Abstract: A sensor circuitry package for a replaceable print apparatus component including a plurality of sensing zones, each sensing zone including a number of sensing devices, each sensing device having a respective sensing function, and an array of memory elements, each memory element corresponding to a respective one of the sensing zones. During a sensing operation, the array of memory elements to serially load a segment of select bits, each select bit having one of a select value and a non-select value, a memory element having a select value to select a number of sensing devices of the respective sensing zone to be enabled to perform its respective sensing function.

Abstract: A circuit die may include an outermost circuit layer having electrical transmission routing and an alignment target overlying the outermost circuit layer.

Abstract: A logic circuitry package includes an interface to communicate with a print apparatus logic circuit and at least one logic circuit including at least one heater and a temperature sensor. The at least one logic circuit is configured to receive, via the interface, a heater command to address the at least one heater. The at least one logic circuit is configured to receive, via the interface, subsequent to the heater command, a sensor command corresponding to a sensor ID to address the temperature sensor. The at least one logic circuit is configured to transmit, via the interface, a digital value in response to the sensor command. The digital value corresponds to a print material level of a print material within a reservoir.

Abstract: Examples include a fluid ejection die embedded in a molded panel. The fluid ejection die comprises a substrate, and the substrate includes an army of nozzles extending therethrough. The substrate has a first surface in which nozzle orifices are formed and a second surface, opposite the first surface, in which nozzle inlet openings are formed. The fluid ejection die is embedded in the molded panel such that the first surface of the substrate is approximately planar with a top surface of the molded panel. The molded panel has a fluid channel formed therethrough in fluid communication with the nozzle inlet openings of the array of nozzles.

Abstract: An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and separated from the fluidic die. A conductive lead may provide an electrical coupling between a ground of the fluidic die and the conductive element.

Abstract: In some examples, a circuit package includes a packaging, and a circuit device in the packaging, where the packaging comprises a first EMC having a first coefficient of thermal expansion (CTE), and a second EMC having a second CTE higher than the first CTE. The second EMC is on the first EMC that has gelled over time.

Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.

Abstract: An integrated circuit to drive a number of fluid actuation devices, comprising a circuit configured to have a memory access state which can be set to one of an enabled state and disabled state. The integrated circuit to include a fluid actuation circuit to transmit selection information for a fluid actuation device, the selection information comprising a data state bit. The integrated circuit to include a memory cell array, configured so that each memory cell is accessible by the memory access state being enabled, and the data state bit being set.

Abstract: A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die, wherein the fluid feed holes are formed through a substrate of the die. A number of fluidic actuators are proximate to the fluid feed holes, to eject fluid received from the fluid feed holes A number of field-effect transistors are parallel to the fluid feed holes, where each of the fluidic actuators is powered by an associated field effect transistor. Logic circuitry to actuate the plurality of field-effect transistors is disposed on the die on an opposite side of the fluid feed holes from the field-effect transistors, wherein traces, disposed between the fluid feed holes, electrically couple the logic circuitry to the field-effect transistors. The die has a repeating structure comprising one fluid feed hole, two fluidic actuators, and two field-effect transistors placed at an interval of two times a dot pitch in a line along the die.

Abstract: A die for a printhead is provided in examples. The die includes a number of fluidic actuator arrays. A data block is associated with each of the plurality of fluidic actuator arrays. The die includes an interface comprising a data pad and a clock pad, wherein a data bit value present at the data pad is loaded into a first data block corresponding to a first fluidic actuator array on a rising clock edge and loaded into a second data block corresponding to a second fluidic actuator array on a falling clock edge.

Abstract: A logic circuitry package for a replaceable print apparatus component comprises an interface to communicate with a print apparatus logic circuit, and at least one logic circuit. The logic circuit may be configured to identify, from a command stream received from the print apparatus, parameters including a class parameter, and/or identify, from the command stream, a read request, and output, via the interface, a count value in response to a read request, the count value based on identified received parameters.

Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.

Abstract: A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die, wherein the fluid feed holes are formed through a substrate of the die. The die includes a number of fluidic actuators, proximate to the fluid feed holes, to eject fluid received from the fluid feed holes. Circuitry on the die operates the fluidic actuators, wherein traces are provided in layers between adjacent fluid feed holes, connecting circuitry on each side of the fluid feed holes.

Abstract: A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die, wherein the fluid feed holes are formed through a substrate of the die. A number of fluidic actuators are proximate to the fluid feed holes to eject fluid received from the plurality of fluid feed holes. The die includes logic circuitry to operate the fluidic actuators, wherein the logic circuitry is disposed on a first side of the plurality of fluid feed holes. Power circuitry to power the plurality of fluidic actuators is disposed on an opposite side of the fluid feed holes from the logic circuitry. Activation traces are disposed between each of the fluid feed holes to couple the logic circuitry to the power circuitry.

Abstract: In one example in accordance with the present disclosure, a fluidic ejection device is described. The device includes a fluidic ejection die embedded in a moldable material. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages. The device also includes the moldable material which includes supply slots to deliver fluid to and from the fluidic ejection die. A carrier substrate of the device supports the fluidic ejection die and moldable material.

Abstract: In one example in accordance with the present disclosure, a fluidic die assembly is described. The fluidic die assembly includes a rigid substrate having a bend therein. A fluidic die is disposed on the rigid substrate. The fluidic die is to eject fluid from a reservoir fluidly coupled to the fluidic die. The fluidic die includes an array of ejection subassemblies. Each ejection subassembly includes an ejection chamber to hold a volume of fluid, an opening, and a fluid actuator to eject a portion of the volume of fluid through the opening. The fluidic die assembly also includes an electrical interface disposed on the rigid substrate to establish an electrical connection between the fluidic die and a controller. The fluidic die and the electrical interface are disposed on a same surface on opposite sides of the bend.

Abstract: A fluid ejection device may include fluid actuators, ejection chambers adjacent the fluid actuators, nozzles extending from the ejection chambers, and fluid feed holes to supply fluid from a fluid supply passage to the ejection chambers. The fluid feed holes have ports connected to the ejection chambers. The ports are sized to pass bubbles formed by the fluid actuators out of the ejection chambers.

Abstract: Imaging medium includes an image-receiving substrate including a color-forming layer, a donor ribbon attached to the image-receiving substrate and including a color layer, and a repeated pattern. The repeated pattern is defined by a portion of each of the color-forming layer and color layer. A repeat of the pattern includes at least three adjacent colored stripes including a cyan or cyan-forming stripe, a magenta or magenta-forming stripe, and a yellow or yellow-forming stripe. A first of the at least three adjacent stripes is a color-forming stripe in the color-forming layer. A second of the at least three adjacent stripes is a colored stripe in the color layer. A third of the at least three adjacent stripes is either a second color-forming stripe in the color-forming layer or a second colored stripe in the color layer of the donor ribbon.

Abstract: A fluid ejection module may include a plurality of fluid ejection dies coupled to a thermoset material and singulated, and a thermoplastic material coupled to the singulated, fluid ejection dies. The thermoplastic material may be bent to form a curvature in the fluid ejection module.

Abstract: An integrated circuit to drive a plurality of fluid actuation devices includes a plurality of memory cells, a select circuit, configuration logic, and control logic. Each memory cell corresponds to a fluid actuation device. The select circuit selects fluid actuation devices and memory cells corresponding to the selected fluid actuation devices. The configuration logic enables or disables access to the plurality of memory cells. The control logic either activates the selected fluid actuation devices or accesses the memory cells corresponding to the selected fluid actuation devices based on a state of the configuration logic.