Abstract: A write request directed to the non-volatile memory device is received. A stripe associated with an address specified by the write request is present in the volatile memory device is determined. The volatile memory device includes a plurality of stripes, each stripe of the plurality of stripes having a plurality of managed units. The write request on a managed unit of the stripe in the volatile memory device is performed. The stripe in the volatile memory device is evicted to a stripe in the non-volatile memory device.

Abstract: Semiconductor die assemblies with sidewall protection, and associated methods and systems are disclosed. In one embodiment, a semiconductor die assembly includes an interface die with a low-k dielectric layer and a stack of semiconductor dies attached to the interface die. The semiconductor die assembly also includes a molding structure that protects sidewalls of the interface die and sidewalls of the semiconductor dies. In some embodiments, the semiconductor die assembly includes a passivation layer attached to the interface die opposite to the stack of semiconductor dies. Further, the passivation layer may include a sidewall surface coplanar with an outer sidewall surface of the molding structure. The passivation layer may include a ledge underneath the molding structure, which is uncovered by the interface die. The semiconductor die assembly may include a NCF material at the sidewalls of the stack of semiconductor dies, where the molding structure surrounds the NCF material.

Abstract: A package structure including a substrate, a first semiconductor element disposed on and electrically connected with the substrate, a second semiconductor element disposed on and electrically connected with the substrate and a molding layer disposed over the substrate and covering at least a top surface of the substrate. The second semiconductor element and the first semiconductor element perform different functions. The molding layer encapsulates the second semiconductor element and wraps around sidewalls of the first semiconductor element. A top surface of the molding layer is higher than a top surface of the first semiconductor element. The molding layer has an opening extending from the top surface of the molding layer to the top surface of the first semiconductor element, so that the top surface of the first semiconductor element is exposed.

Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a redistribution structure, conductive joints, conductive terminals, a circuit substrate, and an insulating encapsulation. The redistribution structure includes a first side and a second side opposite to the first side, wherein trenches are located on the second side of the redistribution structure and extend to an edge of the second side of the redistribution structure. The conductive joints are disposed over the first side of the redistribution structure. The conductive terminals are disposed over the second side of the redistribution structure. The circuit substrate electrically coupled to the redistribution structure through the conductive joints. The insulating encapsulation is disposed on the first side of the redistribution structure to cover the circuit substrate.

Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes a redistribution circuit structure; a first semiconductor chip disposed on the redistribution structure and having a first active surface on which a first conductive post is disposed; a second semiconductor chip disposed above the first semiconductor chip and having a second active surface on which a first conductor is disposed; and a first encapsulant disposed on the redistribution circuit structure and encapsulating at least the first semiconductor chip, wherein the first conductive post and the first conductor are aligned and bonded to each other to electrically connect the first semiconductor chip and the second semiconductor chip.

Abstract: An electronic device is provided. The electronic device includes a housing, a fastened object, a fastener, and a base member. The housing includes a housing body and a bracket. The bracket is integrally formed on the housing body. The bracket includes a bracket stage, a bracket hole and a bracket recess. The bracket hole is formed on the bracket stage. The fastened object corresponds to the bracket stage. At least a portion of the base member is moveably inserted into the bracket recess. The base member includes a member fastening hole. The fastener passes through the fastened object and the bracket hole to connect to the member fastening hole of the base member.

Abstract: A placement method for integrated circuit design is provided. Each net is considered as a soft module. The net will receive a larger penalty if it covers more routing congested regions. Therefore, it is easier to move the nets away from routing congested regions. In addition, to relieve local congestion, a novel inflation method is proposed to expand the area of a cluster according to its internal connectivity intensity and routing congestion occupied by the cluster. Accordingly, it can get better routability and wirelength.

Abstract: Aspects of the present disclosure involve a system comprising a computer-readable storage medium storing a program and method for assigning participants to rooms within a virtual conferencing system. The program and method provide for accessing, in association with a virtual space comprising plural rooms for virtual conferencing between plural participants, room occupancy preferences for occupying the plural rooms; accessing metadata associated with one or more participants of the plural participants; assigning, based on the room occupancy preferences and the metadata, the plural participants to one or more rooms of the plural rooms; and providing, based on the assigning, for virtual conferencing between the plural participants within the one or more rooms.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: An image sensor package and a manufacturing method thereof are provided. The image sensor package includes a redistribution circuit structure; an image sensing chip disposed on the redistribution circuit structure and having a sensing surface, on which a sensing area and a first conductive pillar arranged in the periphery of the sensing area are disposed; a lid covering the sensing area; an encapsulant disposed on the redistribution circuit structure and encapsulating at least part of the image sensing chip and the cover; and a top tier semiconductor chip disposed above the image sensing chip and having an active surface on which a first conductor is disposed. The first conductor overlaps the image sensing chip in a direction perpendicular to the sensing surface. The first conductive pillar and the first conductor are aligned and bonded to each other to electrically connect the image sensing chip and the top tier semiconductor chip.

Abstract: A container energy storage system is provided in this disclosure. The system includes a container and a plurality of functional assemblies. The container includes a container frame and a bottom plate. The container frame is formed a plurality of openings and a hollow main body. The bottom plate is disposed at the bottom of the container frame and is fixedly connected to the container frame. The functional assemblies are disposed in the hollow main body and located above the bottom plate.

