Patents by Inventor Ming-Che Hsieh

Ming-Che Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210208314
    Abstract: Embodiments of the present disclosure relate to a transparent substrate, a method for preparing the same, and an OLED display device. A transparent substrate includes a first transparent film, and a second transparent film arranged on the first transparent film. An interface between the first transparent film and the second transparent film is provided with a light scattering structure.
    Type: Application
    Filed: January 8, 2018
    Publication date: July 8, 2021
    Inventors: Yuanzheng GUO, Ping SONG, Weinan DAI, Ming Che HSIEH, Shiming SHI
  • Patent number: 11024230
    Abstract: A display screen, a display device, a display circuit used for the display screen and a brightness compensation method therefor. The display screen (10) includes a normal display area (11) and a transparent display area (12). The display circuit (20) includes: a first pixel circuit (21), wherein the first pixel circuit is arranged at the normal display area; and a second pixel circuit (22), wherein the second pixel circuit is arranged at the transparent display area. The structure of the first pixel circuit is different from that of the second pixel circuit, so that the light transmittance of the transparent display area is higher than the light transmittance of the normal display area.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: June 1, 2021
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Libin Liu, Yu Feng, Ming Che Hsieh
  • Patent number: 10882221
    Abstract: This disclosure relates to a peeling method of a flexible substrate, and belongs to the technical field of flexible display. The method comprises the steps of: (a) forming a flexible substrate on a base substrate, wherein the flexible substrate has a plane area less than that of the base substrate; (b) adhering a protective film on the base substrate formed with the flexible substrate by an ultraviolet viscosity-reducing adhesive, wherein the plane area of the flexible substrate is less than that of the protective film, and the protective film is further adhered to the base substrate by the ultraviolet viscosity-reducing adhesive; (c) irradiating a region on the base substrate covered by the protective film through the base substrate with an ultraviolet light; and (d) peeling the protective film and the flexible substrate from the base substrate after the irradiation with an ultraviolet light is completed.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: January 5, 2021
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Ming Che Hsieh, Chunyan Xie, Lu Liu, Hejin Wang, Yuanzheng Guo
  • Publication number: 20200212324
    Abstract: Embodiments of the present disclosure provide a flexible display substrate, a manufacturing method thereof and a flexible display device. The manufacturing method includes: forming a plurality of protrusions on a base substrate; forming a base film at one side of the plurality of protrusions facing away from the base substrate; forming a display structure at a surface of the base film facing away from the base substrate; peeling off the base film along with the display structure from the base substrate, and remaining the plurality of protrusions on the base substrate; and attaching the surface of the base film facing away from the display structure onto an elastic substrate and stretching the elastic substrate so that the base film is fractured at positions of the plurality of concaves.
    Type: Application
    Filed: April 18, 2019
    Publication date: July 2, 2020
    Inventors: Yuanzheng GUO, Pinfan WANG, Ming Che HSIEH
  • Publication number: 20200184856
    Abstract: A display substrate and a manufacturing method therefor, and a display device. The display substrate includes a flexible protective layer and sub-pixel structures. The flexible protective layer includes bosses, the sub-pixel structure is provided on a top surface of the boss, the boss further includes multiple side surfaces intersecting with the top surface, and the display substrate further includes secondary sub-pixel structures provided on at least one of the multiple side surfaces.
    Type: Application
    Filed: May 5, 2019
    Publication date: June 11, 2020
    Inventors: Hejin WANG, Ming Che HSIEH, Shanchen KAO
  • Publication number: 20200161384
    Abstract: A substrate and a display device. The substrate includes: a hole region including a plurality of holes penetrating the substrate; and a non-hole region including a plurality of connection portions and a plurality of pixel regions separated from each other. Each connection portion is between adjacent pixel regions to connect the adjacent pixel regions, wherein a straight line in any direction parallel to the substrate passes through the hole region.
    Type: Application
    Filed: June 20, 2019
    Publication date: May 21, 2020
    Applicant: BOE Technology Group Co., Ltd.
    Inventors: Pinfan Wang, Ming Che Hsieh
  • Publication number: 20200098318
    Abstract: A display screen, a display device, a display circuit used for the display screen and a brightness compensation method therefor. The display screen (10) includes a normal display area (11) and a transparent display area (12). The display circuit (20) includes: a first pixel circuit (21), wherein the first pixel circuit is arranged at the normal display area; and a second pixel circuit (22), wherein the second pixel circuit is arranged at the transparent display area. The structure of the first pixel circuit is different from that of the second pixel circuit, so that the light transmittance of the transparent display area is higher than the light transmittance of the normal display area.
