chip moves under force of gravity to the reference corner. Once located at the reference corner, the chip position is carefully adjusted by moving the frame block in the x- and y-directions until the pins are aligned with the pads. The frame block is spring biased against movement in the x- and y-directions, and the position of the frame block is adjusted using thumbscrews. A plunger mechanism can be used to secure the integrated circuit chip in forcible engagement with the chip carrier once the pins are aligned with the pads.

Abstract: A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip is lowered into the socket, and the chip carrier is inclined while it supports the frame block and chip until the chip moves under force of gravity to the reference corner. Once located at the reference corner, the chip position is carefully adjusted by moving the frame block in the x- and y-directions until the pins are aligned with the pads. The frame block is spring biased against movement in the x- and y-directions, and the position of the frame block is adjusted using thumbscrews. A plunger mechanism can be used to secure the integrated circuit chip in forcible engagement with the chip carrier once the pins are aligned with the pads.

Abstract: Additional circuitry is included in an input cell design structure for an integrated circuit to detect and report transitions on an input that was expected to be stable, and to store that event for later analysis. Two or more modified input cells may have their error indications daisy-chained together to minimize additional routing. The storage elements may be included in a scan chain to allow for isolation of which input had the unexpected transition.

Abstract: A computer system includes a processor, and the processor includes at least one interface for communicating with an electronic component. Each of the at least one interface has a set of interface settings. The computer system further includes a memory containing machine executable instructions. Execution of the instructions causes the processor to: monitor communications traffic on the at least one interface; store, eye distribution data acquired during the monitoring of the communications traffic in a database; compare the eye distribution data to a set of predetermined criteria; and generate a set of updated interface settings if the eye distribution does not satisfy the set of predetermined criteria.

Abstract: Configuring functional capabilities in a data processing system comprising entitlement data in a non-volatile storage. The position of the data processing system is determined. Based on said position, functional capabilities are changed based on position information comprised in the entitlement data. Changing functional capabilities consists of enabling functional capabilities, disabling functional capabilities, and both enabling and disabling functional capabilities.

Abstract: A portable tool, in particular a screwing tool, has a tool head for processing a workpiece, has a drive device for driving the tool head, and has a control device for controlling the drive device, at least one work parameter of the drive device being variable. The tool has a signal detecting device, at least temporarily connected to the control device for signaling purposes, for wireless reception of signals, these signals being characteristic of at least the at least one work parameter, and the control device being fashioned in such a way that it defines the at least one work parameter in reaction to a signal detected by the signal detecting device.

Abstract: An industrial and electrically driven tool includes two mutually independent radio modules so that a redundant communication link to a controller can be set up.

Abstract: The disclosure relates to a method for using a rechargeable battery-operated screwing system which is suitable for establishing screw connections by means of a motor-driven working spindle. The rechargeable battery-operated screwing system having communication devices for wirelessly transmitting data for defining screwing curves, which describe a screwing process, between a screwing spindle module and an evaluation module, with at least two variables which are characteristic of the screwing curve being wirelessly transmitted by means of the communication devices and at least one further variable which is relevant for the screwing curve being calculated from the transmitted data by the evaluation module.

Abstract: A method for wireless communication between at least two portable tools is disclosed. The tools each comprise a mechanism for wireless communication and also a data memory and a tool controller. The first tool is configured as a server and the second tool is configured as a client, wherein the second tool sets up a communication link to the first tool.

Abstract: A system for measuring a test voltage level (Vx) in a location within a chip is presented. The system includes an on-chip measurement device with an on-chip comparator and an on-chip storage. The on-chip comparator is configured for comparing the test voltage (Vx) to be measured to a reference voltage (Vref), while the on-chip storage is configured for storing the result of this comparison. The system also includes external (off-chip) equipment for generating the reference voltage (Vref), for generating probe signals for probing the state of the storage and for retrieving the state of said on-chip storage.

Abstract: A method for determining power consumption of a power domain within an integrated circuit is presented. In a first step, a local power supply impedance profile (Z(f)) of this power domain is determined. Subsequently, a local time-resolved power supply voltage (U(t)) is measured while a well-defined periodic activity is executed in power domain. A set of time-domain measured voltage data (U(t)) is thus accumulated and transformed into the frequency domain to yield a voltage spectrum (U(f)). A current spectrum I(t) is calculated from this voltage profile (U(f)) by using the power supply impedance profile Z(f) of this power domain as I(t)=Ff?1{U(f)/Z(f)}. Finally, a time-resolved power consumption spectrum P(t) is determined from measured voltage spectrum U(t)) and calculated current spectrum (I(t)). This power consumption (P(t)) may be compared with a reference (Pref(t)) to verify whether power consumption within power domain matches expectations.