Abstract: An ion implantation system includes an ion implanter containing an ion source unit and a dopant source gas supply system. The system includes a dopant source gas storage tank inside a gas box container located remotely to the ion implanter and a dopant source gas supply pipe configured to supply a dopant source gas from the dopant source gas storage tank to the ion source unit. The dopant source gas supply pipe includes an inner pipe, an outer pipe enclosing the inner pipe, a first pipe adaptor coupled to first end of respective inner and outer pipes, and a second pipe adaptor coupled to seconds end of respective inner and outer pipes opposite the first end. The first pipe adaptor connects the inner pipe to the dopant source gas storage tank and the second pipe adaptor connects the inner pipe to the ion source unit.

Abstract: Disclosed herein is a water-dispersible dry powder formulation that includes, based on the total weight of the water-dispersible dry powder formulation, 0.2 wt % to 4.0 wt % of glucagon, 10 wt % to 95.0 wt % of lactose, 0.001 wt % to 5.0 wt % of acetone, and 0.1 wt % to 10.0 wt % of water. The water-dispersible dry powder formulation has a pH value ranging from 2.0 to 6.0. A method for producing the water-dispersible dry powder formulation is also disclosed.

Abstract: A vapor/liquid condensation system includes a condensation unit and an evaporation unit. The condensation unit is connected with the evaporation unit via conduits. The evaporation unit has a liquid inlet, a vapor outlet and an evaporation chamber in communication with each other. The evaporation unit converts liquid-phase working fluid into vapor-phase working fluid, which spreads to the condensation unit. The condensation unit cools and condenses the vapor-phase working fluid into liquid-phase working fluid, which goes back the evaporation unit. After the vapor-phase working fluid enters the condensation unit, the vapor-phase working fluid is distributed and condensed into liquid-phase working fluid. Then the liquid-phase working fluid is collected and then goes back to the evaporation unit. The length of the pipeline is shortened and the pipeline pressure is lowered to avoid interruption of heat dissipation circulation and failure in heat dissipation.

Abstract: Techniques for generating an indication of ambient light intensity are provided. The techniques include obtaining a set of one or more low light level measurements during a low light level display panel period of a display; obtaining a set of one or more high light level measurements during a high light level display panel period of the display; generating an ambient light level result based on analysis of the set of one or more low light level measurements, the set of one or more high light level measurements, and calibration information; and controlling brightness of the display based on the ambient light level result.

Abstract: A package structure includes a redistribution structure and a core substrate. The redistribution structure includes a plurality of connection pads. The core substrate is disposed on the redistribution structure and electrically connected to the plurality of connection pads. The core substrate includes a first interconnection layer and a plurality of conductive terminals. The first interconnection layer has a first region, a second region surrounding the first region, and a third region surrounding the second region, and includes a plurality of bonding pads located in the first region, the second region and the third region. The conductive terminals are electrically connecting the plurality of bonding pads to the plurality of connection pads of the redistribution structure, wherein the plurality of conductive terminals located over the first region, the second region and the third region of the first interconnection layer have different heights.

Abstract: A chip scale package structure is provided. The chip scale package structure includes an image sensor chip and a chip. The image sensor chip includes a first redistribution layer including a conductive wire and a conductive pad formed on the conductive wire, wherein the conductive pad is exposed from the surface of the first redistribution layer. The chip includes a plurality of through silicon via (TSV) and a second redistribution layer including a conductive wire and a conductive pad formed on the conductive wire, wherein the conductive pad is exposed from the surface of the second redistribution layer. The area of the chip is smaller than that of the image sensor chip. The second redistribution layer of the chip bonds to the first redistribution layer of the image sensor chip.

Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a redistribution structure, conductive joints, conductive terminals, a circuit substrate, and an insulating encapsulation. The redistribution structure includes a first side and a second side opposite to the first side, wherein trenches are located on the second side of the redistribution structure and extend to an edge of the second side of the redistribution structure. The conductive joints are disposed over the first side of the redistribution structure. The conductive terminals are disposed over the second side of the redistribution structure. The circuit substrate electrically coupled to the redistribution structure through the conductive joints. The insulating encapsulation is disposed on the first side of the redistribution structure to cover the circuit substrate.

Abstract: Aspects of the present disclosure involve a system comprising a computer-readable storage medium storing a program and method for presenting participant reactions to a virtual conference. The program and method provide for a virtual conference between plural participants; provide, for each of the plural participants, display of a reaction button which is selectable by the participant to indicate a reaction to the virtual conference; receive indication of selections of the reaction button by one or more of the plural participants; and in response to receiving the indication, provide, for each of the plural participants, display of reaction icons and audio output based on the selections, determine that a rate at which the selections were received meets a threshold rate, and provide, in response to the determining, for modified audio output associated with the selections.

Abstract: The present invention discloses a device and method for measuring a horizontal/vertical permeability of a hydrate reservoir. The device includes a cooling water/saturated methane water tank, a water injection pump, a methane gas tank, a booster pump, an air compressor, a high-pressure gas tank, a back pressure valve, a gas tank, a data acquisition instrument, a constant-temperature water bath and a hydrate reservoir horizontal/vertical permeability measuring apparatus provided in the constant-temperature water bath, where the cooling water/saturated methane water tank is provided with a water circulation inlet and an intake line at an upper part and a water circulation outlet at the bottom; the intake line is provided thereon with an intake control gate valve; the bottom of the cooling water/saturated methane water tank is in communication with the water injection pump.