Patents by Inventor Michael W. Cumbie

Michael W. Cumbie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ink container
    Patent number: 11292263
    Abstract: Aspects relating to an ink container for an image reproduction device are described herein. The ink container includes a body and an electrical connection. The body is formed by molding a polymer material having a metal seed layer. The electrical connection is formed by metallizing a plurality of traces in the metal seed layer. The electrical connection extends from an inside wall of the ink container to an outer wall. A width of the electrical connection on the inside wall of the ink container gradually varies from a bottom of the ink container to a rim.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: April 5, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Boon Bing Ng, Michael W. Cumbie, Yee Kiat Ng
  • Fluid feed hole port dimensions
    Patent number: 11285731
    Abstract: A fluid ejection device may include fluid actuators, ejection chambers adjacent the fluid actuators, nozzles extending from the ejection chambers, and fluid feed holes to supply fluid from a fluid supply passage to the ejection chambers. The fluid feed holes have ports connected to the ejection chambers. The ports are sized to pass bubbles formed by the fluid actuators out of the ejection chambers.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: March 29, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Garrett E. Clark, Michael W. Cumbie
  • Microfluidic chip
    Patent number: 11278887
    Abstract: A microfluidic device is provided that includes a substrate and microfluidic sub-chips embedded in the substrate. An electric field is applied between an adjacent pair microfluidic sub-chips to move a fluid droplet from one of the adjacent pair of microfluidic sub-chips to another of the adjacent pair microfluidic sub-chips.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: March 22, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Viktor Shkolnikov, Michael W. Cumbie, Chien-Hua Chen
  • Chip to chip fluidic interconnect
    Patent number: 11278892
    Abstract: A device may include a substrate, a first fluid processing chip, a second fluid processing chip, a tapered channel, and a fluid actuator. The first fluid processing chip may be disposed on the substrate and may process a micro-volume of fluid. The second fluid processing chip may be disposed on the substrate and co-planar with the first fluid processing chip. The second fluid processing chip may process at least a portion of the micro-volume of fluid. The tapered channel may be disposed between the first and second fluid processing chips to transport the at least the portion of the micro-volume of fluid from the first fluid processing chip to the second fluid processing chip. The fluid actuator may be disposed proximate to the tapered channel and may control movement of the at least the portion of the micro-volume of fluid within the tapered channel.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: March 22, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Viktor Shkolnikov, Chien-Hua Chen
  • Fluidic dies with conductive members
    Patent number: 11279130
    Abstract: Examples include a fluidic device comprising a fluidic die, a support element, and a conductive member. The support element is coupled to the fluidic die, and the support element has a fluid channel formed therein. The fluid channel exposes at least a portion of a back surface of the fluidic die. The support element further includes a member opening passing therethrough. The conductive member is connected to the fluidic die, and the conductive member is a least partially disposed in the member opening such that a portion of the conductive member is exposed to the fluid channel of the support element.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: March 22, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W Cumbie, David J Benson, Randy Hoffman, Amy Gault
  • FLUID EJECTION DEVICE WITH BREAK(S) IN COVER LAYER
    Publication number: 20220072858
    Abstract: In various examples, a fluid ejection device may include a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors, and a cover layer adjacent the fluid ejection die. The cover may be formed with a second material that is different than the first material and may include a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors. In various examples, the first and second regions are separated by a break in the cover layer. The break may be filled with a third material that is different than one or both of the first and second material.
    Type: Application
    Filed: April 29, 2019
    Publication date: March 10, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Anthony M. Fuller, Chien-Hua Chen
  • Die for a printhead
    Patent number: 11267243
    Abstract: A die for a printhead is described herein. The die includes fluid feed holes disposed in a line parallel to a longitudinal axis of the die. The fluid feed holes are formed through a substrate of the die. Fluidic actuators are proximate to the fluid feed holes, to eject fluid received from the fluid feed holes. Field-effect transistors are parallel to the fluid feed holes. Each fluidic actuator is powered by an associated field effect transistor. Logic circuitry to actuate the field-effect transistors is disposed on an opposite side of the fluid feed holes from the field-effect transistors. Traces, disposed between the fluid feed holes, electrically couple the logic circuitry to the field-effect transistors. The die has a repeating structure including one fluid feed hole, two fluidic actuators, and two field-effect transistors placed at an interval of two times a dot pitch in a line along the die.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: March 8, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Michael Gardner, Anthony M. Fuller, Michael W. Cumbie
  • Nozzle arrangements and feed holes
    Patent number: 11247470
    Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes a first respective fluid feed hole fluidically coupled to each respective ejection chamber, and the array of fluid feed holes includes a second respective fluid feed hole fluidically coupled to each respective ejection chamber.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: February 15, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
  • CURVED FLUID EJECTION DEVICES
    Publication number: 20220032626
    Abstract: A curved fluid ejection device may include a plurality of fluid ejection dies overmolded with at least one layer of epoxy mold compound (EMC). Each of the fluid ejection dies and the EMC include a coefficient of thermal expansion (CTE). The combination of the CTE of the fluid ejection dies and the CTE of the at least one layer of EMC defines a curve within the curved fluid ejection device.