    Type: Application
    Filed: December 4, 2018
    Publication date: March 26, 2020
    Inventors: Libin LIU, Yu FENG, Ming Che HSIEH
  • Patent number: 10593898
    Abstract: A base carrier configured to carry a flexible base of a flexible display panel is provided. The flexible display panel includes a display region and a circuit bonding region. A surface of an area of the base carrier corresponding to the display region is smooth, and a surface of an area of the base carrier corresponding to the circuit bonding region is formed with a plurality of micro-grooves. The structure of the base carrier is such that when the flexible base is separated from the base carrier, the amount of laser required for peeling in each of the display region and the circuit bonding region are the same and such that the base carrier can be separated from the flexible display panel by performing the laser scanning once, which simplifies the processes.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: March 17, 2020
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Chunyan Xie, Ming Che Hsieh
  • Patent number: 10319924
    Abstract: A method for manufacturing a flexible substrate, a flexible substrate manufactured using the method and a display device including the flexible substrate are disclosed. The method includes steps of: coating a glass carrier with a plurality of film layers, wherein each of at least one pair of adjacent film layers of the plurality of film layers is formed through steps of: S1: coating the glass carrier with a first film layer; and S2: coating the glass carrier with a second film layer over the first film layer so that the second film layer covers the first film layer, wherein the second film layer has an area greater than an area of the first film layer; and peeling off the plurality of formed film layers from the glass carrier to form a flexible substrate.
    Type: Grant
    Filed: June 6, 2016
    Date of Patent: June 11, 2019
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Ming-Che Hsieh, Lu Liu, Chunyan Xie, Hejin Wang
  • Patent number: 10249527
    Abstract: Methods for manufacturing a flexible display device are provided. A flexible substrate is provided and a first bonding pattern, which encloses a display area, is formed on the flexible substrate. A second bonding pattern is formed on a rigid substrate. The first and second bonding patterns are bonded together to provide a bonding pattern between the flexible substrate and the rigid substrate. At least one display device is formed on the display area of the flexible substrate. The bonding pattern is removed by a cutting process performed so as to separate the flexible substrate having the display device thereon from the rigid substrate.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: April 2, 2019
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Lu Liu, Ming Che Hsieh
  • Publication number: 20180290344
    Abstract: This disclosure relates to a peeling method of a flexible substrate, and belongs to the technical field of flexible display. The method comprises the steps of: (a) forming a flexible substrate on a base substrate, wherein the flexible substrate has a plane area less than that of the base substrate; (b) adhering a protective film on the base substrate formed with the flexible substrate by an ultraviolet viscosity-reducing adhesive, wherein the plane area of the flexible substrate is less than that of the protective film, and the protective film is further adhered to the base substrate by the ultraviolet viscosity-reducing adhesive; (c) irradiating a region on the base substrate covered by the protective film through the base substrate with an ultraviolet light; and (d) peeling the protective film and the flexible substrate from the base substrate after the irradiation with an ultraviolet light is completed.
    Type: Application
    Filed: April 10, 2017
    Publication date: October 11, 2018
    Inventors: Ming Che HSIEH, Chunyan XIE, Lu LIU, Hejin WANG, Yuanzheng GUO
  • Patent number: 10046548
    Abstract: A method for fabricating a flexible device is provided. The method includes forming a sacrificial layer on a substrate; and forming a reflective layer to reflect a laser for subsequently de-bonding the sacrificial layer from the rigid substrate back to the sacrificial layer to reduce required de-bonding energy of the laser over at least a portion of the rigid substrate. Further, the method includes forming a flexible device over the reflective layer; and separating the substrate from the sacrificial layer by irradiating the sacrificial layer using the laser.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: August 14, 2018
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Lu Liu, Ming Che Hsieh
  • Publication number: 20180108850
    Abstract: A method for manufacturing a flexible substrate, a flexible substrate manufactured using the method and a display device including the flexible substrate are disclosed. The method includes steps of: coating a glass carrier with a plurality of film layers, wherein each of at least one pair of adjacent film layers of the plurality of film layers is formed through steps of: S1: coating the glass carrier with a first film layer; and S2: coating the glass carrier with a second film layer over the first film layer so that the second film layer covers the first film layer, wherein the second film layer has an area greater than an area of the first film layer; and peeling off the plurality of formed film layers from the glass carrier to form a flexible substrate.
    Type: Application
    Filed: June 6, 2016
    Publication date: April 19, 2018
    Applicant: Boe Technology Group Co., Ltd.
    Inventors: Ming-Che Hsieh, Lu Liu, Chunyan Xie, Hejin Wang
  • Publication number: 20180053031
    Abstract: An optical fingerprint sensor package includes a carrier, at least one image sensor, at least one LED and at least one non light-transmitting compound. The carrier is provided with pads thereon. The image sensor is mounted on the carrier and electrically connected with the pads. The LED flip-chip is mounted on the carrier through first solder bumps and mounted at an outer side of the image sensor. The non light-transmitting compound surrounds a sidewall of the LED to expose a top surface of the LED.
