Abstract: An intermediate printed board has a plurality of unit regions that are to be cut out and separated to become a plurality of individual printed circuit boards, respectively. The intermediate printed board includes a metal core substrate including: a metal layer; and a plating layer formed on each of a top surface and a bottom surface of the metal layer, the plating layer being absent in each of cutting regions, the cutting regions being regions on the intermediate printed board where the plurality of unit regions are separated so as to produce the plurality of individual printed circuit boards; an insulating layer formed so as to cover a surface of the metal core substrate; and a conductive pattern formed on the insulating layer.

Abstract: A circuit board includes a flexible wiring board having a first section in one end and a second section next to the first section in a plan view; a plate-shaped reinforcing member embedded in the flexible wiring board in the first section; and a first multilayer wiring layer on a top surface of the flexible wiring board in the first section, the first multilayer wiring layer having an opening that exposes a portion of a top surface of the reinforcing member for mounting a device thereon.

Abstract: An inverter control device that controls an inverter connected to a direct-current power supply and connected to an alternating-current rotating electrical machine to convert electric power between direct current and alternating current of a plurality of phases, the inverter control device including an electronic control unit that is configured to perform, in a state in which one switching element of a plurality of switching elements included in the inverter has a turn-off failure in which the switching element always goes into an off state, torque reduction control for reducing torque of the rotating electrical machine or deceleration control for outputting torque in a reverse direction from a rotation direction of the rotating electrical machine by performing switching control of the plurality of switching elements.

Abstract: A circuit board includes a core layer including a plurality of metal layers laminated one over another, a bottommost metal layer of the plurality of metal layers being thickest, and a topmost metal layer of the plurality of metal layer being thinnest; an upper insulating layer and an upper conductive pattern provided over a top surface of the core layer; and a lower insulating layer and a lower conductive pattern provided below a bottom surface of the core layer, wherein the topmost metal layer of the core metal layer is patterned to have a prescribed shaped section that serves as wiring and that is connected to the upper conductive pattern, wherein a metal ratio that is defined as a ratio of an area that is formed of metal relative to an entire area in a plan view is higher in the bottommost metal layer than in the topmost metal layer.

Abstract: A printed wiring board for camera module includes: first and second mounting regions for first and second image pickup devices respectively provided on one and the other sides in a front surface of the printed wiring board, the first and second mounting regions respectively provided with first and second conductive patterns configured to be electrically connected to the first and second image pickup devices, respectively, and a component mounting region provided between the first mounting region and the second mounting region, the component mounting region provided with a third conductive pattern, the third conductive pattern configured to be electrically connected to a signal processing component, amounting density of the third conductive pattern in the component mounting region being higher than that of the first conductive pattern in the first mounting region or a mounting density of the second conductive pattern in the second mounting region, in a plan view.

Abstract: A semiconductor module includes a metal core layer that includes: a first metal layer and a second metal layer on the first metal layer, wherein a portion of the second metal layer is removed to expose a surface of the first metal layer, the removed portion of the second metal layer defining a cavity in the metal core layer having the exposed surface of the first metal layer as a bottom surface, and at least one of a side wall and the bottom surface of the cavity has a smoother surface profile than a surface of the first metal layer that is not exposed by the cavity and under the second metal layer; and a semiconductor element provided in the cavity, affixed to the bottom surface of the cavity with a fixing material containing a resin component.

Abstract: A circuit board includes a flexible wiring board with a reinforcing member. The flexible wiring board has a first, second and third sections. The reinforcing member is embedded in a cavity in the first section of the wiring board, and is sandwiched by a pair of resin layers provided below and above. A pair of wiring layers are disposed on the pair of the resin layers, respectively. The metal reinforcing member has either a plate shape or a frame shape. The first section of the wiring board is positioned closer to one of the wiring layers than to another of the wiring layers in a vertical direction.

Abstract: A vehicle drive control device that controls a vehicle drive device in which a first engagement device, a rotating electrical machine, and a second engagement device are provided in this order from an input side in a mechanical power transmission path connecting an input to an output, the input being drive-coupled to an internal combustion engine serving as a vehicle drive power source, and the output being drive-coupled to wheels, wherein each of the first engagement device and the second engagement device can be changed between an engaged state in which drive power is transmitted and a disengaged state in which drive power is not transmitted, the vehicle control device including an electronic control unit

Abstract: Provided is a circuit board including: a metal core layer having a first main surface capable of supporting a mounting component and a second main surface which is opposite to the first main surface; a first exterior coating base material which is arranged facing the first main surface; and a second exterior coating base material which is arranged facing the second main surface and includes a heat dissipation layer having a via which is connected to the second main surface.

Abstract: A circuit board includes a flexible wiring board with a reinforcing member. The flexible wiring board has a first, second and third sections. The reinforcing member is embedded in a cavity in the first section of the wiring board, and is sandwiched by a pair of resin layers provided below and above. A pair of wiring layers are disposed on the pair of the resin layers, respectively. The metal reinforcing member has either a plate shape or a frame shape and is disposed closer to one of the pair of the wiring layers than to another of the pair of the wiring layers in a vertical direction.