    Type: Application
    Filed: November 21, 2018
    Publication date: February 3, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Si-lam J. Choy
  • Fluid propelling apparatus including a heat sink
    Patent number: 11235574
    Abstract: A fluid propelling apparatus, including a plastic compound, a MEMS at least partially surrounded by the compound, and a heat sink next to the MEMS, to transfer heat away from the MEMS, wherein the heat sink is at least partly surrounded by the compound.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: February 1, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Garrett E. Clark, Michael W. Cumbie, Chien-Hua Chen
  • Coplanar microfluidic manipulation
    Patent number: 11235328
    Abstract: An apparatus includes a polymer base layer having a surface. A die that includes a fluid manipulation surface that is substantially coplanar with the surface of the polymer base layer. The die includes a control electrode to generate an electric field to perform microfluidic manipulation of fluid across the fluid manipulation surface of the die.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: February 1, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Viktor Shkolnikov, Chien-Hua Chen
  • Temperature-cycling microfluidic devices
    Patent number: 11235324
    Abstract: The present disclosure is drawn to temperature-cycling microfluidic devices. In one example, a temperature-cycling microfluidic device can include a driver chip having a top surface and a heat exchange substrate having a top surface coplanar with the top surface of the driver chip. A fluid chamber can be located on the top surface of the driver chip. A first and second microfluidic loop can have fluid driving ends and fluid outlet ends connected to the fluid chamber and can include portions thereof located on the top surface of the heat exchange substrate. A first and second fluid actuator can be on the driver chip. The first and second fluid actuators can be associated with the fluid driving ends of the first and second microfluidic loops, respectively, to circulate fluid through the first and second microfluidic loops.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: February 1, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Adam Higgins, Alexander Govyadinov, Michael W. Cumbie
  • Horizontal interface for fluid supply cartridge having digital fluid level sensor
    Patent number: 11230107
    Abstract: A horizontal interface for a fluid supply cartridge is to connect the fluid supply cartridge to a fluid-ejection device. The horizontal interface includes one or more fluidic interconnect septums to horizontally fluidically interconnect a supply of fluid of the fluid supply cartridge to the fluid-ejection device. The horizontal interface includes an electrical interface to horizontally conductively connect a digital fluid level sensor of the fluid supply cartridge to a corresponding electrical interface of the fluid-ejection device.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: January 25, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Anthony D. Studer, David C. Harvey, Michael W. Cumbie
  • Fluidic dies with inlet and outlet channels
    Patent number: 11225074
    Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber, an opening, and a fluid actuator disposed within the ejection chamber. Each nozzle also includes an inlet passage to deliver fluid into the ejection chamber and an outlet passage to deliver fluid out of the ejection chamber. The fluidic ejection die also includes an array of channels divided into inlet channels and outlet channels. Each inlet channel is fluidly connected to a respective plurality of inlet passages and each outlet channel is fluidly connected to a respective plurality of outlet passages.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: January 18, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Chien-Hua Chen
  • Two-step molding for a lead frame
    Patent number: 11227807
    Abstract: Examples for a two-step insert molding process to encapsulate a pre-molded lead frame (104, 304, 504, 704) are described herein. In some examples, a first circuit component (106, 306, 506) and a first portion of a trace array (110, 310, 510) of the pre-molded lead frame for an integrated circuit (1C) assembly are encapsulated by a first insert molding component (112, 312, 512a, 512b, 712). The trace array connects the first circuit component to a second circuit component (108, 308, 508) of the pre-molded lead frame. A second portion of the trace array is encapsulated by a second insert molding component (114, 314, 514, 714).
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: January 18, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Chien-Hua Chen
  • Thermal contact dies
    Patent number: 11225086
    Abstract: A thermal contact device may include a thermal contact die embedded in a moldable material. The thermal contact die may include a number of resistors integrated into the thermal contact die, and a number of heater drivers integrated into the thermal contact die and electronically coupled to the resistors. The moldable material is coplanar with a thermal contact side of the thermal contact device. Further, the moldable material includes at least one gradient edge along a medium feed path.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: January 18, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W Cumbie, Reynaldo V Villavelez, Chien-Hua Chen
  • Printheads
    Patent number: 11220107
    Abstract: The present disclosure includes a description of an example printhead having multiple ejection dies. The ejection dies are coupled to a temperature sensor and send temperature signals to a controller. The printhead can also include a heater coupled to the ejection dies to apply heat to at least one ejection die.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: January 11, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Garrett E Clark, Michael W. Cumbie, Mark H. MacKenzie
  • Fluid ejection die interlocked with molded body
    Patent number: 11214065
    Abstract: A fluid ejection device includes a fluid ejection die including a substrate and a fluid architecture supported by the substrate, and a molded body molded around the fluid ejection die, with the molded body interlocked with the fluid architecture of the fluid ejection die.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: January 4, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W Cumbie, Chien-Hua Chen
  • LIQUID LEVEL SENSOR PACKAGE FOR REPLACEABLE LIQUID RESERVOIR
    Publication number: 20210402786
    Abstract: A liquid level sensor package for a replaceable print liquid reservoir, the package including a number of heater circuits, each heater circuit including a heater element to dissipate heat and a number of control devices, each control device individually controllable to be electrically connected to the heater element, the heater element to dissipate a different amount of heat when electrically connected to different ones of the control devices.
    Type: Application
    Filed: October 25, 2019
    Publication date: December 30, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: James Michael GARDNER, Sirena LU, Frank D. DERRYBERRY, Michael W. CUMBIE
  • CIRCUIT DIE ALIGNMENT TARGET
    Publication number: 20210402782
    Abstract: A circuit die may include an outermost circuit layer having electrical transmission routing and an alignment target overlying the outermost circuit layer.
    Type: Application
    Filed: April 15, 2018
    Publication date: December 30, 2021
    Inventors: Anthony M. Fuller, Michael W. Cumbie, Chien-Hua Chen