    Type: Application
    Filed: April 7, 2017
    Publication date: February 22, 2018
    Inventors: Ruey-Jiann LIN, Ming-Che HSIEH
  • Patent number: 9859525
    Abstract: Disclosed is a flexible display substrate and a method for manufacturing the same which can avoid break and peeling of film layers disposed on a flexible base and further reduce degree of a warpage occurred in the flexible base when separating the support substrate from the flexible base located above the support substrate. The flexible display substrate comprises the flexible base, a first buffer layer and a second buffer layer disposed on an upper surface and a lower surface of the flexible base, respectively, a plurality of display modules disposed on the first buffer layer, each display module includes at least one thin film transistor and at least one electrode corresponding to the thin film transistor, and a plurality of auxiliary thin film transistors disposed on one side of the second buffer layer which is away from the flexible base, the auxiliary thin film transistors corresponding to the thin film transistors one by one, respectively.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: January 2, 2018
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Ming-Che Hsieh, Chunyan Xie, Lu Liu
  • Publication number: 20170317301
    Abstract: A base carrier configured to carry a flexible base of a flexible display panel is provided. The flexible display panel includes a display region and a circuit bonding region. A surface of an area of the base carrier corresponding to the display region is smooth, and a surface of an area of the base carrier corresponding to the circuit bonding region is formed with a plurality of micro-grooves. The structure of the base carrier is such that when the flexible base is separated from the base carrier, the amount of laser required for peeling in each of the display region and the circuit bonding region are the same and such that the base carrier can be separated from the flexible display panel by performing the laser scanning once, which simplifies the processes.
    Type: Application
    Filed: March 1, 2016
    Publication date: November 2, 2017
    Inventors: Chunyan XIE, Ming Che HSIEH
  • Publication number: 20170271625
    Abstract: The present disclosure provides a method for fabricating a display substrate for a display panel. The method includes providing a flexible organic light-emitting diode (flexible OLED) substrate with a thin-film transistor (TFT) layer on the flexible OLED substrate and a patterned adhesive layer on the TFT layer, wherein the TFT layer includes at least one testing area; providing a barrier film (BF) with a patterned laser barrier layer on a surface of the BF, the surface of the BF facing the TFT layer; and bonding the BF onto the flexible OLED substrate such that at least a portion of the patterned laser barrier corresponds to the at least one testing area. The method also includes irradiating a laser beam along a cutting line on the BF to remove a first portion of the BF.
    Type: Application
    Filed: September 28, 2015
    Publication date: September 21, 2017
    Applicant: Boe Technology Group Co., Ltd.
    Inventors: LU LIU, MING CHE HSIEH, BAOMING CAI
  • Publication number: 20170263488
    Abstract: Methods for manufacturing a flexible display device are provided. A flexible substrate is provided and a first bonding pattern, which encloses a display area, is formed on the flexible substrate. A second bonding pattern is formed on a rigid substrate. The first and second bonding patterns are bonded together to provide a bonding pattern between the flexible substrate and the rigid substrate. At least one display device is formed on the display area of the flexible substrate. The bonding pattern is removed by a cutting process performed so as to separate the flexible substrate having the display device thereon from the rigid substrate.
    Type: Application
    Filed: September 18, 2015
    Publication date: September 14, 2017
    Inventors: Lu LIU, Ming Che HSIEH
  • Publication number: 20170236802
    Abstract: A semiconductor device has a semiconductor wafer and a first conductive layer formed over the semiconductor wafer as contact pads. A first insulating layer formed over the first conductive layer. A second conductive layer including an interconnect site is formed over the first conductive layer and first insulating layer. The second conductive layer is formed as a redistribution layer. A second insulating layer is formed over the second conductive layer. An opening is formed in the second insulating layer over the interconnect site. The opening extends to the first insulating layer in an area adjacent to the interconnect site. Alternatively, the opening extends partially through the second insulating layer in an area adjacent to the interconnect site. An interconnect structure is formed within the opening over the interconnect site and over a side surface of the second conductive layer. The semiconductor wafer is singulated into individual semiconductor die.
    Type: Application
    Filed: April 28, 2017
    Publication date: August 17, 2017
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: Ming-Che Hsieh, Chien Chen Lee, Baw-Ching Perng
  • Publication number: 20170212675
    Abstract: Provided is a simplified input device, having a display module connected with a processing module. When the processing module receives a confirming command produced by an input module, the processing module loads a selected symbol. When the selected symbol is a typographical symbol, the processing module displays the selected symbol on a position of an input cursor. When the selected symbol is an input cursor moving symbol, the processing module moves the position of the input cursor corresponding to the selected symbol. Therefore, a user types letters, and moves the input cursor to a position of a wrong letter to input another letter for quickly correcting the wrong letter. Further, a connecting module receives typographical symbol setting data to update the language of the typographical symbols. The language is not limited by a manufacturer of the simplified input device and enhanced convenience in use is provided.
    Type: Application
    Filed: January 26, 2016
    Publication date: July 27, 2017
    Inventors: Ming-Che Hsieh, Sheng-Yi Tang, Yuan-Chen Hsiao