Abstract: A circuit board includes a flexible wiring board having a first section in one end and a second section next to the first section in a plan view; a plate-shaped reinforcing member embedded in the flexible wiring board in the first section; and a first multilayer wiring layer on a top surface of the flexible wiring board in the first section, the first multilayer wiring layer having an opening that exposes a portion of a top surface of the reinforcing member for mounting a device thereon.

Abstract: A circuit board includes a flexible wiring board with a reinforcing member. The flexible wiring board has a first, second and third sections. The reinforcing member is embedded in a cavity in the first section of the wiring board, and is sandwiched by a pair of resin layers provided below and above. A pair of wiring layers are disposed on the pair of the resin layers, respectively. The metal reinforcing member has either a plate shape or a frame shape. The first section of the wiring board is positioned closer to one of the wiring layers than to another of the wiring layers in a vertical direction.

Abstract: A circuit board includes a flexible wiring board with a reinforcing member. The flexible wiring board has a first, second and third sections. The reinforcing member is embedded in a cavity in the first section of the wiring board, and is sandwiched by a pair of resin layers provided below and above. A pair of wiring layers are disposed on the pair of the resin layers, respectively. The metal reinforcing member has either a plate shape or a frame shape and is disposed closer to one of the pair of the wiring layers than to another of the pair of the wiring layers in a vertical direction.

Abstract: A semiconductor module includes a metal core layer that includes: a first metal layer and a second metal layer on the first metal layer, wherein a portion of the second metal layer is removed to expose a surface of the first metal layer, the removed portion of the second metal layer defining a cavity in the metal core layer having the exposed surface of the first metal layer as a bottom surface, and at least one of a side wall and the bottom surface of the cavity has a smoother surface profile than a surface of the first metal layer that is not exposed by the cavity and under the second metal layer; and a semiconductor element provided in the cavity, affixed to the bottom surface of the cavity with a fixing material containing a resin component.

Abstract: An intermediate printed board has a plurality of unit regions that are to be cut out and separated to become a plurality of individual printed circuit boards, respectively. The intermediate printed board includes a metal core substrate including: a metal layer; and a plating layer formed on each of a top surface and a bottom surface of the metal layer, the plating layer being absent in each of cutting regions, the cutting regions being regions on the intermediate printed board where the plurality of unit regions are separated so as to produce the plurality of individual printed circuit boards; an insulating layer formed so as to cover a surface of the metal core substrate; and a conductive pattern formed on the insulating layer.

Abstract: Provided is a module substrate including an inductor that can be made thinner and smaller. A module substrate according to an aspect of the present invention includes a substrate member having a mounting surface on which electronic components are mounted, a magnetic core disposed within the substrate member, and a conductor coil provided in the substrate member and wound around the magnetic core. The module substrate has a configuration in which an inductor is built into the substrate member, which makes it possible to make the overall module substrate smaller and thinner.

Abstract: A printed wiring board for camera module includes: first and second mounting regions for first and second image pickup devices respectively provided on one and the other sides in a front surface of the printed wiring board, the first and second mounting regions respectively provided with first and second conductive patterns configured to be electrically connected to the first and second image pickup devices, respectively, and a component mounting region provided between the first mounting region and the second mounting region, the component mounting region provided with a third conductive pattern, the third conductive pattern configured to be electrically connected to a signal processing component, amounting density of the third conductive pattern in the component mounting region being higher than that of the first conductive pattern in the first mounting region or a mounting density of the second conductive pattern in the second mounting region, in a plan view.

Abstract: A circuit substrate of one aspect of the present invention includes a first substrate body made of a flexible wiring substrate and having a first edge and a second edge opposite to the first edge, the first substrate body having a bottomed or bottomless recess adjacent to the first edge; a plate-shaped or frame-shaped reinforcement member disposed in the recess of the first substrate body adjacent to the first edge; a pair of resin layers sandwiching the reinforcement member in the recess and a portion of the first substrate body adjacent to the reinforcement member including the first edge, each of the resin layers having a circuit portion formed thereon electrically connected to the flexible wiring substrate.

Abstract: An embedded component substrate includes: a core layer; a first electrode provided on a top surface of the core layer with a first insulating layer therebetween; and a second electrode provided on a bottom surface of the core layer with a second insulating layer therebetween, wherein a cavity is formed in the embedded component substrate from a top surface thereof to expose the second insulating layer at a bottom of the cavity, wherein a placement region is defined on the bottom of the cavity, for accommodating an electronic component; and wherein the embedded component substrate further includes a pad electrode on a portion of the second insulating layer, exposed by the cavity, surrounding the placement region located on the bottom of the cavity, the pad electrode vertically protruding from a top surface of the exposed second insulating layer upwardly and being configured to electrically connect to the electronic component.

Abstract: A printed circuit board includes a metal core substrate, an insulating layer formed on a surface of the metal core substrate, and a wiring pattern formed on the insulating layer. The metal core substrate includes a first metal layer made of a first metal material, and a second metal layer made of a second metal material differing from the first metal material, the second metal layer being laminated on the first metal layer. The elastic modulus of the second metal layer is lower than the elastic modulus of the first metal layer, and the thermal conductivity of the second metal layer is greater than the thermal conductivity of the first metal layer.